RT9137/8/9

RT9137/8/9
Rail-to-Rail Operational Amplifier
General Description
Features
The RT9137/RT9138/RT9139 consist low power, high slew
rates, rail-to-rail input and output operation amplifiers.

Rail-to-Rail Output Swing

Supply Voltage : 4.5V to 16.5V
Continuous Output Current : 35mA
Peak Output Current : 300mA
High Slew Rate : 120V/μ
μs
RoHS Compliant and Halogen Free
The RT9137 contains a single amplifier, RT9138 contains
two amplifiers and RT9139 contains four amplifiers in one
package.




The RT9137/RT9138/RT9139 have high slew rates
(120V/μs), 35mA continuous output current, 300mA peak
output current and offset voltage below 16.5mV.
The RT9137 is available in TSOT-23-5 and WDFN-6L 2x2
packages. The RT9138 is available in MSOP-8 and
WDFN-6L 2x2 packages. The RT9139 is available in
WQFN-16L 4x4, TSSOP-14, TSSOP-14 (Exposed Pad),
MSOP-10 and WDFN-10L 3x3 package.
Applications




Notebook Computer Displays
LCD Monitor Panels
Automotive Displays
LCD-TVs
The RT9137/RT9138/RT9139 are specified for operation
over the full −40°C to 85°C temperature range.
Ordering Information
RT9137
RT9139A
Package Type
C : TSSOP-14
CP : TSSOP-14 (Exposed Pad)
QW : WQFN-16L 4x4 (W-Type)
Package Type
J5 : TSOT-23-5
QW : WDFN-6L 2x2 (W-Type)
Lead Plating System
G : Green (Halogen Free and Pb Free)
RT9138A
Lead Plating System
G : Green (Halogen Free and Pb Free)
RT9139B
Package Type
F : MSOP-8
Lead Plating System
G : Green (Halogen Free and Pb Free)
RT9138B
Package Type
F : MSOP-10
QW : WDFN-10L 3x3 (W-Typw)
Lead Plating System
G : Green (Halogen Free and Pb Free)
Note :
Package Type
QW : WDFN-6L 2x2 (W-Type)
Lead Plating System
G : Green (Halogen Free and Pb Free)
DS9137/8/9-01 April 2011
Richtek products are :

RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.

