STK5U4UCE0D-E Product Preview 50A/600V Intelligent Power Module in DIP package The STK5U4UCE0D-E is a fully-integrated inverter power module consisting of an independent gate driver, six IGBT’s and a thermistor, suitable for driving permanent magnet synchronous (PMSM) motors, brushless DC (BLDC) motors and AC asynchronous motors. The IGBT’s are configured in a 3-phase bridge with separate emitter connections for the lower legs for maximum flexibility in the choice of control algorithm. The power stage has under-voltage lockout protection (UVP) and desaturation protection (DESATP) with a fault detection output flag. Internal boost diodes are provided for high side gate boost drive. www.onsemi.com PACKAGE PICTURE Features Three-phase 50A/600V IGBT module with independent drivers. Negative logic interface. Built-in under-voltage protection (UVP) and VCE desaturation Protection (DESATP) with a fault detection output flag. Integrated bootstrap diodes and resistors. Separate low-side IGBT emitter connections for individual current sensing of each phase Thermistor. MARKING DIAGRAM Typical Applications 1 Industrial Drives Industrial Pumps Industrial Fans Industrial Automation VDW HINW FoW GNDW Gate Driver with desaturation detection 3x Gate Driver with desaturation detection Desat VH W V UH VH WH UL VL WL WH Desat WH ORDERING INFORMATION UL VL WL Desat UL Desat VL Desat WL Device STK5U4UCE0D-E TH2 VDN LINU LINV LINW FoN GND STK5U4UCE0D = Specific Device Code A = Year B = Month C = Production Site DD = Factory Lot Code VH Package TBD Shipping (Qty / Packing) TBD NW Gate Driver with desaturation detection 33 Desat UH NV VDV HINV FoV GNDV 64 UH NU Gate Driver with desaturation detection U STK5U4UCE0D TH1 VDU HINU FoU GNDU 32 ABCDD VP Figure 1. Functional Diagram This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. © Semiconductor Components Industries, LLC, 2016 April 2016 - Rev. P1 1 Publication Order Number: STK5U4UCE0D-E/D STK5U4UCE0D-E VDU VP FoU Interface Circuit (see detail) + CS Gate Driver with Desaturation Cbulk Protection HINU GNDU U VDV FoV Gate Driver with Desaturation Interface Circuit (see detail) Protection HINV GNDV V Motor VDW FoW Gate Driver with Desaturation Protection Interface Circuit (see detail) HINW GNDW W VDN MCU GND Interface Circuit (see detail) LINU Gate Driver with Desaturation Protection NU Interface Circuit (see detail) LINV Gate Driver with Desaturation Protection NV LINW Gate Driver with Desaturation Interface Circuit (see detail) Protection FoN NW TH1 Sensing, isolation TH2 To op-amp circuit Sample interface circuit detail VDx To DESAT circuit MCU Fox HINx /LINx To IGBT Gate drive GNDx GND Figure 2. Application Schematic www.onsemi.com 2 STK5U4UCE0D-E VDU (29) VP (33,34,35) FoU (31) HINU (30) Gate Driver With Desaturation Protection GNDU (32) U (39,40,41) VDV (22) FoV (24) HINV (23) Gate Driver With Desaturation Protection GNDV (25) V (45,46,47) VDW (15) FoW (17) HINW (16) Gate Driver With Desaturation Protection GNDW (18) W (51,52,53) VDN (10) GND (11) LINU (8) Gate Driver With Desaturation Protection NU (57,58) LINV (7) Gate Driver With Desaturation Protection NV (60,61) FoN (5) LINW (6) Gate Driver With Desaturation Protection NW (63,64) TH1 (3) TH2 (2) Figure 3. Equivalent Block Diagram www.onsemi.com 3 STK5U4UCE0D-E PIN FUNCTION DESCRIPTION Pin 2 3 5 6 7 8 10 11 15 16 17 18 22 23 24 25 29 30 31 32 33,34,35 39,40,41 45,46,47 51,52,53 57,58 60,61 63,64 Name TH1 TH2 FoN LINW LINV LINU VDN GND VDW HINW FoW GNDW VDV HINV FoV GNDV VDU HINU FoU GNDU VP U V W NU NV NW Description Thermistor connection Thermistor connection Fault output low side Logic Input Low Side Gate Driver - Phase W Logic Input Low Side Gate Driver - Phase V Logic Input Low Side Gate Driver - Phase U Control power supply low