ISL9012 ® Data Sheet September 27, 2005 Dual LDO with Low Noise, Low IQ, and High PSRR ISL9012 is a high performance dual LDO capable of sourcing 150mA current from channel 1 and 300mA from channel 2. The device has a low standby current and highPSRR and is stable with output capacitance of 1µF to 10µF with ESR of up to 200mΩ. The device integrates a Power-On-Reset (POR) function for the VO2 output. The POR delay for VO2 can be externally programmed by connecting a timing capacitor to the CPOR pin. A reference bypass pin is also provided for connecting a noise-filtering capacitor for low noise and high PSRR applications. The quiescent current is typically only 45µA with both LDO’s enabled and active. Separate enable pins control each individual LDO output. When both enable pins are low, the device is in shutdown, typically drawing less than 0.1µA. FN9220.0 Features • Integrates two high performance LDOs - VO1 - 150mA output - VO2 - 300mA output • Excellent transient response to large current steps • Excellent load regulation: • <1% voltage change across full range of load current • High PSRR: 70dB @ 1kHz • Wide input voltage capability: 2.3V - 6.5V • Extremely low quiescent current: 45µA (both LDOs on) • Low dropout voltage: typically 120mV @ 150mA • Low output noise: typically 30µVrms @ 100µA(1.5V) • Stable with 1-10µF ceramic capacitors • Separate enable pins for each LDO Several combinations of voltage outputs are standard. Others are available on request. Output voltage options for each LDO range from 1.2V to 3.6V. • POR output, with adjustable delay time indicates when the VO2 output is good Pinout • Current limit and overheat protection ISL9012 10-PIN 3X3 DFN TOP VIEW • Soft-start to limit input current surge during enable • ±1.8% accuracy over all operating conditions • Tiny 10 Ld 3x3mm DFN package • -40°C to +85°C operating temperature range VIN 1 10 VO1 EN1 2 9 VO2 EN2 3 8 POR CBYP 4 7 NC Applications CPOR 5 6 GND • PDAs, Cell Phones and Smart Phones • Pin compatible with Micrel MIC2212 • Pb-free plus anneal available (RoHS compliant) • Portable Instruments, MP3 Players • Handheld Devices including Medical Handhelds 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2005. All Rights Reserved. All other trademarks mentioned are the property of their respective owners. ISL9012 Ordering Information PART NUMBER (Notes 1, 2, 3) PART MARKING VO1 VOLTAGE VO2 VOLTAGE TEMP RANGE (°C) PACKAGE (Pb-free) PKG. DWG. # ISL9012IRNJZ DAPA 3.3V 2.8V -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9012IRNFZ DARA 3.3V 2.5V -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9012IRMMZ DAAK 3.0V 3.0V -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9012IRLLZ DAAJ 2.9V 2.9V -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9012IRKKZ DASA 2.85V 2.85V -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9012IRKJZ DATA 2.85V 2.8V -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9012IRKFZ DAVA 2.85V 2.5V -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9012IRKCZ DAAB 2.85V 1.8V -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9012IRJMZ DAAH 2.8V 3.0V -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9012IRJRZ DAAG 2.8V 2.6V -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9012IRJCZ DAAF 2.8V 1.8V -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9012IRJBZ DAWA 2.8V 1.5V -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9012IRGCZ DAAE 2.7V 1.8V -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9012IRFJZ DAYA 2.5V 2.8V -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9012IRPLZ DAAD 1.85V 2.9V -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9012IRBJZ DAAC 1.5V 2.8V -40 to +85 10 Ld 3x3 DFN L10.3x3C NOTES: 1. Add -T to part number for tape and reel. 2. For other output voltages, contact Intersil Marketing. 3. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2 FN9220.0 September 27, 2005 ISL9012 Absolute Maximum Ratings Thermal Information Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.1V All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VIN+0.3)V Thermal Resistance (Notes 1, 2) θJA (°C/W) θJC (°C/W) 3x3 DFN Package . . . . . . . . . . . . . . . . 50 10 Junction Temperature Range . . . . . . . . . . . . . . . . .-40°C to +125°C Operating Temperature Range . . . . . . . . . . . . . . . . .-40°C to +85°C Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C Recommended Operating Conditions Ambient Temperature Range (TA) . . . . . . . . . . . . . . .-40°C to +85°C Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3 to 6.5V CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 2. θJC, “case temperature” location is at the center of the exposed metal pad on the package underside. See Tech Brief TB379. Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature range of the device as follows: TA = -40°C to +85°C; VIN = (VO+0.5V) to 6.5V with a minimum VIN of 2.3V; CIN = 1µF; CO = 1µF; CBYP = 0.01µF; CPOR = 0.01µF PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS 6.5 V DC CHARACTERISTICS Supply Voltage VIN Ground Current 2.3 Quiescent condition: IO1 = 0µA; IO2 = 0µA IDD1 One LDO active 25 40 µA IDD2 Both LDO active 45 60 µA Shutdown Current IDDS @25°C 0.1 1.0 µA UVLO Threshold VUV+ 1.9 2.1 2.3 V 1.6 1.8 VUVRegulation Voltage Accuracy Variation from nominal voltage output, VIN = VO+0.5 to 5.5V, TJ = -40°C to 125°C -1.8 Line Regulation VIN = (VOUT + 1.0V relative to highest output voltage) to 5.5V -0.2 Load Regulation IOUT = 100µA to 150mA (VO1 and VO2) 2.0 V +1.8 % 0 0.2 %/V 0.1 0.7 % IOUT = 100µA to 300mA (VO2) Maximum Output Current IMAX Internal Current Limit Thermal Shutdown Temperature % 150 mA VO2: Continuous 300 mA ILIM Dropout Voltage (Note 4) 1.0 VO1: Continuous 350 475 600 mA VDO1 IO = 150mA; VO > 2.1V (VO1) 125 200 mV VDO2 IO = 300mA; VO < 2.5V (VO2) 300 500 mV VDO3 IO = 300mA; 2.5V ≤ VO ≤ 2.8V (VO2) 250 400 mV VDO4 IO = 300mA; VO > 2.8V (VO2) 200 325 mV TSD+ 145 °C TSD- 110 °C @ 1kHz 70 dB @ 10kHz 55 dB @ 100kHz 40 dB IO = 100µA, VO = 1.5V, TA = 25°C, CBYP = 0.1µF BW = 10Hz to 100kHz (Note 3) 30 µVrms AC CHARACTERISTICS Ripple Rejection IO = 10mA, VIN = 2.8V(min), VO = 1.8V, CBYP = 0.1µF Output Noise Voltage 3 FN9220.0 September 27, 2005 ISL9012 Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature range of the device as follows: TA = -40°C to +85°C; VIN = (VO+0.5V) to 6.5V with a minimum VIN of 2.3V; CIN = 1µF; CO = 1µF; CBYP = 0.01µF; CPOR = 0.01µF (Continued) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS DEVICE START-UP CHARACTERISTICS Device Enable TIme LDO Soft-start Ramp Rate TEN Time from assertion of the ENx pin to when the output voltage reaches 95% of the VO(nom) 250 500 µs TSSR Slope of linear portion of LDO output voltage ramp during startup 30 60 µs/V EN1, EN2 PIN CHARACTERISTICS Input Low Voltage VIL -0.3 0.5 V Input High Voltage VIH 1.4 VIN+0.3 V 0.1 µA Input Leakage Current IIL, IIH Pin Capacitance CPIN Informative 5 pF POR PIN CHARACTERISTICS POR Thresholds VPOR+ As a percentage of nominal output voltage VPORPOR Delay TPLH CPOR = 0.01µF 91 94 97 % 87 90 93 % 100 200 300 ms TPHL POR Pin Output Low Voltage VOL POR Pin Internal Pull-up Resistance µs 25 @IOL = 1.0mA RPOR 78 100 0.2 V 130 kΩ NOTES: 3. Guaranteed by design and characterization. 