RT9715CA

®
RT9715CA
90mΩ
Ω, 1.5A High-Side Power Switches with Flag
General Description
Features
The RT9715CA is a cost-effective, low-voltage, single
N-MOSFET high-side Power Switch IC for USB application.
Low switch-on resistance (typ. 90mΩ) and low supply
current (typ. 50μA) are realized in this IC.

The RT9715CA integrates an over-current protection circuit,
a short fold back circuit, a thermal shutdown circuit and
an under-voltage lockout circuit for overall protection.
Besides, a flag output is available to indicate fault
conditions to the local USB controller. Furthermore, the
chip also integrates an embedded delay function to prevent
miss-operation from happening due to inrush-current. The
RT9715CA is an ideal solution for USB power supply and
can support in package SOT-23-5.
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Applications
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Ordering Information
RT9715CA
Package Type
B : SOT-23-5
Lead Plating System
G : Green (Halogen Free and Pb Free)
Note :
Richtek products are :

RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.

Suitable for use in SnPb or Pb-free soldering processes.
90mΩ
Ω (typ.) N-MOSFET Switch
Operating Range : 2.7V to 5.5V
Reverse Blocking Current
Under Voltage Lockout
Deglitched Fault Report (FLG)
Thermal Protection with Foldback
Over Current Protection
Short Circuit Protection
UL Approved−E219878
Nemko Approved−NO49621
RoHS Compliant and Halogen Free

USB Peripherals
Notebook PCs
Pin Configurations
(TOP VIEW)
VIN
EN
5
4
2
3
VOUT GND FLG
SOT-23-5
Marking Information
4R= : Product Code
4R=DNN
DNN : Date Code
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1
RT9715CA
Typical Application Circuit
Pull-Up Resistor (10k to 100k)
USB Controller
Supply Voltage
2.7V to 5.5V
CIN
1µF
RT9715CA
VOUT
EN
VBUS
+
Enable
Over -Current
FLG
VIN
COUT
10µF
GND
D+
DGND
150µF
Ferrite
Beads
Data
μF aluminum electrolytic or tantalum between VOUT and GND is strongly recommended to meet the
Note : A low-ESR 150μ
330mV maximum droop requirement in the hub VBUS. (see Application Information Section for further details)
Functional Pin Description
Pin No.
Pin Name
Pin Function
1
VOUT
Output Voltage.
2
GND
Ground.
3
FLG
Fault FLAG Output.
4
EN
Chip Enable (Active High).
5
VIN
Power Input Voltage.
Function Block Diagram
VIN
EN
Bias
UVLO
Oscillator
Charge
Pump
Thermal
Protection
Current
Limiting
Gate
Control
Output Voltage
Detection
VOUT
FLG
Delay
GND
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RT9715CA
Absolute Maximum Ratings
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(Note 1)
Supply Input Voltage, VIN -------------------------------------------------------------------------------------------- 6V
EN Voltage -------------------------------------------------------------------------------------------------------------- −0.3V to 6V
FLAG Voltage ---------------------------------------------------------------------------------------------------------- 6V
Power Dissipation, PD @ TA = 25°C
SOT-23-5 ---------------------------------------------------------------------------------------------------------------- 0.3W
Package Thermal Resistance (Note 2)
SOT-23-5, θJA ----------------------------------------------------------------------------------------------------------- 250°C/W
Junction Temperature ------------------------------------------------------------------------------------------------- 150°C
Lead Temperature (Soldering, 10 sec.) --------------------------------------------------------------------------- 260°C
Storage Temperature Range ---------------------------------------------------------------------------------------- −65°C to 150°C
ESD Susceptibility (Note 3)
HBM (Human Body Mode) ------------------------------------------------------------------------------------------ 2kV
MM (Machine Mode) -------------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions
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