side Control power GND low side Control power supply high side – Phase W Logic input high side – Phase W Fault output high side – Phase W Control power GND high side – Phase W Control power supply high side – Phase V Logic input high side – Phase V Fault output high side – Phase V Control power GND high side – Phase V Control power supply high side – Phase U Logic input high side – Phase U Fault output high side – Phase U Control power GND high side – Phase U Positive Bus Input Voltage U Phase Output V Phase Output W Phase Output Low Side Emitter Connection - Phase U Low Side Emitter Connection - Phase V Low Side Emitter Connection - Phase W Note : Pins 1, 4, 9, 12, 13, 14, 19, 20, 21, 26, 27, 28, 36, 37, 38, 42, 43, 44, 48, 49, 50, 54, 55, 56, 59, and 62 are not present www.onsemi.com 4 STK5U4UCE0D-E ABSOLUTE MAXIMUM RATINGS at Tc= 25°C (Notes 1,2) Rating Symbol Conditions Value Unit 450 V VP to U,V,W; U to NU, V to NV, W to NW 600 V VD1,2,3,4 = between 13.5V and 16.5V, Tj ≤ 150°C, up to “tdesatbl”, non-repetitive 400 V ±50 A ±100 A 0.3 to VD V 0.3 to VD V 0.3 to VD V Supply voltage VCC VP to NU,NV,NW, surge < 400V Collector-emitter voltage Self-protection supply voltage limit (DESATP capability) Output current VCE VCC(SC) Output peak current Iop Gate driver supply voltages VD1, 2,3,4 Input signal voltage VIN FAULT terminal voltage VFo Fault output IFo Maximum power dissipation Pd IGBT per channel TBD W Junction temperature Tj IGBT, FRD 150 C Storage temperature Tstg 40 to +125 C Operating case temperature Tc Io Package mounting torque Isolation voltage 1. 2. 3. 4. VP,NU,NV,NW,U,V,W terminal current VP,NU,NV,NW,U,V,W terminal current pulse width 1ms VDU to GNDU, VDV to GNDV, VDW to GNDW, VDN to GND (Note 4) HINU to GNDU, HINV to GNDV, HINW to GNDW, LINU / LINV / LINW to GND FoU to GNDU, FoV to GNDV, FoW to GNDW, FoN to GND FoU, FoV, FoW, FoN Source current 25 FoU, FoV, FoW, FoN Sink current mA 10 IPM case temperature Case mounting screw M4 Vis (Note 3) 40 to +100 C 1.17 Nm 2500 Vrms (Note 4) 50Hz sine wave AC 1 minute Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe Operating parameters. This surge voltage developed by the switching operation due to the wiring inductance between VP and NU(NV,NW) terminal. Flatness tolerance of the heatsink should be within 50m to +100m. RECOMMENDED OPERATING RANGES (Note 5) Rating Supply voltage Gate driver supply voltage Symbol VCC VD1,2,3 VD4 ON-state input voltage VIN(ON) OFF-state input voltage VIN(OFF) PWM frequency fPWM Conditions VP to NU, NV, NW VDU to GNDU; VDV to GNDV; VDW to GNDW VDD to GND HINU to GNDU, HINV to GNDV, HINW to GNDW, LINU / LINV / LINW to GND Min Typ 0 Max Unit 400 V V 12.6 15 17.5 13.5 15 16.5 V 0 - 0.7 V 3.3 - 15 V 1 - 20 kHz μs Dead time DT Turn-off to turn-on (external) 2 - - Allowable input pulse width PWIN ON and OFF 1 - - μs 0.79 - 1.17 Nm Package mounting torque 5. M4 type screw Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 5 STK5U4UCE0D-E ELECTRICAL CHARACTERISTICS (Note 6) at Tc=25C, VD1, VD2, VD3, VD4=15V Parameter Test Conditions Symbol Min Typ Max Unit - - 1 mA - (1.7) TBD V - (1.8) - V - (1.9) TBD V - (2.1) - V Power output section Collector-emitter leakage current Collector to emitter saturation voltage Diode forward voltage Junction to case thermal resistance Switching time VCE = 600V ICE Ic = 50A, Tj = 25C VCE(SAT) Ic = 50A, Tj = 100C IF = 50A, Tj = 25C VF IF = 50A, Tj = 100C IGBT θj-c(T) - (0.69) TBD C/W FWD θj-c(D) - (1.06) TBD C/W tON - (0.4) - μs Ic = 50A, VCC = 300V, Tj = 25°C tOFF - (0.8) - μs EON - (2.3) - mJ EOFF - (1.4) - mJ Total switching loss ETOT - (3.7) - mJ Turn-on switching loss EON - (2.5) - mJ EOFF - (1.5) - mJ ETOT - (4.0) - mJ EREC - (0.05) - mJ trr - (0.2) - μs - 8 17 mA - 24 51 mA Turn-on switching loss Turn-off