4. VOx = 0.98 * VOx(NOM); Valid for VOx greater than 1.85V. EN2 TEN VPOR+ VPOR- VPOR+ VPOR- <tPHL VO2 tPLH tPHL POR FIGURE 1. TIMING PARAMETER DEFINITION 4 FN9220.0 September 27, 2005 ISL9012 Typical Performance Curves 0.10 0.8 VO = 3.3V ILOAD = 0mA 0.4 0.2 -40°C 0.0 25°C -0.2 85°C -0.4 VIN = 3.8V VO = 3.3V 0.08 OUTPUT VOLTAGE CHANGE (%) OUTPUT VOLTAGE, VO (%) 0.6 -0.6 0.06 0.04 -40°C 0.02 25°C 0.00 -0.02 85°C -0.04 -0.06 -0.08 -0.8 3.4 3.8 4.6 4.2 5.0 5.4 5.8 6.2 -0.10 6.6 0 50 200 250 300 350 400 LOAD CURRENT - IO (mA) FIGURE 2. OUTPUT VOLTAGE vs INPUT VOLTAGE (3.3V OUTPUT) FIGURE 3. OUTPUT VOLTAGE CHANGE vs LOAD CURRENT 3.4 0.10 VIN = 3.8V VO = 3.3V ILOAD = 0mA 0.08 0.06 0.04 0.02 0.00 -0.02 -0.04 -0.06 VO1 = 3.3V IO = 0mA 3.3 OUTPUT VOLTAGE, VO (V) OUTPUT VOLTAGE CHANGE (%) 150 100 INPUT VOLTAGE (V) 3.2 IO = 150mA 3.1 3.0 2.9 -0.08 2.8 -0.10 -40 -25 -10 5 20 35 50 65 TEMPERATURE (°C) 80 95 110 125 FIGURE 4. OUTPUT VOLTAGE CHANGE vs TEMPERATURE DROPOUT VOLTAGE, VDO (mV) OUTPUT VOLTAGE, VO (V) 5.1 5.6 6.1 6.5 300 IO = 150mA 2.6 IO = 300mA 2.5 2.4 3.1 4.6 350 VO2 = 2.8V 2.7 2.6 4.1 FIGURE 5. OUTPUT VOLTAGE vs INPUT VOLTAGE (VO1 = 3.3V) 2.8 2.3 3.6 INPUT VOLTAGE (V) 2.9 IO = 0mA 3.1 3.6 4.1 4.6 5.1 5.6 INPUT VOLTAGE (V) FIGURE 6. OUTPUT VOLTAGE vs INPUT VOLTAGE (VO2 = 2.8V) 5 6.1 6.5 250 VO2 = 2.8V 200 150 100 VO1 = 3.3V 50 0 0 50 100 150 200 250 OUTPUT LOAD (mA) 300 350 400 FIGURE 7. VO1 DROPOUT VOLTAGE vs LOAD CURRENT FN9220.0 September 27, 2005 ISL9012 Typical Performance Curves (Continued) 55 175 50 GROUND CURRENT (µA) DROPOUT VOLTAGE, VDO (mV) VO1 = 3.3V 150 125 85°C 25°C -40°C 100 75 50 125°C 25°C 45 -40°C 40 35 VO1 = 3.3V VO2 = 2.8V 30 25 IO(BOTH CHANNELS) = 0µA 0 25 0 25 50 75 100 125 OUTPUT LOAD (mA) 150 175 200 3.0 4.0 3.5 4.58 5.0 5.5 6.5 6.0 INPUT VOLTAGE (V) FIGURE 8. VO1 DROPOUT VOLTAGE vs LOAD CURRENT FIGURE 9. GROUND CURRENT vs INPUT VOLTAGE 55 200 180 50 140 25°C 85°C 120 GROUND CURRENT (µA) GROUND CURRENT (µA) 160 -40°C 100 80 60 40 VIN = 3.8V VO1 = 3.3V VO2 = 2.8V 20 0 0 50 100 150 200 250 300 350 45 40 35 VIN = 3.8V VO = 3.3V ILOAD = 0µA 30 BOTH OUTPUTS ON 25 -40 400 -25 -10 5 LOAD CURRENT (mA) VIN VO1 IL2 = 300mA 2.5 3 2 95 110 125 VO1 = 3.3V VO2 = 2.8V IL1 = 150mA 3.0 VOLTAGE (V) VOLTAGE (V) 3.5 VO1 = 3.3V VO2 = 2.8V IL1 = 150mA 4 80 FIGURE 11. GROUND CURRENT vs TEMPERATURE FIGURE 10. GROUND CURRENT vs LOAD 5 20 35 50 65 TEMPERATURE (°C) VO2 1 0 POR IL2 = 300mA CPOR = 0.1µF 2.0 VO-1 1.5 VO-2 1.0 0.5 0 0 1 2 3 4 5 6 TIME (s) 7 8 FIGURE 12. POWER-UP/POWER-DOWN 6 9 10 0 0.5 1.0 1.5 2.0 2.5 3.0 TIME (s) 3.5 4.0 4.5 5.0 FIGURE 13. POWER-UP/POWER-DOWN WITH POR SIGNALS FN9220.0 September 27, 2005 ISL9012 Typical Performance Curves (Continued) VO2 (10mV/DIV) VO = 3.3V ILOAD = 150mA 2 VO1 (V) CLOAD = 1µF CBYP = 0.01µF VIN = 5.0V VO1 = 3.3V VO2 = 2.8V IL1 = 150mA IL2 = 300mA CL1, CL2 = 1µF CBYP = 0.01µF 3 1 4.3V 3.6V 0 