(Note 4)
Supply Input Voltage, VIN -------------------------------------------------------------------------------------------- 2.7V to 5.5V
EN Voltage -------------------------------------------------------------------------------------------------------------- 0V to 5.5V
Junction Temperature Range ---------------------------------------------------------------------------------------- −40°C to 100°C
Ambient Temperature Range ---------------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VIN = 5V, CIN = 1μF, COUT = 10μF, TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Input Quiescent Current
IQ
Switch On, VOUT = Open
--
50
70
Input Shutdown Current
ISHDN
Switch Off, V OUT = Open
--
0.1
1
VIN = 5V, IOUT = 1.3A
--
90
110
m
1.5
2
2.8
A
A
Switch On Resistance
A
Current Limit
ILIM
VOUT = 4V
Short Current
ISC_FB
VOUT = 0V, Measured Prior to
Thermal Shutdown
--
1.4
--
Logic_High Voltage
VIH
VIN = 2.7V to 5.5V
2
--
--
Logic_Low Voltage
VIL
VIN = 2.7V to 5.5V
--
--
0.8
EN Input Current
IEN
VEN = 5V
--
0.01
0.1
A
Output Leakage Current
ILEAKAGE
VEN = 0V, RLOAD = 0
--
0.5
1
A
Output Turn-On Rise Time
TON_RISE
10% to 90% of VOUT Rising
--
200
--
s
FLG Output Resistance
RFLG
I SINK = 1mA
--
20
--