Suitable for use in SnPb or Pb-free soldering processes.
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1
RT9137/8/9
Pin Configurations
VIN-
5
4
2
3
VS-
1
NC
VS+
2
3
6
VS-
(TOP VIEW)
VS+
VIN+
5
7
4
VINVOUT
VOUTA
VINAVINA+
VS-
VS+
VOUTB
VINBVINB+
8
2
7
3
6
4
5
VOUT VS- VIN+
RT9138A
VOUTA
1
VINA
VS-
2
3
6
VS+
5
7
4
VOUTB
VINB
VINA-
1
VINA+
2
VS+
3
VINB+
4
NC
RT9137
VOUTD
RT9137
VOUTA
MSOP-8
NC
WDFN-6L 2x2
VS-
TSOT-23-5
16
15
14
13
12
VIND-
11
VIND+
10
VS-
9
VINC+
VS-
6
7
8
VOUTC
VINC-
RT9138B
5
VINB-
WDFN-6L 2x2
VOUTB
17
VOUTA
VINAVINA+
VS+
VINB+
VINBVOUTB
VOUTD
VINDVIND+
VSVINC+
VINCVOUTC
14
2
13
3
12
VS-
4
5
11
10
6
9
15
7
8
TSSOP-14 (Exposed Pad)
RT9139A
WQFN-16L 4x4
VOUTA
VINAVINA+
VS+
VINB+
VINBVOUTB
14
2
13
3
12
4
11
5
10
6
9
7
8
VOUTD
VINDVIND+
VSVINC+
VINCVOUTC
VOUTA
VINA
VS+
VINB
VOUTB
10
2
9
3
8
4
7
5
6
VOUTD
VIND
VSVINC
VOUTC
VOUTA
VINA
VS+
VINB
VOUTB
1
2
3
4
5
VS-
RT9139A
11
10
9
8
7
6
VOUTD
VIND
VSVINC
VOUTC
TSSOP-14
MSOP-10
WDFN-10L 3x3
RT9139A
RT9139B
RT9139B
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DS9137/8/9-01 April 2011
RT9137/8/9
Marking Information
RT9137GJ5
RT9138AGF
BL= : Product Code
BL=DNN
DN= : Product Code
DNN : Date Code
DN=YM
DNN
RT9138BGQW
YMDNN : Date Code
RT9139AGQW
ET= : Product Code
H3 : Product Code
W : Date Code
H3W
ET=YM
DNN
RT9139AGCP
YMDNN : Date Code
RT9139AGC
RT9139AGCP : Product Number
RT9139A
GCPYMDNN
YMDNN : Date Code
RT9139AGC : Product Number
RT9139A
GCYMDNN
YMDNN : Date Code
RT9139BGQW
FK= : Product Code
FK=YM
DNN
YMDNN : Date Code
Functional Pin Description
RT9137
TSOT-23-5
Pin No.
WDFN-6L 2x2
Pin Name
Pin Function
1
4
VOUT
Amplifier Output.
--
2
NC
No Internal Connection.
2
1, 7 (Exposed Pad)
VS-
Negative Power Supply.
3
6
VIN+
Amplifier Non-Inverting Input.
4
5
VIN-
Amplifier Inverting Input.
5
3
VS+
Positive Power Supply.
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RT9137/8/9
RT9138A
Pin No.
1
Pin Name
VOUTA
Pin Function
Amplifier A Output.
2
VINA-
Amplifier A Inverting Input.
3
VINA+
Amplifier A Non-Inverting Input.
4
VS-
Negative Power Supply.
5
VINB+
Amplifier B Non-Inverting Input.
6
VINB-
Amplifier B Inverting Input.
7
VOUTB
Amplifier B Output.
8
VS+
Positive Power Supply.
RT9138B
Pin No
Pin Name
Pin Function
1
VOUTA
Amplifier A Output.
2
VINA
Amplifier A Input.
3, 7 (Exposed Pad) VS-
Negative Power Supply.
4
VINB
Amplifier B Input.
5
VOUTB
Amplifier B Output.
6
VS+
Positive Power Supply.
RT9139A
Pin No.
Pin Name
Pin Function
TSSOP-14
TSSOP-14
(Exposed Pad)
WQFN-16L 4x4
1
1
15
VOUTA
Amplifier A Output.
2
2
1
VINA-
Amplifier A Inverting Input.
3
3
2
VINA+
Amplifier A Non-Inverting Input.
4
4
3
VS+
Positive Power Supply.
5
5
4
VINB+
Amplifier B Non-Inverting Input.
6
6
5
VINB-
Amplifier B Inverting Input.
7
7
6
VOUTB
Amplifier B Output.
8
8
7
VOUTC
Amplifier C Output.
9
9
8
VINC-
Amplifier C Inverting Input.
10
9
VINC+
Amplifier C Non-Inverting Input.
10
11
11,
10,
VS15 (Exposed Pad) 17 (Exposed Pad)
Negative Power Supply.
12
12
11
VIND+
Amplifier D Non-Inverting Input.
13
13
12
VIND-
Amplifier D Inverting Input.
14
14
14
VOUTD
Amplifier D Output.
--
--
16
NC
No Internal Connection.
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DS9137/8/9-01 April 2011
RT9137/8/9
RT9139B
Pin No
Pin Name
Pin Function
MSOP-10
WDFN-10L 3x3
1
1
VOUTA
Amplifier A Output.
2
2
VINA
Amplifier A Input.
3
3
VS+
Positive Power Supply.
4
4
VINB
Amplifier B Input.
5
5
VOUTB
Amplifier B Output.
6
6
VOUTC
Amplifier C Output.
7
7
VINC
Amplifier C Input.
8
8, 11 (Exposed Pad) VS-
Negative Power Supply.
9
9
VIND
Amplifier D Input.
10
10
VOUTD
Amplifier D Output.
Function Block Diagram
VOUTA
VS+
-
VINVIN+
VINAVINA+
VOUT
+
-
+
+
+
+
-
-
VS+
VS-
VINB+
VINB-
RT9137
-
+
+
VS-
RT9139A
VINBVINB+
VS+
RT9138A
VOUTA
VINA
VOUTD
-
-
+
+
VIND
+
+
VINC
-
-
VS+
VINB
VOUTA
VINA
VOUTB
-
-
+
+
VS+
VINC+
VINCVOUTC
VOUTB
-
VINDVIND+
VS-
VOUTB
VOUTA
VINAVINA+
VOUTD
-
VS-
VOUTB
VOUTC
VINB
VS-
RT9139B
RT9138B
DS9137/8/9-01 April 2011
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5
RT9137/8/9
Absolute Maximum Ratings









