CAV24C64 64-Kb I2C CMOS Serial EEPROM Description The CAV24C64 is a 64−Kb CMOS Serial EEPROM device, internally organized as 8192 words of 8 bits each. It features a 32−byte page write buffer and supports the Standard (100 kHz) and Fast (400 kHz) I2C protocol. External address pins make it possible to address up to eight CAV24C64 devices on the same bus. Features • • • • • • • • • • • • Automotive Temperature Grade 1 (−40°C to +125°C) Supports Standard and Fast I2C Protocol 2.5 V to 5.5 V Supply Voltage Range 32−Byte Page Write Buffer Hardware Write Protection for Entire Memory CAV Prefix for Automotive and Other Applications Requiring Site and Change Control Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs (SCL and SDA) Low Power CMOS Technology 1,000,000 Program/Erase Cycles 100 Year Data Retention SOIC, TSSOP 8−lead, and WLCSP 4−Ball Packages This Device is Pb−Free, Halogen Free/BFR Free, and RoHS Compliant www.onsemi.com SOIC−8 W SUFFIX CASE 751BD WLCSP−4 C4C SUFFIX CASE 567JY PIN CONFIGURATIONS (Top Views) 1 A0 A1 A2 VSS VCC WP SCL SDA SOIC (W), TSSOP (Y) 1 VCC A1 A2 VSS SCL B1 B2 SDA WLCSP (C4C) PIN FUNCTION VCC Pin Name A0, A1, A2 SCL CAV24C64 A2, A1, A0 TSSOP−8 Y SUFFIX CASE 948AL SDA WP Function Device Address Input SDA Serial Data Input/Output SCL Serial Clock Input WP Write Protect Input VCC Power Supply VSS Ground VSS Figure 1. Functional Symbol ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet. © Semiconductor Components Industries, LLC, 2016 February, 2016 − Rev. 2 1 Publication Order Number: CAV24C64/D CAV24C64 DEVICE MARKINGS (TSSOP−8) (WLCSP−4) C64F A Y M XXX G For the location of Pin 1, please consult the corresponding package drawing. A YM C64F AYMXXX G A Y M = Specific Device Code = Assembly Location = Production Year (Last Digit) = Production Month (1-9, O, N, D) = Last Three Digits of Assembly Lot Number = Pb−Free Package (SOIC−8) 24C64F AYMXXX G = Specific Device Code = Production Year (Last Digit) = Production Month (1−9, O, N, D) 24C64F A Y M XXX G = Specific Device Code = Assembly Location = Production Year (Last Digit) = Production Month (1-9, O, N, D) = Last Three Digits of Assembly Lot Number = Pb−Free Package Table 1. ABSOLUTE MAXIMUM RATINGS Parameters Ratings Units Storage Temperature –65 to +150 °C Voltage on Any Pin with Respect to Ground (Note 1) –0.5 to +6.5 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. During input transitions, voltage undershoot on any pin should not exceed −1 V for more than 20 ns. Voltage overshoot on pins A0, A1, A2 and WP should not exceed VCC + 1 V for more than 20 ns, while voltage on the I2C bus pins, SCL and SDA, should not exceed the absolute maximum ratings, irrespective of VCC. Table 2. RELIABILITY CHARACTERISTICS (Note 2) Symbol Parameter NEND (Note 3) TDR Endurance Min Units 1,000,000 Program/Erase Cycles 100 Years Data Retention 2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100 and JEDEC test methods. 3. Page Mode, VCC = 5 V, 25°C. Table 3. D.C. OPERATING CHARACTERISTICS (VCC = 2.5 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified.) Symbol Parameter Test Conditions Min Max Units ICCR Read Current Read, fSCL = 400 kHz 1 mA ICCW Write Current Write, fSCL = 400 kHz 2 mA 5 mA 2 mA −0.5 0.3 x VCC V A0, A1, A2 and WP 0.7 x VCC VCC + 0.5 V SCL and SDA 0.7 x VCC 5.5 ISB Standby Current All I/O Pins at GND or VCC IL I/O Pin Leakage Pin at GND or VCC VIL Input Low Voltage VIH Input High Voltage VOL Output Low Voltage TA = −40°C to +125°C VCC > 2.5 V, IOL = 3 mA 0.4 V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 2 CAV24C64 Table 4. PIN IMPEDANCE CHARACTERISTICS (VCC = 2.5 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified.) Parameter Symbol Conditions Max Units 8 pF CIN (Note 4) SDA I/O Pin Capacitance VIN = 0 V, TA = 25°C CIN (Note 4) Input Capacitance (other pins) VIN = 0 V, TA = 25°C 6 pF IWP (Note 5) WP Input Current VIN < VIH, VCC = 5.5 V 130 mA VIN < VIH, VCC = 3.3 V 120 VIN < VIH, VCC = 2.5 V 80 VIN > VIH 2 VIN < VIH, VCC = 5.5 V 50 VIN < VIH, VCC = 3.3 V 35 VIN < VIH, VCC = 2.5 V 25 VIN > VIH 2 IA (Note 5) Address Input Current (A0, A1, A2) Product Rev F mA 4. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100 and JEDEC test methods. 