FLG Off Current
IFLG_OFF
VFLG = 5V
--
0.01
1
A
FLG Delay Time
TD
From fault condition to FLG
assertion
5
12
20
ms
EN
Threshold
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V
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RT9715CA
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
1.3
1.7
--
V
Under-Voltage Lockout
VUVLO
VIN Rising
Under-Voltage Hysteresis
VUVLO
VIN Decreasing
--
0.1
--
V
Thermal Shutdown Protection
TSD
VOUT > 1V
--
120
--
°C
VOUT = 0V
--
100
--
°C
VOUT = 0V
--
20
--
°C
Thermal Shutdown Hysteresis
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect
device reliability.
Note 2. θJA is measured at TA = 25°C on a low effective thermal conductivity single-layer test board per JEDEC 51-3.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
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is a registered trademark of Richtek Technology Corporation.
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RT9715CA
Typical Operating Characteristics
On Resistance vs. Temperature
On Resistance vs. Input Voltage
108
125
IOUT = 2A
120
104
On Resistance (mΩ)
On Resistance (mΩ)
106
102
100
98
96
94
VIN = 5V, IOUT = 2A
115
110
105
100
95
90
85
80
92
75
70
90
2.7
3.1
3.5
3.9
4.3
4.7
5.1
-40
5.5
-25
-10
5
No Load
59
Quiescent Current (µA)
Quiescent Current (µA)
60
56
54
52
50
48
46
44
42
VIN = 5V, No Load
58
57
56
55
54
53
52
3.1
3.5
3.9
4.3
4.7
5.1
5.5
-40
-25
-10
5
20
35
50
65
80
95
110
Temperature (°C)
Input Voltage (V)
Shutdown Current vs. Temperature
Shutdown Current vs. Input Voltage
1.0
No Load
0.9
Shutdown Current (µA)1
Shutdown Current (µA)1
80
50
2.7
0.9
65
51
40
1.0
50
Quiescent Current vs. Temperature
Quiescent Current vs. Input Voltage
58
35
Temperature (°C)
Input Voltage (V)
60
20
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
VIN = 5V
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.0
2.7
3.1
3.5
3.9
4.3
4.7
5.1
Input Voltage (V)
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5.5
-40
-25
-10
5
20
35
50
65
80
95
110
Temperature (°C)
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RT9715CA
Output Voltage vs. Output Current
UVLO Threshold vs. Temperature
6.0
2.2
5.5
VIN = 5V
2.0
UVLO Threshold (V)
Output Voltage (V)
5.0
4.5
4.0
VIN = 3.3V
3.5
3.0
2.5
2.0
1.5
1.8
Rising
1.6
Falling
1.4
1.0
1.2
0.5
0.0
1.0
0
0.25 0.5 0.75
1
1.25 1.5 1.75
2
2.25 2.5
-40
-25
-10
5
2.4
2.40
2.3
2.35
2.2
2.30
Current Limit (A)
Current Limit (A)
35
50
65
80
95
110
Current Limit vs. Temperature
Current Limit vs. Input Voltage
2.1
2.0
1.9
1.8
1.7
VIN = 5V
2.25
2.20
2.15
2.10
2.05
1.6
2.00
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
-40
-25
-10
5
20
35
50
65
80
95
110
Temperature (°C)
Input Voltage (V)
Short Current vs. Input Voltage
Short Current vs. Temperature
2.0
2.0
1.9
1.9
1.8
1.8
Short Current (A)
Short Current (A)
20
Temperature (°C)
Output Current (A)
1.7
1.6
1.5
1.4
1.3
1.7
1.6
1.5
1.4
1.3
1.2
1.2
1.1
1.1
1.0
VIN = 5V
1.0
2.7
3.1
3.5
3.9
4.3
4.7
5.1
Input Voltage (V)
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5.5
-40
-25
-10
5
20
35
50
65
80
95
110
Temperature (°C)
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RT9715CA
FLG Delay Time vs. Temperature
12.0
11
11.5
FLG Delay Time (ms)
FLG Delay Time (ms)
FLG Delay Time vs. Input Voltage
12
10
9
8
7
6
5
VIN = 5V
11.0
10.5
10.0
9.5
9.0
8.5
4
8.0
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
-40
-25
-10
5
20
35
50
65
Input Voltage (V)
Temperature (°C)
Power On from VIN
Power Off from VIN
EN = 5V, No Load
VIN
(2V/Div)
VOUT
(2V/Div)
VOUT
(2V/Div)
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95
110
EN = 5V, No Load
VIN
(2V/Div)
Time (25ms/Div)
80
Time (25ms/Div)
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RT9715CA
Applications Information
The RT9715CA is a single N-MOSFET high-side power
switches with enable input, optimized for self-powered and
bus-powered Universal Serial Bus (USB) applications. The
RT9715CA is equipped with a charge pump circuitry to
drive the internal N-MOSFET switch; the switch's low
RDS(ON), 90mΩ, meets USB voltage drop requirements;
and a flag output is available to indicate fault conditions
to the local USB controller.
Input and Output
VIN (input) is the power source connection to the internal
circuitry and the drain of the MOSFET. VOUT (output) is
the source of the MOSFET. In a typical application, current
flows through the switch from VIN to VOUT toward the load.
If VOUT is greater than VIN, current will flow from VOUT to
VIN since the MOSFET is bidirectional when on.
Unlike a normal MOSFET, there is no parasitic body diode
between drain and source of the MOSFET, the RT9715CA