switching loss Turn-off switching loss Ic = 50A, VCC = 300V, Tj = 25°C Ic = 50A, VCC = 300V, Tj = 100°C Total switching loss Diode reverse recovery energy Diode reverse recovery time Ic = 50A, VCC = 300V, Tj = 100°C (di/dt set by internal driver) Driver Section Gate driver power dissipation High level Input voltage VD1, 2, 3 = 15V ID VD4 = 15V VIN H 3.2 - - V Low level Input voltage HINU to GNDU, HINV to GNDV, HINW to GNDW, LINU / LINV / LINW to GND VIN L - - 1.2 V Logic 1 input current VIN = 3.0V IIN+ - - 500 μA Logic 0 input current VIN = 1.2V IIN- - - 100 μA FoU, FoV, FoW, FoN Sink: 5mA VFL - 0.2 1.0 V FoU, FoV, FoW, FoN Source: 20mA VFH 12 13.3 - V - 2 - μs VDUVP+ 11.3 12.0 12.6 V VDUVP- 10.4 11.0 11.7 V FAULT terminal output voltage Desaturation protection blanking time tdeasatbl VD supply undervoltage positive going input threshold VD supply undervoltage negative going input threshold Bootstrap diode reverse current VR(BD) = 600V IR(BD) - - 1 mA Bootstrap diode forward voltage IF(BD) = 0.1A Including voltage drop by resistor VF(BD) - (2.3) - V RB - 15 - Ω Bootstrap current controlling resistor 6. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 6 STK5U4UCE0D-E APPLICATIONS INFORMATION Logic and Protection Timing Chart DESAT protection reset signal /VIN OFF ON VD undervoltage protection reset voltage VD* Output Current OFF ON VDESAT threshold Internal DESAT Voltage Desaturation blanking time Fault output Figure 4. Logic and Protection Timing Chart Notes 1. 2. 3. The VD supply under voltage protection protects the module when the pre-driver supply voltage falls due to an operating malfunction. It will typically start up at 12 V (typical). The UVP circuit has typically 1.0 V of hysteresis and will disable the output if the supply voltage falls below 11 V (typical). The driver power supply low voltage protection turns off the gate and will automatically reset when recovering to normal voltage. It does not depend on input signal voltage. The three high-side and three low-side gate driver ICs have their own separate under-voltage shutdown protection which functions independently of the other phases. For the low-side drivers, there is one combined fault output; it is therefore not possible to determine which output has caused the desaturation fault. The fault condition is cleared as soon as the input signal is set HIGH (off state, negative logic levels). When using the over-current protection with an external shunt resistor, please set the current protection level to be less than or equal to the peak output current rating (Iop). Input / Output Logic Table IGBT output Protected Operation High side - U High side - V High side - W Low side - U Low side - V Low side - W UVP DESATP UVP DESATP UVP DESATP UVP DESATP UVP DESATP UVP DESATP High side Fault output Low side High side U V W U V W U V W Low side OFF OFF - OFF OFF - OFF OFF - OFF OFF OFF OFF - OFF OFF OFF OFF - OFF OFF OFF OFF Low High Low Low Low Low Low Low Low Low Low Low Low Low Low High Low Low Low Low Low Low Low Low Low Low Low Low Low High Low Low Low Low Low Low Low Low Low Low Low Low Low High Low High Low High *) - (hyphen) follows the actual input signals using negative logic (e.g. LINU = LOW turns on the low-side U phase IGBT). www.onsemi.com 7 STK5U4UCE0D-E Thermistor characteristics Symbol Condition Min Typ. Max Unit Resistance Parameter R25 Tc = 25C Resistance R100 Tc = 100C B-Constant (25-50C) - B Temperature range - - 97 5.07 4208 40 100 5.38 4250 - 103 5.71 4293 +125 kΩ kΩ K C Thermistor resistance Rt versus Case temperature Tc Thermistor resistance Rt [kΩ] 10000 1000 min typ max 100 10 1 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 Case temperature Tc [C] Figure 5. Thermistor Resistance versus Case Temperature www.onsemi.com 8 STK5U4UCE0D-E