(Note 1)
Supply Voltage, VS+ to VS- ------------------------------------------------------------------------------Input Voltage, VINx -----------------------------------------------------------------------------------------Differential Input Voltage -----------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C
TSOT-23-5 -----------------------------------------------------------------------------------------------------WDFN-6L 2x2 ------------------------------------------------------------------------------------------------MSOP-8 -------------------------------------------------------------------------------------------------------TSSOP-14 (Exposed Pad) --------------------------------------------------------------------------------TSSOP-14 -----------------------------------------------------------------------------------------------------WQFN-16L 4x4 ----------------------------------------------------------------------------------------------MSOP-10 ------------------------------------------------------------------------------------------------------WDFN-10L 3x3 -----------------------------------------------------------------------------------------------Package Thermal Resistance (Note 2)
TSOT-23-5, θJA -----------------------------------------------------------------------------------------------WDFN-6L 2x2, θJA -------------------------------------------------------------------------------------------MSOP-8, θJA --------------------------------------------------------------------------------------------------TSSOP-14 (Exposed Pad), θJA --------------------------------------------------------------------------TSSOP-14, θJA -----------------------------------------------------------------------------------------------WQFN-16L 4x4, θJA -----------------------------------------------------------------------------------------MSOP-10, θJA ------------------------------------------------------------------------------------------------WDFN-10L 3x3, θJA -----------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) -----------------------------------------------------------------Junction Temperature ---------------------------------------------------------------------------------------Storage Temperature Range ------------------------------------------------------------------------------ESD Susceptibility (Note 3)
HBM (Human Body Mode) --------------------------------------------------------------------------------MM (Machine Mode) -----------------------------------------------------------------------------------------
Recommended Operating Conditions




18V
VS- − 0.5V to VS+ + 0.5V
VS
0.625W
0.833W
0.833W
2W
0.833W
1.852W
0.833W
1.429W
160°C/W
120°C/W
120°C/W
50°C/W
120°C/W
54°C/W
120°C/W
70°C/W
260°C
150°C
−65°C to 150°C
2kV
200V
(Note 4)
Supply Voltage (Single Supply), VS+ ------------------------------------------------------------------Supply Voltage (Dual Supply), VS+ and VS- ---------------------------------------------------------Junction Temperature Range ------------------------------------------------------------------------------Ambient Temperature Range -------------------------------------------------------------------------------
4.5V to 16.5V
± 2.25V to ± 8.25V
−40°C to 125°C
−40°C to 85°C
Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a high effective thermal conductivity four-layer test board of
JEDEC 51-7 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
To be continued
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RT9137/8/9
Electrical Characteristics
(VS+ = 2.5V, VS- = −2.5V, RL = 1kΩ to 0V, TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
--
3
17.5
mV
Input Characteristics
Input Offset Voltage
V OS
Average Offset Voltage Drift
Note (2)
VOS /T 40C  T A  85C
--
7
--
V/C
Input Bias Current
IB
--
2
60
nA
RIN
--
1
--
G
CIN
--
2
--
pF
CMIR
3
--
3
V
Input Impedance
Note (2)
Input Capacitance
Note (2)
Common-Mode Input Range
V CM = 0V
V CM = 0V
Common-Mode Rejection Ratio CMRR
For V IN from 3V to 3V
--
70
--
dB
Open-Loop Gain
A VOL
2V  V OUT  2V
--
70
--
dB
Output Swing Low
V OL
IL = 5mA
--
2.42
2.35
V
Output Swing High
V OH
IL = 5mA
2.35
2.42
--
V
Continuous Output Current
IOC
--
±35
--
mA
Peak Output Current
IPC
--
100
--
mA
--
70
--
dB
Output Characteristics
Power Supply
Power Supply Rejection Ratio
PSRR
V S is moved from ±2.25V to ±7.5V
Supply Current/Amplifier
ISY
No Load, Per Channel
--
4.4
--
mA
SR
2V  VOUT  2V, 20% to 80%
--
110
--
V/us
Setting to ±0.1% (AV = 1)
Note (2)
tS
(A V = 1), VOUT = 2V step
--
100
--
ns
3dB Bandwidth
BW
RL = 10k, C L =10 pF
--
50
--
MHz
Gain-Bandwidth Product
GBWP
RL = 10k, C L =10 pF
--
30
--
MHz
Phase Margin
PM
RL = 10k, C L =10 pF
--
50
--