VEN (V) 5 10mV/DIV 0 0 100 200 300 400 500 600 700 800 900 1000 400µs/DIV TIME (µs) FIGURE 14. TURN ON/TURN OFF RESPONSE FIGURE 15. LINE TRANSIENT RESPONSE, 3.3V OUTPUT VO = 2.8V ILOAD = 300mA CLOAD = 1µF CBYP = 0.01µF VO (25mV/DIV) 4.2V 3.5V VO = 1.8V VIN = 2.8V 300mA 10mV/DIV ILOAD 100µA 100µs/DIV 400µs/DIV FIGURE 17. LOAD TRANSIENT RESPONSE FIGURE 16. LINE TRANSIENT RESPONSE, 2.8V OUTPUT 100 1000 90 80 CBYP = 0.01µF 70 PSRR (dB) SPECTRAL NOISE DENSITY (nV/√Hz) VIN = 3.6V VO = 1.8V IO = 10mA CLOAD = 1µF 60 50 40 30 20 10 0 0.1 1 10 100 FREQUENCY (kHz) FIGURE 18. PSRR vs FREQUENCY 7 1000 100 10 1 VIN = 3.6V VO = 1.8V ILOAD = 10mA CBYP = 0.01µF CIN = 1µF CLOAD = 1µF 0.1 10 100 1K 10K FREQUENCY (Hz) 100K 1M FIGURE 19. SPECTRAL NOISE DENSITY vs FREQUENCY FN9220.0 September 27, 2005 ISL9012 Pin Description PIN # PIN NAME TYPE 1 VIN Analog I/O 2 EN1 Low Voltage Compatible CMOS Input LDO-1 Enable. 3 EN2 Low Voltage Compatible CMOS Input LDO-2 Enable. 4 CBYP Analog I/O Reference Bypass Capacitor Pin: Optionally connect capacitor of value 0.01µF to 1µF between this pin and GND to tune in the desired noise and PSRR performance. 5 CPOR Analog I/O POR Delay Setting Capacitor Pin: Connect a capacitor between this pin and GND to delay the POR output release after LDO-2 output reaches 94% of its specified voltage level (200ms delay per 0.01µF). 6 GND Ground 7 NC NC 8 POR Open Drain Output (1mA) 9 VO2 Analog I/O LDO-2 Output: Connect capacitor of value 1µF to 10µF to GND (1µF recommended). 10 VO1 Analog I/O LDO-1 Output: Connect capacitor of value 1µF to 10µF to GND (1µF recommended). DESCRIPTION Supply Voltage / LDO Input: Connect a 1µF capacitor to GND. GND is the connection to system ground. Connect to PCB Ground plane. No Connection. Open-drain POR Output for LDO-2 (active-low). Typical Application R1 ISL9012 VIN (2.3-6.5V) 1 ON 2 Enable 1 OFF ON Enable 2 OFF 3 4 5 C1 C2 VIN EN1 EN2 VO1 VO2 POR CBYP NC CPOR GND C3 10 Vout 1 9 Vout 2 Vout 2 OK 8 7 Vout2 too low RESET (200ms delay, C3=0.01µF) 6 C4 C5 C1, C4, C5: 1µF X5R ceramic capacitor C2: 0.01µF X5R ceramic capacitor C3: 0.01µF X5R ceramic capacitor R1: 100kΩ resistor, 5% 8 FN9220.0 September 27, 2005 ISL9012 Block Diagram VIN IS2 1V LDO VREF ERROR TRIM VO2 AMPLIFIER VO1 QEN2 ~1.0V VO2 POR COMPARATOR VOK2 POR LDO-2 EN1 QEN2 QEN1 IS2 IS1 LDO-1 CONTROL LOGIC EN2 UVLO GND BANDGAP AND TEMPERATURE SENSOR VOK2 VOLTAGE REFERENCE GENERATOR CBYP Functional Description The ISL9012 contains all circuitry required to implement two high performance LDO’s. High performance is achieved through a circuit that delivers fast transient response to varying load conditions. In a quiescent condition, the ISL9012 adjusts its biasing to achieve the lowest standby current consumption. The device also integrates current limit protection, smart thermal shutdown protection, staged turn-on and soft-start. Smart Thermal shutdown protects the device against overheating. Staged turn-on and soft-start minimize start-up input current surges without causing excessive device turnon time. Power Control The ISL9012 has two separate enable pins, EN1 and EN2, to individually control power to each of the LDO outputs. When both EN1 and EN2 are low, the device is in shutdown 9 POR DELAY POR 1.00V 0.94V 0.90V CPOR mode. During this condition, all on-chip circuits are off, and the device draws minimum current, typically less than 