prevents reverse current flow if VOUT is externally forced
to a higher voltage than VIN when the chip is disabled
(VEN < 0.8V).
S
D
S
D
G
RT9715CA
Chip Enable Input
The switch will be disabled when the EN pin is in a logic
low condition. During this condition, the internal circuitry
and MOSFET will be turned off, reducing the supply current
to 0.1μA typical. Floating the EN may cause unpredictable
operation. EN should not be allowed to go negative with
respect to GND. The EN pin may be directly tied to VIN
(GND) to keep the part on.
Soft-Start for Hot Plug-In Applications
In order to eliminate the upstream voltage droop caused
by the large inrush current during hot-plug events, the
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Fault Flag
The RT9715CA series provides a FLG signal pin which is
an N-Channel open drain MOSFET output. This open drain
output goes low when current limit or the die temperature
exceeds 120°C approximately. The FLG output is capable
of sinking a 10mA load to typically 200mV above ground.
The FLG pin requires a pull-up resistor, this resistor should
be large in value to reduce energy drain. A 100kΩ pull-up
resistor works well for most applications. In the case of
an over-current condition, FLG will be asserted only after
the flag response delay time, tD, has elapsed. This ensures
that FLG is asserted only upon valid over-current conditions
and that erroneous error reporting is eliminated.
For example, false over-current conditions may occur
during hot-plug events when extremely large capacitive
loads are connected and causes a high transient inrush
current that exceeds the current limit threshold. The FLG
response delay time tD is typically 12ms.
Under-Voltage Lockout
Under-voltage lockout (UVLO) prevents the MOSFET
switch from turning on until input the voltage exceeds
G
Normal MOSFET
“soft-start” feature effectively isolates the power source
from extremely large capacitive loads, satisfying the USB
voltage droop requirements.
approximately 1.7V. If input voltage drops below
approximately 1.3V, UVLO turns off the MOSFET switch.
Under-voltage detection functions only when the switch
is enabled.
Current Limiting and Short-Circuit Protection
The current limit circuitry prevents damage to the MOSFET
switch and the hub downstream port but can deliver load
current up to the current limit threshold of typically 1.5A
through the switch for RT9715CA. When a heavy load or
short circuit is applied to an enabled switch, a large
transient current may flow until the current limit circuitry
responds. Once this current limit threshold is exceeded,
the device enters constant current mode until the thermal
shutdown occurs or the fault is removed.
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RT9715CA
Thermal Shutdown
Thermal protection limits the power dissipation in
RT9715CA. When the operation junction temperature
exceeds 120°C, the OTP circuit starts the thermal
shutdown function and turns the pass element off. The
pass element turn on again after the junction temperature
cools to 80°C. The RT9715CA lowers its OTP trip level
from 120°C to 100°C when output short circuit occurs
(VOUT < 1V) as shown in Figure 1.
1V
V OUT
IOUT
Thermal
Shutdown
IC Temperature
100 C
80 C
Figure 1. Short Circuit Thermal Folded Back Protection
when Output Short Circuit Occurs (Patent)
Power Dissipation
The junction temperature of the RT9715CA series depend
on several factors such as the load, PCB layout, ambient
temperature and package type. The output pin of the
RT9715CA can deliver the current of up to 1.5A
(RT9715CA) over the full operating junction temperature
range. However, the maximum output current must be
decreased at higher ambient temperature to ensure the
junction temperature does not exceed 100°C. With all
possible conditions, the junction temperature must be
within the range specified under operating conditions.
Power dissipation can be calculated based on the output
current and the RDS(ON) of the switch as below.
PD = RDS(ON) x IOUT2
Although the device is rated for 1.5A of output current,
but the application may limit the amount of output current
based on the total power dissipation and the ambient
temperature. The final operating junction temperature for
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PD (MAX) = ( TJ (MAX) − TA ) / θJA
Where TJ (MAX) is the maximum junction temperature of
the die (100°C) and TA is the maximum ambient temperature.
The junction to ambient thermal resistance (θJA) for
SOT-23-5 package at recommended minimum footprint
are 250°C/W (θJA is layout dependent).
Universal Serial Bus (USB) & Power Distribution
V OUT Short to GND
120  C 100 C