CS
f = 5MHz
--
75
--
dB
Dynamic Performance
Slew Rate
Note (1)
Note (2)
Channel Separation
Note :
(1) Slew rate is measured on rising and falling edges.
(2) Guaranteed by design, not subject to production testing.
DS9137/8/9-01 April 2011
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RT9137/8/9
(VS+ = 5V, VS- = -5V, RL = 1kΩ to 0V, TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Input Characteristics
Input Offset Voltage
VOS
VCM = 0
--
3
17.5
mV
Average Offset Voltage Drift
Note (2)
V OS /T
40C  T A  85C
--
7
--
V/C
Input Bias Current
IB
VCM = 0
--
2
60
nA
RIN
--
1
--
G
CIN
--
2
--
pF
5.5
--
5.5
V
Input Impedance
Note (2)
Input Capacitance
Note (2)
Common-Mode Input Range
CMIR
Common-Mode Rejection Ratio CMRR
For VIN from 5.5V to 5.5V
--
70
--
dB
Open-Loop Gain
AVOL
4.5V  VOUT  4.5V
--
70
--
dB
Output Swing Low
VOL
IL = 5mA
--
4.92
4.85
V
Output Swing High
VOH
I L = 5mA
4.85
4.92
--
V
Continuous Output Current
IOC
--
±35
--
mA
Peak Output Current
IPC
--
250
--
mA
Output Characteristics
Power Supply
Power Supply Rejection Ratio
PSRR
VS is moved from ±2.25V to ±7.5V
--
70
--
dB
Supply Current/Amplifier
ISY
No Load, Per Channel
--
4.6
--
mA
SR
4.0V  VOUT  4.0V, 20% to 80%
--
120
--
V/s
tS
(AV = 1), VOUT = 2V step
--
100
--
ns
-3dB Bandwidth
BW
RL = 10k, CL =10 pF
--
50
--
MHz
Gain-Bandwidth Product
GBWP
RL = 10k, CL =10 pF
--
30
--
MHz
Phase Margin
PM
RL = 10k, CL =10 pF
--
50
--

