BAT760 Medium power Schottky barrier single diode Rev. 03 — 17 October 2008 Product data sheet 1. Product profile 1.1 General description Planar medium power Schottky barrier single diode with an integrated guard ring for stress protection, encapsulated in a SOD323 (SC-76) very small Surface-Mounted Device SMD plastic package. 1.2 Features n n n n Ultra high-speed switching Very low forward voltage Guard-ring protected Very small SMD plastic package 1.3 Applications n Ultra high-speed switching n Voltage clamping n Protection circuits 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VR IF VF [1] Min Typ Max Unit reverse voltage - - 20 V forward current - - 1 A - 480 550 mV forward voltage Pulse test: tp ≤ 300 µs; δ ≤ 0.02. Conditions IF = 1 A [1] BAT760 NXP Semiconductors Medium power Schottky barrier single diode 2. Pinning information Table 2. Pinning Pin Description 1 cathode 2 anode Simplified outline Graphic symbol [1] 1 1 2 2 sym001 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BAT760 SC-76 plastic surface-mounted package; 2 leads SOD323 Table 4. Marking codes 4. Marking Type number Marking code BAT760 A4 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VR reverse voltage IF forward current IFSM non-repetitive peak forward current Tj Tamb Tstg Max Unit - 20 V - 1 A - 5 A junction temperature - 125 °C ambient temperature −65 +125 °C storage temperature −65 +150 °C tp = 8.3 ms; half-sine wave; JEDEC method BAT760_3 Product data sheet Min © NXP B.V. 2008. All rights reserved. Rev. 03 — 17 October 2008 2 of 9 BAT760 NXP Semiconductors Medium power Schottky barrier single diode 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient in free air Min Typ Max Unit [1] - - 220 K/W [2] - - 180 K/W [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 10 × 10 mm2. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 40 × 40 mm2. 7. Characteristics Table 7. Characteristics Tamb = 25 °C unless otherwise specified. Symbol VF Parameter Conditions Min Typ Max Unit IF = 10 mA - 240 270 mV IF = 100 mA - 300 350 mV - 480 550 mV VR = 5 V - 5 10 µA VR = 8 V - 7 20 µA VR = 15 V - 10 50 µA VR = 5 V; f = 1 MHz - 19 25 pF [1] forward voltage IF = 1 A IR Cd [1] [1] reverse current diode capacitance Pulse test: tp ≤ 300 µs; δ ≤ 0.02. BAT760_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 17 October 2008 3 of 9 BAT760 NXP Semiconductors Medium power Schottky barrier single diode mld562 103 mld563 105 IR (µA) IF (mA) (1) 104 102 (2) 103 (1) (2) (3) 10 102 (3) 1 10 10−1 0 0.2 0.4 VF (V) 1 0.6 0 5 (1) Tamb = 125 °C (1) Tamb = 125 °C (2) Tamb = 85 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (3) Tamb = 25 °C Fig 1. Forward current as a function of forward voltage; typical values Fig 2. 10 15 20 VR (V) 25 Reverse current as a function of reverse voltage; typical values mld564 80 Cd (pF) 60 40 20 0 0 5 10 20 15 VR (V) f = 1 MHz; Tamb = 25 °C Fig 3. Diode capacitance as a function of reverse voltage; typical values BAT760_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 17 October 2008 4 of 9 BAT760 NXP Semiconductors Medium power Schottky barrier single diode 8. Package outline 1.35 1.15 1.1 0.8 0.45 0.15 1 2.7 2.3 1.8 1.6 2 0.40 0.25 Dimensions in mm Fig 4. 0.25 0.10 03-12-17 Package outline SOD323 (SC-76) 9. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number BAT760 [1] Package SOD323 Description 4 mm pitch, 8 mm tape and reel 3000 10000 -115 -135 For further information and the availability of packing methods, see Section 13. BAT760_3 Product data sheet Packing quantity © NXP B.V. 2008. All rights reserved. Rev. 03 — 17 October 2008 5 of 9 BAT760 NXP Semiconductors Medium power Schottky barrier single diode 10. Soldering 3.05 2.1 solder lands solder resist 0.5 (2×) 1.65 0.95 0.6 (2×) solder paste occupied area 2.2 Dimensions in mm 0.5 (2×) 0.6 (2×) Fig 5. sod323_fr Reflow soldering footprint SOD323 (SC-76) 5 2.9 1.5 (2×) solder lands solder resist occupied area 2.75 1.2 (2×) Dimensions in mm preferred transport direction during soldering sod323_fw Fig 6. Wave soldering footprint SOD323 (SC-76) BAT760_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 17 October 2008 6 of 9 BAT760 NXP Semiconductors Medium power Schottky barrier single diode 11. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes BAT760_3 20081017 Product data sheet - BAT760_2 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • • • Legal texts have been adapted to the new company name where appropriate. Table 1 “Quick reference data”: added Figure 4: superseded by minimized package outline drawing Section 9 “Packing information”: added Section 10 “Soldering”: added Section 12 “Legal information”: updated BAT760_2 20040126 Product specification - BAT760_1 BAT760_1 20010312 Product specification - - BAT760_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 17 October 2008 7 of 9 BAT760 NXP Semiconductors Medium power Schottky barrier single diode 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 12.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BAT760_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 17 October 2008 8 of 9 BAT760 NXP Semiconductors Medium power Schottky barrier single diode 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 2 3 3 5 5 6 7 8 8 8 8 8 8 9 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 17 October 2008 Document identifier: BAT760_3