5. When not driven, the WP, A0, A1 and A2 pins are pulled down to GND internally. For improved noise immunity, the internal pull−down is relatively strong; therefore the external driver must be able to supply the pull−down current when attempting to drive the input HIGH. To conserve power, as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x VCC), the strong pull−down reverts to a weak current source. Table 5. A.C. CHARACTERISTICS (VCC = 2.5 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified.) (Note 6) Standard FSCL tHD:STA Min Parameter Symbol Clock Frequency Max Fast Min 100 START Condition Hold Time Max Units 400 kHz 4 0.6 ms tLOW Low Period of SCL Clock 4.7 1.3 ms tHIGH High Period of SCL Clock 4 0.6 ms 4.7 0.6 ms tSU:STA START Condition Setup Time tHD:DAT Data In Hold Time 0 0 ms tSU:DAT Data In Setup Time 250 100 ns tR SDA and SCL Rise Time 1000 300 ns tF (Note 6) SDA and SCL Fall Time 300 300 ns tSU:STO STOP Condition Setup Time tBUF Bus Free Time Between STOP and START tAA SCL Low to Data Out Valid tDH Data Out Hold Time Ti (Note 6) 4 0.6 ms 4.7 1.3 ms 3.5 100 Noise Pulse Filtered at SCL and SDA Inputs 0.9 100 100 ms ns 100 ns tSU:WP WP Setup Time 0 0 ms tHD:WP WP Hold Time 2.5 2.5 ms tWR tPU (Notes 7, 8) Write Cycle Time 5 5 ms Power−up to Ready Mode 1 1 ms 6. Test conditions according to “AC Test Conditions” table. 7. Tested initially and after a design or process change that affects this parameter. 8. tPU is the delay between the time VCC is stable and the device is ready to accept commands. Table 6. A.C. TEST CONDITIONS Input Levels 0.2 x VCC to 0.8 x VCC Input Rise and Fall Times ≤ 50 ns Input Reference Levels 0.3 x VCC, 0.7 x VCC Output Reference Levels 0.5 x VCC Output Load Current Source: IOL = 3 mA; CL = 100 pF www.onsemi.com 3 CAV24C64 I2C Bus Protocol Power-On Reset (POR) Each CAV24C64 incorporates Power-On Reset (POR) circuitry which protects the internal logic against powering up in the wrong state. The device will power up into Standby mode after VCC exceeds the POR trigger level and will power down into Reset mode when VCC drops below the POR trigger level. This bi-directional POR behavior protects the device against ‘brown-out’ failure following a temporary loss of power. The 2-wire I2C bus consists of two lines, SCL and SDA, connected to the VCC supply via pull-up resistors. The Master provides the clock to the SCL line, and either the Master or the Slaves drive the SDA line. A ‘0’ is transmitted by pulling a line LOW and a ‘1’ by letting it stay HIGH. Data transfer may be initiated only when the bus is not busy (see A.C. Characteristics). During data transfer, SDA must remain stable while SCL is HIGH. START/STOP Condition Pin Description SCL: The Serial Clock input pin accepts the clock signal generated by the Master. SDA: The Serial Data I/O pin accepts input data and delivers output data. In transmit mode, this pin is open drain. Data is acquired on the positive edge, and is delivered on the negative edge of SCL. A0, A1 and A2: The Address inputs set the device address that must be matched by the corresponding Slave address bits. The Address inputs are hard-wired HIGH or LOW allowing for up to eight devices to be used (cascaded) on the same bus. When left floating, these pins are pulled LOW internally. WP: When pulled HIGH, the Write Protect input pin inhibits all write operations. When left floating, this pin is pulled LOW internally. An SDA transition while SCL is HIGH creates a START or STOP condition (Figure 2). The START consists of a HIGH to LOW SDA transition, while SCL is HIGH. Absent the START, a Slave will not respond to the Master. The STOP completes all commands, and consists of a LOW to HIGH SDA transition, while SCL is HIGH. Device Addressing The Master addresses a Slave by creating a START condition and then broadcasting an 8-bit Slave address. For the CAV24C64, the first four bits of the Slave address are set to 1010 (Ah); the next three bits, A2, A1 and A0, must match the logic state of the similarly named input pins. The R/W bit tells the Slave whether the Master intends to read (1) or write (0) data (Figure 3). Acknowledge During the 9th clock cycle following every byte sent to the bus, the transmitter releases the SDA line, allowing the receiver to respond. The receiver then either acknowledges (ACK) by pulling SDA LOW, or does not acknowledge (NoACK) by letting SDA stay HIGH (Figure 4). Bus timing is illustrated in Figure 5. Functional Description The CAV24C64 supports the Inter-Integrated Circuit (I2C) Bus protocol. The protocol relies on the use of a Master device, which provides the clock and directs bus traffic, and Slave devices which execute requests. The CAV24C64 operates as a Slave device. Both Master and Slave can transmit or receive, but only the Master can assign those roles. SCL SDA START CONDITION STOP CONDITION