ASM3P2274A 4x Multiplier EMI Reduction IC Product Description The ASM3P2274 is a versatile Spread Spectrum Frequency Modulator designed specifically for a wide range of clock frequencies. It provides a 4x Spread Spectrum Modulated output from an input clock source. The ASM3P2274A reduces electromagnetic interference (EMI) at the clock source, allowing system wide reduction of EMI of all clock dependent signals. The ASM3P2274A allows significant system cost savings by reducing the number of circuit board layers, ferrite beads and shielding that are traditionally required to pass EMI regulations. The ASM3P2274A uses the most efficient and optimized modulation profile approved by the FCC and is implemented by using a proprietary all digital method. The ASM3P2274A modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal’s bandwidth is called ‘spread spectrum clock generation.’ • • • 1 TSOP−6 CASE 318G PIN CONNECTION PD 1 XOUT 2 XIN/CLKIN 3 ASM3P2274A 6 VSS 5 ModOUT 4 VDD MARKING DIAGRAM Features • • • • • www.onsemi.com Generates a 4x EMI Optimized Clock Signal at the Output Integrated Loop Filter Components Operates with a 2.5/3.3 V Supply CMOS Design Input Frequency Range: ♦ 12 MHz to 30 MHz for 2.5 V ♦ 12 MHz to 30 MHz for 3.3 V Frequency Deviation: −1.5% (Typ) @ 66 MHz Output Frequency Available in TSOP−6 Package This Device is Pb-Free and is RoHS Compliant Z4LAYWG G 1 Z4L A Y W G = Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) Applications The ASM3P2274A is targeted towards all portable devices like MP3 players, MFP, LCD Panel Module and digital still cameras. ORDERING INFORMATION See detailed ordering and shipping information on page 6 of this data sheet. Table 1. KEY SPECIFICATIONS Description Supply Voltages Cycle-to-Cycle Jitter Specification VDD = 2.5/3.3 V ±360 ps (Typ) Output Duty Cycle 45/55% Modulation Rate Equation FIN/640 Frequency Deviation © Semiconductor Components Industries, LLC, 2015 July, 2015 − Rev. 3 −1.5% (Typ) @ 66 MHz Output 1 Publication Order Number: ASM3P2274/D ASM3P2274A VDD PD XOUT PLL Modulation XIN/CLKIN Frequency Divider Crystal Oscillator Loop Filter Phase Detector Feedback Divider VCO Output Divider ModOUT VSS Figure 1. Block Diagram PD 1 XOUT 2 XIN/CLKIN 3 ASM3P2274A 6 VSS 5 ModOUT 4 VDD Figure 2. Pin Configuration Table 2. PIN DESCRIPTION Pin# Pin Name Type Description 1 PD I Power-Down Control Pin. Pull Low to Enable Power-Down Mode. Connect to VDD if Not Used 2 XOUT O Crystal Connection. If Using an External Reference, this Pin Must be Left Unconnected 3 XIN/CLKIN I Crystal Connection or External Reference Frequency Input. This Pin has Dual Functions. It can be Connected either to an External Crystal or an External Reference Clock 4 VDD P Power Supply for the Entire Chip 5 ModOUT O Spread Spectrum Clock Output (4x Output) 6 VSS P Ground Connection Figure 3. Modulation Profile www.onsemi.com 2 ASM3P2274A Table 3. SPECIFICATIONS Description Specification Input Frequency Range for 2.5 V Supply for 3.3 V Supply 12 MHz < CLKIN < 30 MHz 12 MHz < CLKIN < 30 MHz Modulation Equation FIN/640 Frequency Deviation −1.5% (Typ) @ 66 MHz Output Table 4. ABSOLUTE MAXIMUM RATINGS Symbol VDD, VIN TSTG Parameter Rating Unit Voltage on any Pin with Respect to Ground −0.5 to +4.6 V Storage Temperature −65 to +125 °C TS Maximum Soldering Temperature (10 s) 260 °C TJ Junction Temperature 150 °C 2 kV TDV Static Discharge Voltage (as per JEDEC STD22−A114−B) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 5. RECOMMENDED OPERATING CONDITIONS Parameter VDD Description Supply Voltage Min Max Unit 2.375 3.6 V TA Operating Temperature (Ambient Temperature) 0 70 °C CL Load Capacitance − 15 pF CIN Input Capacitance − 7 pF Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. Table 6. DC ELECTRICAL CHARACTERISTICS FOR 2.5 V SUPPLY Symbol Parameter Min Typ Max Unit VIL Input Low Voltage VSS − 0.3 − 0.8 V VIH Input High Voltage 2.0 − VDD + 0.3 V IIL Input Low Current − − −35 mA IIH Input High Current − − 35 mA IXOL XOUT Output Low Current (@ 0.5 V, VDD = 2.5 V) − 3 − mA IXOH