µModule LGA Level 2 Interconnect Reliability Data CONTENTS May 2013 Demo Board Details………………………………………….…...…….2 Demo Board Reliability Results.…………………………...………….3, 4 Rider Card Details………………………………………….….….…….5 Rider Card Reliability Results.…………………………...………...….6 Daisy Chain Board Details……………………………………….…....7 Daisy Chain Board Reliability Results…..……………………………8-11 LTC Demo Board Details PCB Material # Metal Layers Board Size Thickness Pad Type Pad Finish Pad Size Soldermask opening Soldermask thickness Method for Detecting Interconnect Failure FR-4 2 4 3/4" x 3" 62 mils or 93 mils (see details) NSMD NiAu 0.635mm 0.686mm 0.02 - 0.03mm Bench set-up, Functional test Page 2 DEMO BOARD MOUNT TEMP CYCLE DATA FOR THE LTM46XX FAMILY (15mmX15mm) DEVICE CYCLES CYCLES ON TC ON TC -40°C -40°C DATE DEVICE PKG BOARD SAMPLE BENCH TO TO SOLDER CODE TYPE TYPE THICKNESS SIZE REJECTS +125°C +125°C PASTE 0513 0525 0546 0623 0738 0846 LTM4600 LTM4600 LTM4600 LTM4601 LTM4616 LTM4617 6 LOTS DATE DEVICE CODE TYPE 0715 0632 LTM4600 LTM4601 2 LOTS DATE DEVICE CODE TYPE 0624 0624 LTM4600 LTM4600 2 LOTS LGA-104 LGA-104 LGA-104 LGA-118 LGA-144 LGA-144 PKG TYPE LGA-104 LGA-118 PKG TYPE LGA-104 LGA-104 62 mils 62 mils 62 mils 62 mils 62 mils 62 mils 99 96 93 88 96 77 0 0 0 0 0 0 549 0 2,000 2,000 2,000 2,000 2,000 1,500 198,000 192,000 186,000 176,000 192,000 115,500 SnPb SnPb SnAgCu SnAgCu SnAgCu SnAgCu 1,059,500 * 10 °C per minute ramp rate * 10 minute dwell time DEVICE CYCLES CYCLES ON TC ON TC BOARD SAMPLE BENCH 0°C TO 0°C TO SOLDER THICKNESS SIZE REJECTS +100°C +100°C PASTE 62 mils 62 mils 40 44 0 0 84 0 5,000 3,500 200,000 154,000 SnAgCu SnPb 354,000 * 10 °C per minute ramp rate * 10 minute dwell time DEVICE CYCLES CYCLES ON TC ON TC -55°C -55°C BOARD SAMPLE BENCH TO TO SOLDER THICKNESS SIZE REJECTS +125°C +125°C PASTE 62 mils 62 mils 65 76 0 0 141 0 1,500 1,500 97,500 114,000 211,500 * 10 °C per minute ramp rate * 10 minute dwell time Page 3 SnPb SnPb DEMO BOARD MOUNT TEMP CYCLE DATA FOR THE LTM46XX FAMILY (15mmX9mm) DEVICE CYCLES CYCLES ON TC ON TC -40°C -40°C TO TO SOLDER DATE DEVICE PKG BOARD SAMPLE ATE CODE TYPE TYPE THICKNESS SIZE REJECTS +125°C +125°C PASTE 0714 0714 0728 0729 LTM4604 LTM4604 LTM4608 LTM4608 4 LOTS LGA-66 LGA-66 LGA-68 LGA-68 62 mils 62 mils 93 mils 93 mils 79 79 116 116 0 0 0 0 390 0 2,000 2,000 1,000 1,000 158,000 158,000 116,000 116,000 SnPb SnAgCu SnPb SnAgCu 548,000 * 10 °C per minute ramp rate * 10 minute dwell time Page 4 Rider Card PCB Details PCB Material # Metal Layers Board Size Thickness Pad Type Pad Finish Pad Size Soldermask opening Soldermask thickness Method for Detecting Interconnect Failure FR-4 or Polyimide 4 1 1/2" x 1 1/4" 93 mils NSMD NiAu 0.635mm 0.686mm 0.02 - 0.03mm ATE, Functional test Page 5 RIDER CARD MOUNT TEMP CYCLE DATA FOR THE LTM80XX FAMILY DATE DEVICE CODE TYPE 0723 0723 LTM8023 LTM8023 2 LOTS PKG TYPE LGA-50 LGA-50 BOARD SAMPLE THICKNESS SIZE 93 mils 93 mils 114 107 0 221 ATE REJECTS CYCLES ON TC -40°C TO +125°C 0 0 2,000 2,000 DEVICE CYCLES ON TC -40°C TO SOLDER +125°C PASTE 228,000 214,000 0 442,000 * 10 °C per minute ramp rate * 10 minute dwell time Page 6 SnPb SnAgCu Daisy-Chain PCB Details Material # Metal Layers Board Size Thickness Pad Type Pad Finish Pad Size Soldermask opening Soldermask thickness FR-4 6 6 1/4" x 6 1/4" 93 mils SMD NiAu 0.730mm x 0.730mm 0.630mm x 0.630mm 0.035mm ± 0.010mm Daisy-Chain Test Details Tests Conform to Ramp Rate Dwell Time IPC-9701A 10°C / minute 10 minutes Method for Detecting Interconnect Failure Daisy Chain with Real-Time Resistivity Monitor Page 7 DAISY CHAIN TEMP CYCLE DATA DATE CODE DEVICE TYPE PKG TYPE SAMPLE SIZE CONTINUITY REJECTS CYCLES ON TC 0°C TO +100°C 0640 0640 0748 0748 0847 0911 0927 1007 1027 1224 LTM4600 LTM4600 LTM4601A LTM4601A LTM2880 LTM9004 LTM4617 LTM2885 LTM4620 LTM4676 LGA-104 LGA-104 LGA-133 LGA-133 LGA-68 LGA-204 LGA-133 LGA-32 LGA-144 LGA-144 30 30 40 40 80 40 40 40 40 40 21 0 5 0 0 0 0 2 0 0 3,500 4,000 6,000 3,500 3,500 6,000 6,000 6,000 6,000 6,000 10 LOTS 420 28 DEVICE CYCLES ON TC 0°C TO +100°C SOLDER PASTE 105,000 120,000 240,000 140,000 280,000 240,000 240,000 240,000 240,000 240,000 PbSn SnAgCu PbSn SnAgCu SnAgCu SnAgCu SnAgCu SnAgCu SnAgCu SnAgCu 2,085,000 LTM46xx μModule Footprint Comparisons Page 8 LTM4600 Daisy Chain Failure Analysis 99% 4826 cycles. 1%, 1380 cycles Weibull plot for LTM4600 daisy chain Pb board mounted units after 0/100C 3500 cycles test. No failures found from PbF solder paste (up to 4000 T/C) Solder Fatigue and Edge Crack found at Corner Pin after 3500 cycles (Pb solder paste). Page 9 LTM4601A Daisy Chain Failure Analysis 1%, 1780 cycles Weibull plot above for LTM4601A Daisy Chain Pb board mounted units after 0/+100°C, 6000 cycles test. No failures found from PbF solder paste up to 3500 cycles. Cross-section above shows good solder joint integrity. Page 10 LTM2885 Daisy Chain Failure Analysis 1%, 3470 cycles PCB side LGA Package side Dye and pry after 6000 cycles shows A1 corner pin saturated. This DUT failed at 3773 cycles. Presence of dye indicates a solder joint failure at the A1 pin location. Page 11