CS
f = 5MHz
--
75
--
dB
Dynamic Performance
Slew Rate
Note (1)
Setting to ±0.1% (A V = +1)
Note (2)
Note (2)
Channel Separation
Note :
(1) Slew rate is measured on rising and falling edges.
(2) Guaranteed by design, not subject to production testing.
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DS9137/8/9-01 April 2011
RT9137/8/9
(VS+ = 7.5V, VS- = −7.5V, RL = 1kΩ to 0V, TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
--
3
17.5
mV
Input Characteristics
Input Offset Voltage
V OS
Average Offset Voltage Drift
Note (2)
VOS /T 40C  T A  85C
--
7
--
V/C
Input Bias Current
IB
--
2
60
nA
RIN
--
1
--
G
CIN
--
2
--
pF
CMIR
8
--
8
V
Input Impedance
Note (2)
Input Capacitance
Note (2)
Common-Mode Input Range
V CM = 0V
V CM = 0V
Common-Mode Rejection Ratio CMRR
For V IN from 8V to 8V
--
70
--
dB
Open-Loop Gain
A VOL
7V  V OUT  7V
--
70
--
dB
Output Swing Low
V OL
IL = 5mA
--
7.42
7.35
V
Output Swing High
V OH
IL = 5mA
7.35
7.42
--
V
Continuous Output Current
IOC
--
±35
--
mA
Peak Output Current
IPC
--
±300
--
mA
--
70
--
dB
Output Characteristics
Power Supply
Power Supply Rejection Ratio
PSRR
V S is moved from ±2.25V to ±7.5V
Supply Current/Amplifier
ISY
No Load, Per Channel
--
5.5
--
mA
SR
7V  VOUT  7V, 20% to 80%
--
140
--
V/s
Setting to ±0.1% (AV = 1)
Note (2)
tS
(A V = 1), VOUT = 2V step
--
100
--
ns
3dB Bandwidth
BW
RL = 10k, C L =10 pF
--
50
--
MHz
Gain-Bandwidth Product
GBWP
RL = 10k, C L =10 pF
--
30
--
MHz
Phase Margin
PM
RL = 10k, C L =10 pF
--
50
--

CS
f = 5MHz
--
75
--
dB
Dynamic Performance
Slew Rate
Note (1)
Note (2)
Channel Separation
Note :
(1) Slew rate is measured on rising and falling edges.
(2) Guaranteed by design, not subject to production testing.
DS9137/8/9-01 April 2011
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9
RT9137/8/9
Typical Operating Characteristics
Offset Voltage vs. Supply Voltage
20
8
12
Offset Voltage (mV)
Supply Current (mA) 1
Supply Current vs. Supply Voltage
10
6
4
2
4
-4
-12
0
-20
4.5
6.5
8.5
10.5
12.5
14.5
16.5
4.5
6.5
8.5
12.5
14.5
16.5
Output Swing Voltage Low vs. Supply Voltage
80
90
70
80
Swing Voltage (mV)
Swing Voltage (mV)
Output Swing Voltage High vs. Supply Voltage
60
50
40
30
20
10
70
60
50
40
30
20
10
0
0
4.5
6.5
8.5
10.5
12.5
14.5
16.5
4.5
6.5
8.5
Supply Voltage (V)
10.5
12.5
14.5
16.5
Supply Voltage (V)
Supply Current vs. Temperature
Offset Voltage vs. Temperature
10
20
8
12
Offset Voltage (mV)
Supply Current (mA) 1
10.5
Supply Voltage (V)
Supply Voltage (V)
6
4
2
4
-4
-12
VSUP = 15V
VSUP = 15V
-20
0
-50
-25
0
25
50
Temperature (C)
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10
75
100
125
-50
-25
0
25
50
75
100
125
Temperature (C)
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RT9137/8/9
Slew Rate
Rail-to-Rail Input and Ouput Voltage
VIN
(5V/Div)
VIN
(2V/Div)
VOUT
(5V/Div)
VSUP = 10V
Time (5μs/Div)
DS9137/8/9-01 April 2011
VOUT
(2V/Div)
VSUP = 10V
Time (25ns/Div)
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RT9137/8/9
Application Information
The RT9137/RT9138/RT9139 is a high performance
operational amplifier capable of driving large loads for
different applications. A high slew rate, rail-to-rail input
and output capability, and low power consumption are the
features which make the operational amplifier ideal for LCD