XOUT Output High Current (@ 1.8 V, VDD = 2.5 V) − 3 − mA VOL Output Low Voltage (VDD = 2.5 V, IOL = 8 mA) − − 0.6 V VOH Output High Voltage (VDD = 2.5 V, IOH = 8 mA) 1.8 − − V IDD Static Supply Current (Note 1) − − 2 mA ICC Dynamic Supply Current (2.5 V, 66 MHz and No Load) VDD Operating Voltage tON ZOUT 3.0 mA 2.375 2.5 2.625 V Power-Up Time (First Locked Cycle after Power-Up) (Note 2) − − 5 ms Output Impedance − 50 − W 1. XIN/CLKIN pin and PD pin are pulled low. 2. VDD and XIN/CLKIN input are stable, PD pin is made high from low. www.onsemi.com 3 ASM3P2274A Table 7. AC ELECTRICAL CHARACTERISTICS FOR 2.5 V SUPPLY Symbol CLKIN ModOUT fD Min Typ Max Unit Input Frequency Parameter 12 − 30 MHz Output Frequency 48 − 120 MHz Frequency Deviation Output Frequency = 48 MHz Output Frequency = 120 MHz − − −1.6 −1.4 − − % tLH* Output Rise Time (Measured at 0.7 V to 1.7 V) 0.5 2.0 2.3 ns tHL* Output Fall Time (Measured at 1.7 V to 0.7 V) 0.4 1.0 1.2 ns tJC Jitter (Cycle-to-Cycle) − ±360 − ps tD Output Duty Cycle 40 50 60 % Min Typ Max Unit * tLH and tHL are measured into a capacitive load of 15 pF. Table 8. DC ELECTRICAL CHARACTERISTICS FOR 3.3 V SUPPLY Symbol Parameter VIL Input Low Voltage VSS − 0.3 − 0.8 V VIH Input High Voltage 2.0 − VDD + 0.3 V IIL Input Low Current − − −35 mA IIH Input High Current − − 35 mA IXOL XOUT Output Low Current (@ 0.4 V, VDD = 3.3 V) − 3 − mA IXOH XOUT Output High Current (@ 2.5 V, VDD = 3.3 V) − 3 − mA VOL Output Low Voltage (VDD = 3.3 V, IOL = 8 mA) − − 0.4 V VOH Output High Voltage (VDD = 3.3 V, IOH = 8 mA) 2.5 − − V IDD Static Supply Current (Note 1) − 2 ICC Dynamic Supply Current (3.3 V, 66 MHz and No Load) VDD Operating Voltage tON ZOUT − 4.0 mA mA 3.0 3.3 3.6 V Power-Up Time (First Locked Cycle after Power-Up) (Note 2) − − 5 ms Output Impedance − 45 − W Min Typ Max Unit Input Frequency 12 − 30 MHz Output Frequency 48 − 120 MHz Frequency Deviation Output Frequency = 48 MHz Output Frequency = 120 MHz − − −1.6 −1.4 − − 1. XIN/CLKIN pin and PD pin are pulled low. 2. VDD and XIN/CLKIN input are stable, PD pin is made high from low. Table 9. AC ELECTRICAL CHARACTERISTICS FOR 3.3 V SUPPLY Symbol CLKIN ModOUT fD Parameter % tLH* Output Rise Time (Measured at 0.8 V to 2.0 V) 0.4 1.3 1.6 ns tHL* Output Fall Time (Measured at 2.0 V to 0.8 V) 0.4 0.8 1.1 ns tJC Jitter (Cycle-to-Cycle) − ±360 − ps tD Output Duty Cycle 40 50 60 % * tLH and tHL are measured into a capacitive load of 15 pF. www.onsemi.com 4 ASM3P2274A Table 10. TYPICAL CRYSTAL SPECIFICATIONS Fundamental AT Cut Parallel Resonant Crystal Rating Nominal Frequency 14.31818 MHz ±50 ppm or Better at 25°C Frequency Tolerance Operating Temperature Range −25 to +85°C Storage Temperature −40 to +85°C Load Capacitance (CP) 18 pF Shunt Capacitance 7 pF Maximum 25 W ESR NOTE: CL is Load Capacitance and Rx is used to prevent oscillations at overtone frequency of the Fundamental frequency. R Crystal Rx CL CL CL = 2 ⋅ (CP − CS) Where: CL = Load Capacitance of Crystal CS = Stray Capacitance due to CIN, PCB, Trace, etc. Figure 4. Typical Crystal Interface Circuit VDD C1 0.1 mF C2 2.2 mF VDD ASM3P2274A Rs ModOUT VSS Figure 5. Typical Application Schematic www.onsemi.com 5 ModOUT Clock ASM3P2274A Table 11. ORDERING INFORMATION Part Number Marking Package Temperature Shipping† ASM3P2274AF-06OR Z4L TSOP−6 (Pb-Free) 0 to 70°C 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. PACKAGE DIMENSIONS TSOP−6 CASE 318G−02 ISSUE V D H ÉÉ ÉÉ 6 E1 1 NOTE 5 5 2 4 L2 GAUGE PLANE E 3 L M b A1 SEATING PLANE DIM A A1 b c D E E1 e L L2 M DETAIL Z e 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H. 5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE. A c DETAIL Z MIN 0.90 0.01 0.25 0.10 2.90 2.50 1.30 0.85 0.20 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 2.75 3.00 1.50 1.70 0.95 1.05 0.40 0.60 0.25 BSC 10° − RECOMMENDED SOLDERING FOOTPRINT* 6X 0.60 6X 3.20 0.95 0.95 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 ASM3P2274A ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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