verified prior to production. When not using the bootstrap circuit, each high side driver power supply requires an external independent floating power supply. If the selected capacitance is more than 47μF (±20%), connect a resistor (about 40Ω) in series between each 3-phase upper side power supply terminals (VDU, VDV. VDW) and each bootstrap capacitor. When not using the bootstrap circuit, each upper side gate driver power supply requires an external independent floating power supply. Also we recommend adopting safety measures such as using Zener diodes for surge absorption or low impedance capacitors around each power supply terminal to suppress voltage transients. Under-voltage lockout (UVLO) If VDx goes below the VDx supply under-voltage negative going input threshold, the IGBT gate drives will be turned off. If VDx rises above the positive going input threshold, the IGBT gate drivers will return to normal operation. The FoX signal outputs stay low during the UVLO protection state. The UVLO protection does not depend on input signal voltage. Desaturation Protection function (DESATP) The Desaturation Protection function (DESATP) is implemented by comparing the voltage between the collector and the emitter of IGBT with an internal reference of 6.5V (typ). If a short circuit occurs after the IGBT is turned on and saturated, there will be a delay while the blanking capacitor is charged from the VCE(sat) level of the IGBT to the trip voltage of the comparator. If the collector voltage exceeds the trip level, a DESATP fault is triggered and the FoX signal (FoU, FoV, FoW, FoN) is set HIGH. The fault condition is cleared after the input signal is set to inactive (HIGH due to negative logic on input). Additional protection against abnormal current levels such as a protection circuit using external shunt resistors, and a fuse on the input voltage line is strongly recommended. CB value calculation for bootstrap circuit Calculate condition Item Symbol High-side power supply. VBS Total gate charge of output Qg power IGBT at 15V. High-side power supply low UDUVvoltage protection. High-side power dissipation. IDmax ON time required for CB voltage to fall from 15V to Ton-max UVLO Capacitors on High Voltage and VD supplies Both the high voltage and VDD supplies require an electrolytic capacitor and an additional high frequency capacitor. Value Unit 15 V 310 nC 12 V 17 mA - s Capacitance calculation formula CB must not be discharged below to the upper limit of the UVLO - the maximum allowable on-time (Tonmax) of the upper side is calculated as follows: Disconnection of U, V and W terminals Disconnection of terminals U, V, or W during normal motor operation will cause damage to IPM, use caution with this connection. VBS * CB – Qg – IDmax * Ton-max = UVLO * CB CB = (Qg + IDmax * Ton-max) / (VBS – UVLO) Minimum input pulse width When input pulse width is less than 1μs, an output may not react to the pulse. (Both ON signal and OFF signal) CB is recommended to be approximately 3 times the value calculated above. The recommended value of CB is in the range of 1 to 47μF, however, the value needs to be verified prior to production. Layout The traces between the IPM terminals and each optocoupler must be as short as possible , and the stray capacitance between the primary and the secondary must be considered in order to select a layout pattern. It is essential that trace length between terminals in the snubber circuit be kept as short as possible to reduce the effect of surge voltages. Recommended value of “CS” is in the range of 0.1 to 10μF. This capacitor should be a high frequency capacitor. Boot strap capacitance CB [uF] 100 CB vs. Ton-max 10 Thermistor 1 0.1 Inside the IPM, a thermistor used as the temperature monitor for internal substrate is connected between “TH1” and “TH2”. The variation of thermistor resistance with temperature is shown in this datasheet. 