applications. The RT9137/RT9138/RT9139 also has wide
bandwidth and phase margin to drive a panel load.
Operating Voltage
The RT9137/8/9 is specified with a single nominal supply
voltage from 5V to 15V or a split supply with its total
range from 5V to 15V. Correct operation is guaranteed for
a supply range of 4.5V to 16.5V. The RT9137/8/9
specifications remain stable over the entire supply range
and operating temperature range from −40°C to 85°C.
Parameter variations with operating voltage and
temperature are shown in the typical performance curves.
The output swing of the RT9137/8/9 typically extends to
within 80mV of positive/negative supply rails with 5mA
load current source/sink.
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
For recommended operating condition specifications of
the RT9137/8/9, the maximum junction temperature is
125°C and TA is the ambient temperature. The junction to
ambient thermal resistance, θJA, is layout dependent. The
thermal resistance, θJA, is 160°C/W for TSOT-23-5
package, 120°C/W for WDFN-6L 2x2 package, 120°C/W
for MSOP-8 package, 50°C/W for TSSOP-14 (Exposed
Pad) package, 120°C/W for TSSOP-14 package, 54°C/W
for WQFN-16L 4x4 package, 120°C/W for MSOP-10
package, and 70°C/W for WDFN-10L 3x3 package, on a
standard JEDEC 51-7 four-layer thermal test board. The
maximum power dissipation at TA = 25°C can be calculated
by the following formulas :
PD(MAX) = (125°C − 25°C) / (160°C/W) = 0.625W for
TSOT-23-5 package
PD(MAX) = (125°C − 25°C) / (120°C/W) = 0.833W for
Short Circuit Condition
WDFN-6L 2x2 package
An internal short circuit protection circuit is implemented
to protect the device from output short circuit. The RT9137/
8/9 limits the short circuit current to ±300mA when supply
voltage is ±7.5V. For reliability concerns, a continuous
output current of not more than ±35mA is recommended.
PD(MAX) = (125°C − 25°C) / (120°C/W) = 0.833W for
Unused Amplifier
If the amplifier is unused, it is recommended to connect
the positive input to ground while keeping the output pin
open.
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
PD(MAX) = (TJ(MAX) − TA) / θJA
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12
MSOP-8 package
PD(MAX) = (125°C − 25°C) / (50°C/W) = 2W for
TSSOP-14 (Exposed Pad) package
PD(MAX) = (125°C − 25°C) / (120°C/W) = 0.833W for
TSSOP-14 package
PD(MAX) = (125°C − 25°C) / (54°C/W) = 1.852W for
WQFN-16L 4x4 package
PD(MAX) = (125°C − 25°C) / (120°C/W) = 0.833W for
MSOP-10 package
PD(MAX) = (125°C − 25°C) / (70°C/W) = 1.429W for
WDFN-10L 3x3 package
The maximum power dissipation depends on the operating
ambient temperature for fixed T J(MAX) and thermal
resistance, θJA. For the RT9137/8/9 packages, the derating
curves in Figure 1 allow the designer to see the effect of
rising ambient temperature on the maximum power
dissipation.
DS9137/8/9-01 April 2011
RT9137/8/9
Layout Considerations
Maximum Power Dissipation (W)1
2.20
Four-Layer PCB
TSSOP-14 (Exposed Pad)
WQFN-16L 4x4
WDFN-10L 3x3
MSOP-10
TSSOP-14
MSOP-8
MSOP-8
TSOT-23-5
2.00
1.80
1.60
1.40
1.20
1.00
PCB layout is very important for designing power circuits.
The following layout guidelines should be strictly followed
for best performance of the RT9137/8/9.