OTP Trip Point
any set of conditions can be estimated by the following
thermal equation :
The goal of USB is to enable device from different vendors
to interoperate in an open architecture. USB features
include ease of use for the end user, a wide range of
workloads and applications, robustness, synergy with the
PC industry, and low-cost implementation. Benefits
include self-identifying peripherals, dynamically attachable
and reconfigurable peripherals, multiple connections
(support for concurrent operation of many devices), support
for as many as 127 physical devices, and compatibility
with PC Plug-and-Play architecture.
The Universal Serial Bus connects USB devices with a
USB host: each USB system has one USB host. USB
devices are classified either as hubs, which provide
additional attachment points to the USB, or as functions,
which provide capabilities to the system (for example, a
digital joystick). Hub devices are then classified as either
Bus-Power Hubs or Self-Powered Hubs.
A Bus-Powered Hub draws all of the power to any internal
functions and downstream ports from the USB connector
power pins. The hub may draw up to 500mA from the
upstream device. External ports in a Bus-Powered Hub
can supply up to 100mA per port, with a maximum of four
external ports.
Self-Powered Hub power for the internal functions and
downstream ports does not come from the USB, although
the USB interface may draw up to 100mA from its
upstream connect, to allow the interface to function when
the remainder of the hub is powered down. The hub must
be able to supply up to 500mA on all of its external
downstream ports. Please refer to Universal Serial
Specification Revision 2.0 for more details on designing
compliant USB hub and host systems.
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RT9715CA
Over-Current protection devices such as fuses and PTC
resistors (also called polyfuse or polyswitch) have slow
trip times, high on-resistance, and lack the necessary
circuitry for USB-required fault reporting.
The faster trip time of the RT9715CA power distribution
allows designers to design hubs that can operate through
faults. The RT9715CA provides low on-resistance and
internal fault-reporting circuitry to meet voltage regulation
and fault notification requirements.
Because the devices are also power switches, the designer
of self-powered hubs has the flexibility to turn off power to
output ports. Unlike a normal MOSFET, the devices have
controlled rise and fall times to provide the needed inrush
current limiting required for the bus-powered hub power
switch.
Voltage Drop
The USB specification states a minimum port-output
voltage in two locations on the bus, 4.75V out of a SelfPowered Hub port and 4.40V out of a Bus-Powered Hub
port. As with the Self-Powered Hub, all resistive voltage
drops for the Bus-Powered Hub must be accounted for to
guarantee voltage regulation (see Figure 7-47 of Universal
Serial Specification Revision 2.0).
The following calculation determines VOUT (MIN) for multiple ports (NPORTS) ganged together through one switch (if
using one switch per port, NPORTS is equal to 1) :
VOUT (MIN) = 4.75V − [ II x ( 4 x RCONN + 2 x RCABLE ) ] −
(0.1A x NPORTS x RSWITCH ) − VPCB
Where
RCONN = Resistance of connector contacts
Supply Filter/Bypass Capacitor
A 1μF low-ESR ceramic capacitor from VIN to GND,
located at the device is strongly recommended to prevent
the input voltage drooping during hot-plug events. However,
higher capacitor values will further reduce the voltage droop
on the input. Furthermore, without the bypass capacitor,
an output short may cause sufficient ringing on the input
(from source lead inductance) to destroy the internal
control circuitry. The input transient must not exceed 6V
of the absolute maximum supply voltage even for a short
duration.
Output Filter Capacitor
A low-ESR 150μF aluminum electrolytic or tantalum
between VOUT and GND is strongly recommended to meet
the 330mV maximum droop requirement in the hub VBUS
(Per USB 2.0, output ports must have a minimum 120μF
of low-ESR bulk capacitance per hub). Standard bypass
methods should be used to minimize inductance and
resistance between the bypass capacitor and the
downstream connector to reduce EMI and decouple voltage
droop caused when downstream cables are hot-insertion
transients. Ferrite beads in series with VBUS, the ground
line and the 0.1μF bypass capacitors at the power
connector pins are recommended for EMI and ESD
protection. The bypass capacitor itself should have a low
dissipation factor to allow decoupling at higher frequencies.
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(two contacts per connector)
RCABLE = Resistance of upstream cable wires
(one 5V and one GND)
RSWITCH = Resistance of power switch
(90mΩ typical for RT9715CA)
VPCB = PCB voltage drop
The USB specification defines the maximum resistance
per contact (RCONN) of the USB connector to be 30mΩ
and the drop across the PCB and switch to be 100mV.
This basically leaves two variables in the equation: the
resistance of the switch and the resistance of the cable.
If the hub consumes the maximum current (II) of 500mA,
the maximum resistance of the cable is 90mΩ.
The resistance of the switch is defined as follows :
RSWITCH = { 4.75V − 4.4V − [ 0.5A x ( 4 x 30mΩ + 2 x
90mΩ) ] − VPCB }  ( 0.1A x NPORTS )
= (200mV − VPCB )  ( 0.1A x NPORTS )
If the voltage drop across the PCB is limited to 100mV,
the maximum resistance for the switch is 250mΩ for four
ports ganged together. The RT9715CA, with its maximum
110mΩ on-resistance over temperature, can fit the demand
of this requirement.
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RT9715CA
Thermal Considerations
Layout Consideration
For continuous operation, do not exceed absolute
maximum operation junction temperature. The maximum
power dissipation depends on the thermal resistance of
IC package, PCB layout, the rate of surroundings airflow
and temperature difference between junction to ambient.
The maximum power dissipation can be calculated by
following formula :
In order to meet the voltage drop, droop, and EMI
requirements, careful PCB layout is necessary. The
following guidelines must be followed :