0.1µA. When one or both of the enable pins are asserted, the device first polls the output of the UVLO detector to ensure that VIN voltage is at least about 2.1V. Once verified, the device initiates a start-up sequence. During the start-up sequence, trim settings are first read and latched. Then, sequentially, the bandgap, reference voltage and current generation circuitry power up. Once the references are stable, a fast-start circuit quickly charges the external reference bypass capacitor (connected to the CBYP pin) to the proper operating voltage. After the bypass capacitor has been charged, the LDO’s power up. If EN1 is brought high, and EN2 is goes high before the VO1 output stablizes, the ISL9012 delays the VO2 turn-on until the VO1 output reaches its target level. This minimizes input current surge due to concurrent turn-on. FN9220.0 September 27, 2005 ISL9012 If EN2 is brought high, and EN1 goes high before the VO2 output stablizes, the ISL9012 delays the VO1 turn-on until the VO2 output reaches its target level. If both EN1 and EN2 are high, the VO1 output has priority, and is always powered up first. During operation, whenever the VIN voltage drops below about 1.8V, the ISL9012 immediately disables both LDO outputs. When VIN rises back above 2.1V, the device reinitiates its start-up sequence and LDO operation will resume automatically. Reference Generation The reference generation circuitry includes a trimmed bandgap, a trimmed voltage reference divider, a trimmed current reference generator, and an RC noise filter. The filter includes the external capacitor connected to the CBYP pin. A 0.01µF capacitor connected CBYP implements a 100Hz lowpass filter, and is recommended for most high performance applications. For the lowest noise application, a 0.1µF or greater CBYP capacitor should be used. This filters the reference noise to below the 10Hz – 1kHz frequency band, which is crucial in many noise-sensitive applications. The bandgap generates a zero temperature coefficient (TC) voltage for the reference divider. The reference divider provides the regulation reference, POR detection thresholds, and other voltage references required for current generation and over-temperature detection. The current generator outputs references required for adaptive biasing as well as references for LDO output current limit and thermal shutdown determination. LDO Regulation and Programmable Output Divider The LDO Regulator is implemented with a high-gain operational amplifier driving a PMOS pass transistor. The design of the ISL9012 provides a regulator that has low quiescent current, fast transient response, and overall stability across all operating and load current conditions. LDO stability is guaranteed for a 1µF to 10µF output capacitor that has a tolerance better than 20% and ESR less than 200mΩ. The design is performance-optimized for a 1µF capacitor. Unless limited by the application, use of an output capacitor value above 4.7µF is not recommended as LDO performance improvement is minimal. Power On Reset Generation LDO-2 has a Power-on Reset signal generation circuit which outputs to the POR pin. The POR signal is generated as follows: A POR comparator continuously monitors the voltage of the LDO-2 output. The LDO enters a power-good state when the output voltage is above 94% of the expected output voltage for a period exceeding