Place the components as close to the IC as possible.
The traces should be wide and short, especially for the
high current loop.

Connect a 0.1μF capacitor from VIN+ to ground and
place it as close to the IC as possible for better
performance.

A series resistance may be needed at the output for
some applications.

The exposed pad of the chip should be connected to a
strong ground or VS- plane for maximum thermal
consideration.
0.80
0.60
0.40
0.20
0.00
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 1. Derating Curves for the RT9137/8/9 Packages
DS9137/8/9-01 April 2011
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13
RT9137/8/9
Outline Dimension
H
D
L
B
C
b
A
A1
e
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
1.000
0.028
0.039
A1
0.000
0.100
0.000
0.004
B
1.397
1.803
0.055
0.071
b
0.300
0.559
0.012
0.022
C
2.591
3.000
0.102
0.118
D
2.692
3.099
0.106
0.122
e
0.838
1.041
0.033
0.041
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
TSOT-23-5 Surface Mount Package
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14
DS9137/8/9-01 April 2011
RT9137/8/9
D2
D
L
E
E2
1
e
b
A
A1
SEE DETAIL A
2
1
2
1
A3
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.200
0.350
0.008
0.014
D
1.950
2.050
0.077
0.081
D2
1.000
1.450
0.039
0.057
E
1.950
2.050
0.077
0.081
E2
0.500
0.850
0.020
0.033
e
L
0.650
0.300
0.026
0.400
0.012
0.016
W-Type 6L DFN 2x2 Package
DS9137/8/9-01 April 2011
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15
RT9137/8/9
D
L
E1
E
e
A2
A
A1
b
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.810
1.100
0.032
0.043
A1
0.000
0.150
0.000
0.006
A2
0.750
0.950
0.030
0.037
b
0.220
0.380
0.009
0.015
D
2.900
3.100
0.114
0.122
e
0.650
0.026
E
4.800
5.000
0.189
0.197
E1
2.900
3.100
0.114
0.122
L
0.400
0.800
0.016
0.031
8-Lead MSOP Plastic Package
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DS9137/8/9-01 April 2011
RT9137/8/9
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
1.000
1.200
0.039
0.047
A1
0.000
0.150
0.000
0.006
A2
0.800
1.050
0.031
0.041
b
0.190
0.300
0.007
0.012
D
4.900
5.100
0.193
0.201
e
0.650
0.026
E
6.300
6.500
0.248
0.256
E1
4.300
4.500
0.169
0.177
L
0.450
0.750
0.018
0.030
U
1.900
2.900
0.075
0.114
V
1.600
2.600
0.063
0.102
14-Lead TSSOP (Exposed Pad) Plastic Package
DS9137/8/9-01 April 2011
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17
RT9137/8/9
D
L
E1
E
e
A2
A
A1
b
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
1.000
1.200
0.039
0.047
A1
0.050
0.150
0.002
0.006
A2
0.800
1.050
0.031
0.041
b
0.190
0.300
0.007
0.012
D
4.900
5.100
0.193
0.201
e
0.650
0.026
E
6.300
6.500
0.248
0.256
E1
4.300
4.500
0.169
0.177
L
0.450
0.750
0.018
0.030
14-Lead TSSOP Plastic Package
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18
DS9137/8/9-01 April 2011
RT9137/8/9
D
SEE DETAIL A
D2
L
1
E
E2
e
b
A
A1
1
1
2
2
DETAIL A
Pin #1 ID and Tie Bar Mark Options
A3
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.250
0.380
0.010
0.015
D
3.950
4.050
0.156
0.159
D2
2.000
2.450
0.079
0.096
E
3.950
4.050
0.156
0.159
E2
2.000
2.450
0.079
0.096
e
L
0.650
0.500
0.026
0.600
0.020
0.024
W-Type 16L QFN 4x4 Package
DS9137/8/9-01 April 2011
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19
RT9137/8/9
D
L
E1
E
e
A2
A
A1
b
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.810
1.100
0.032
0.043
A1
0.000
0.150
0.000
0.006
A2
0.750
0.950
0.030
0.037
b
0.170
0.270
0.007
0.011
D
2.900
3.100
0.114
0.122
e
0.500
0.020
E
4.800
5.000
0.189
0.197
E1
2.900
3.100
0.114
0.122
L
0.400
0.800
0.016
0.031
10-Lead MSOP Plastic Package
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20
DS9137/8/9-01 April 2011
RT9137/8/9
D2
D
L
E
E2
1
e
SEE DETAIL A
2
b
2
1
DETAIL A
Pin #1 ID and Tie Bar Mark Options
A
A1
1
A3
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.180
0.300
0.007
0.012
D
2.950
3.050
0.116
0.120
D2
2.300
2.650
0.091
0.104
E
2.950
3.050
0.116
0.120
E2
1.500
1.750
0.059
0.069
e
L
0.500
0.350
0.020
0.450
0.014
0.018
W-Type 10L DFN 3x3 Package
Richtek Technology Corporation
Richtek Technology Corporation
Headquarter
Taipei Office (Marketing)
5F, No. 20, Taiyuen Street, Chupei City
5F, No. 95, Minchiuan Road, Hsintien City
Hsinchu, Taiwan, R.O.C.
Taipei County, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Tel: (8862)86672399 Fax: (8862)86672377
Email: [email protected]
Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.
DS9137/8/9-01 April 2011
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21