Locate the ceramic bypass capacitors as close as
possible to the VIN pins of the RT9715CA.

Place a ground plane under all circuitry to lower both
resistance and inductance and improve DC and transient
performance (Use a separate ground and power plans if
possible).

Keep all VBUS traces as short as possible and use at
least 50-mil, 2 ounce copper for all VBUS traces.

Avoid vias as much as possible. If vias are necessary,
make them as large as feasible.

Place cuts in the ground plane between ports to help
reduce the coupling of transients between ports.
the thermal resistance θJA is 250°C/W on the standard
JEDEC 51-3 single-layer thermal test board. The maximum
power dissipation at TA = 25°C can be calculated by
following formula :

Locate the output capacitor and ferrite beads as close
to the USB connectors as possible to lower impedance
(mainly inductance) between the port and the capacitor
and improve transient load performance.
P D(MAX) = (100°C − 25°C) / (250°C/W) = 0.3W for
SOT-23-5 package

Locate the RT9715CA as close as possible to the output
port to limit switching noise.
PD(MAX) = (TJ(MAX) − TA) / θJA
Where T J(MAX) is the maximum operation junction
temperature 100°C, TA is the ambient temperature and the
θJA is the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT9715CA, where TJ(MAX) is the maximum junction
temperature of the die (100°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance θJA is layout dependent. For SOT-23-5 package,
The maximum power dissipation depends on the operating
ambient temperature for fixed T J(MAX) and thermal
resistance, θJA. The derating curve in Figure 2 of derating
curves allows the designer to see the effect of rising
ambient temperature on the maximum power allowed.
V BUS
The input capacitor should
be placed as close as
possible to the IC.
V OUT
V IN
Maximum Power Dissipation (W)1
0.5
Single Layer PCB
GND
0.4
0.3
GND_BUS
FLG
EN
V IN
0.2
Figure 3
0.1
0.0
0
10
20
30
40
50
60
70
80
90
100
Ambient Temperature (°C)
Figure 2. Derating Curve of Maximum Power Dissipation
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS9715CA-00 April 2015
is a registered trademark of Richtek Technology Corporation.
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RT9715CA
Outline Dimension
H
D
L
B
C
b
A
A1
e
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
0.889
1.295
0.035
0.051
A1
0.000
0.152
0.000
0.006
B
1.397
1.803
0.055
0.071
b
0.356
0.559
0.014
0.022
C
2.591
2.997
0.102
0.118
D
2.692
3.099
0.106
0.122
e
0.838
1.041
0.033
0.041
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
SOT-23-5 Surface Mount Package
Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
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DS9715CA-00 April 2015