the LDO PGOOD entry delay time. In the power-good state, the open-drain POR output is in a high-impedance state. An external resistor can be added between the POR output and either LDO output or the input voltage, VIN. The power-good state is exited when the LDO-2 output falls below 90% of the expected output voltage for a period longer than the PGOOD exit delay time. While power-good is false, the ISL9012 pulls the respective POR pin low. The PGOOD entry and exit delays are determined by the value of the external capacitor connected to the CPOR pin. For a 0.01µF capacitor, the entry and exit delays are 200ms and 25µs respectively. Larger or smaller capacitor values will yield proportionately longer or shorter delay times. The POR exit delay should never be allowed to be less than 10µs to ensure sufficient immunity against transient induced false POR triggering. Overheat Detection The bandgap outputs a proportional-to-temperature current that is indicative of the temperature of the silicon. This current is compared with references to determine if the device is in danger of damage due to overheating. When the die temperature reaches about 145°C, one or both of the LDO’s momentarily shut down until the die cools sufficiently. In the overheat condition, only the LDO sourcing more than 50mA will be shut off. This does not affect the operation of the other LDO. If both LDOs source more than 50mA and an overheat condition occurs, both LDO outputs are disabled. Once the die temperature falls back below about 110°C, the disabled LDO(s) are re-enabled and soft-start automatically takes place. Soft-start circuitry integrated into each LDO limits the initial ramp-up rate to about 30µs/V to minimize current surge. The ISL9012 provides short-circuit protection by limiting the output current to about 475mA. Each LDO uses an independently trimmed 1V reference. An internal resistor divider drops the LDO output voltage down to 1V. This is compared to the 1V reference for regulation. The resistor division ratio is programmed in the factory to one of the following output voltages: 1.5V, 1.8V, 1.85, 2.5V, 2.6, 2.7, 2.8V, 2.85V, 2.9, 3.0, and 3.3V. 10 FN9220.0 September 27, 2005 ISL9012 Dual Flat No-Lead Plastic Package (DFN) L10.3x3C 2X 10 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE 0.15 C A A D MILLIMETERS 2X 0.15 C B E SYMBOL MIN 0.80 0.90 1.00 - - - 0.05 - 0.20 REF 0.18 D D2 B A C SEATING PLANE D2 6 INDEX AREA 0.08 C A3 SIDE VIEW (DATUM B) 0.10 C 7 8 2.48 7, 8 - 3.00 BSC 1.49 e 1.64 1.74 7, 8 0.50 BSC - k 0.20 - - - L 0.30 0.40 0.50 8 N 10 2 Nd 5 3 2. N is the number of terminals. NX k 3. Nd refers to the number of terminals on D. 4. All dimensions are in millimeters. Angles are in degrees. E2 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. E2/2 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. NX L N-1 NX b e (Nd-1)Xe REF. BOTTOM VIEW 5 0.10 M C A B 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. 9. COMPLIANT TO JEDEC MO-229-WEED-3 except for dimensions E2 & D2. CL NX (b) 2.38 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. (DATUM A) 8 5, 8 NOTES: 2 N 0.30 Rev. 0 3/05 D2/2 1 E2 0.25 - 3.00 BSC 2.23 E // NOTES A b TOP VIEW MAX A1 A3 6 INDEX AREA NOMINAL (A1) 9 L 5 e SECTION "C-C" C C TERMINAL TIP FOR ODD TERMINAL/SIDE All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 11 FN9220.0 September 27, 2005