0.01 0.01 0.1 1 Ton-max [ms] Figure 6. Bootstrap selection as a function of maximum ON time Dimensioning of bootstrap capacitor The module includes an internal bootstrap circuit requiring one bootstrap capacitor for each phase, each with a value CB. The recommended value of CB is in the range of 1 to 47μF, however, this value needs to be www.onsemi.com 9 10 STK5U4UCE0D-E Mounting Instructions Item Recommended Condition Pitch 67.8±0.1mm (Please refer to Package Outline Diagram) Screw diameter : M4 Bind machine screw, Truss machine screw, Pan machine screw Washer Plane washer The size is D:9mm, d:4.8mm and t:0.8mm JIS B 1256 Heat sink Torque Grease Material: Aluminum or Copper Warpage (the surface that contacts IPM ) : 50 to 100 μm Screw holes must be countersunk. No contamination on the heat sink surface that contacts IPM. Temporary tightening : 20 to 30 % of final tightening on first screw Temporary tightening : 20 to 30 % of final tightening on second screw Final tightening : 0.79 to 1.17Nm on first screw Final tightening : 0.79 to 1.17Nm on second screw Silicone grease. Thickness : 100 to 200 μm Uniformly apply silicon grease to whole back. Thermal foils are only recommended after careful evaluation. Thickness, stiffness and compressibility parameters have a strong influence on performance. Recommended Not recommended Figure 7. Module mounting details: components; washer drawing; need for even spreading of thermal grease www.onsemi.com 10 STK5U4UCE0D-E TYPICAL CHARACTERISTICS 120 TJ = 25°C 100 VD = 15V IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A) 120 VD = 17V VD = 13V 80 60 40 20 TJ = 100°C 100 VD = 17V 80 VD = 13V 60 40 20 0 0 0 0.5 1 1.5 2 2.5 VCE, COLLECTOR-EMITTER VOLTAGE (V) 0 3 0.5 1 1.5 2 2.5 VCE, COLLECTOR-EMITTER VOLTAGE (V) Figure 8. IC versus VCE for different VD STANDARDIZED SQUARE-WAVE PEAK R(t) IF, FORWARD CURRENT (A) 1 100 TJ = 25°C 80 TJ = 100°C 60 40 20 0 0 0.5 1 1.5 2 VF, FORWARD VOLTAGE (V) 2.5 3 0.1 0.01 0.001 0.00001 0.001 0.1 10 1000 ON-PULSE WIDTH (s) Figure 10. IF versus VF for different temperatures Figure 11. IGBT thermal impedance plot 400 1200 TJ = 100°C toff, SWITCHING TIME (ns) VCC = 300V VD = 15V 350 tON, SWITCHING TIME (ns) 3 Figure 9. IC versus VCE for different VD 120 300 TJ = 25°C 250 200 150 100 50 0 TJ = 100°C 1000 VCC = 300V VD = 15V 800 TJ = 25°C 600 400 200 0 0 10 20 30 40 IC, COLLECTOR CURRENT (A) 50 60 0 Figure 12. ton versus IC for different temperatures 10 20 30 40 IC, COLLECTOR CURRENT (A) 50 60 Figure 13. toff versus IC for different temperatures 3.0 1.6 VCC = 300V VD = 15V 2.5 Eoff, SWITCHING LOSS (mJ) EON, SWITCHING LOSS (mJ) VD = 15V TJ = 100°C 2.0 TJ = 25°C 1.5 1.0 0.5 0.0 VCC = 300V VD = 15V 1.4 1.2 TJ = 100°C 1.0 TJ = 25°C 0.8 0.6 0.4 0.2 0.0 0 10 20 30 40 IC, COLLECTOR CURRENT (A) 50 60 0 Figure 14. Eon versus IC for different temperatures 10 20 30 40 IC, COLLECTOR CURRENT (A) 50 Figure 15. Eoff versus IC for different temperatures www.onsemi.com 11 60 STK5U4UCE0D-E t:100ns/div t:100ns/div VCE: 100V/div Io:25A/div VCE: 100V/div Io:25A/div Figure 16. Turn-on waveform Tj=25°C, VCC=300V Figure 17. Turn-off waveform Tj=25°C, VCC=300V t:100ns/div t:100ns/div VCE: 100V/div Io:25A/div VCE: 100V/div Io:25A/div Figure 18. Turn-on waveform Tj=100°C, VCC=300V Figure 19. Turn-off waveform Tj=100°C, VCC=300V www.onsemi.com 12 STK5U4UCE0D-E PACKAGE DIMENSIONS unit : mm [TENTATIVE] Missing pin : 1, 4, 9, 12, 13, 14, 19, 20, 21, 26, 27, 28, 36, 37, 38, 42, 43, 44, 48, 49, 50, 54, 55, 56, 59, 62 to www.onsemi.com 13 STK5U4UCE0D-E ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf . SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. www.onsemi.com 14