Figure 2. Start/Stop Timing 1 0 1 0 A2 A1 A0 DEVICE ADDRESS Figure 3. Slave Address Bits www.onsemi.com 4 R/W CAV24C64 BUS RELEASE DELAY (TRANSMITTER) SCL FROM MASTER 1 BUS RELEASE DELAY (RECEIVER) 8 9 DATA OUTPUT FROM TRANSMITTER DATA OUTPUT FROM RECEIVER START ACK SETUP (≥ tSU:DAT) ACK DELAY (≤ tAA) Figure 4. Acknowledge Timing tHIGH tF tLOW tR tLOW SCL tHD:DAT tSU:STA tHD:STA tSU:DAT tSU:STO SDA IN tAA tDH tBUF SDA OUT Figure 5. Bus Timing WRITE OPERATIONS Byte Write Acknowledge Polling To write data to memory, the Master creates a START condition on the bus and then broadcasts a Slave address with the R/W bit set to ‘0’. The Master then sends two address bytes and a data byte and concludes the session by creating a STOP condition on the bus. The Slave responds with ACK after every byte sent by the Master (Figure 6). The STOP starts the internal Write cycle, and while this operation is in progress (tWR), the SDA output is tri-stated and the Slave does not acknowledge the Master (Figure 7). As soon (and as long) as internal Write is in progress, the Slave will not acknowledge the Master. This feature enables the Master to immediately follow-up with a new Read or Write request, rather than wait for the maximum specified Write time (tWR) to elapse. Upon receiving a NoACK response from the Slave, the Master simply repeats the request until the Slave responds with ACK. Hardware Write Protection With the WP pin held HIGH, the entire memory is protected against Write operations. If the WP pin is left floating or is grounded, it has no impact on the Write operation. The state of the WP pin is strobed on the last falling edge of SCL immediately preceding the 1st data byte (Figure 9). If the WP pin is HIGH during the strobe interval, the Slave will not acknowledge the data byte and the Write request will be rejected. Page Write The Byte Write operation can be expanded to Page Write, by sending more than one data byte to the Slave before issuing the STOP condition (Figure 8). Up to 32 distinct data bytes can be loaded into the internal Page Write Buffer starting at the address provided by the Master. The page address is latched, and as long as the Master keeps sending data, the internal byte address is incremented up to the end of page, where it then wraps around (within the page). New data can therefore replace data loaded earlier. Following the STOP, data loaded during the Page Write session will be written to memory in a single internal Write cycle (tWR). Delivery State The CAV24C64 is shipped erased, i.e., all bytes are FFh. www.onsemi.com 5 CAV24C64 BUS ACTIVITY: S T A MASTER R T ADDRESS BYTE SLAVE ADDRESS ADDRESS BYTE DATA BYTE a7 − a0 d7 − d0 a15 − a8 S S T O P P * * * A C K A C K SLAVE *a15 − a13 are don’t care bits. A C K A C K Figure 6. Byte Write Sequence SCL SDA 8th Bit Byte n ACK tWR STOP CONDITION START CONDITION ADDRESS Figure 7. Write Cycle Timing BUS ACTIVITY: S T A MASTER R T ADDRESS BYTE SLAVE ADDRESS DATA BYTE n ADDRESS BYTE DATA BYTE n+1 S T O P DATA BYTE n+P P S A C K A C K A C K SLAVE A C K A C K Figure 8. Page Write Sequence ADDRESS BYTE DATA BYTE 1 8 a7 a0 9 1 8 d7 d0 SCL SDA tSU:WP WP tHD:WP Figure 9. WP Timing www.onsemi.com 6 A C K A C K CAV24C64 READ OPERATIONS Immediate Read Write sequence by sending data, the Master then creates a START condition and broadcasts a Slave address with the R/W bit set to ‘1’. The Slave responds with ACK after every byte sent by the Master and then sends out data residing at the selected address. After receiving the data, the Master responds with NoACK and then terminates the session by creating a STOP condition on the bus (Figure 11). To read data from memory, the Master creates a START condition on the bus and then broadcasts a Slave address with the R/W bit set to ‘1’. The Slave responds with ACK and starts shifting out data residing at the current address. After receiving the data, the Master responds with NoACK and terminates the session by creating a STOP condition on the bus (Figure 10). The Slave then returns to Standby mode. Sequential Read Selective Read If, after receiving data sent by the Slave, the Master responds with ACK, then the Slave will continue transmitting until the Master responds with NoACK followed by STOP (Figure 12). During Sequential Read the internal byte address is automatically incremented up to the end of memory, where it then wraps around to the beginning of memory. To read data residing at a specific address, the selected address must first be loaded into the internal address register. This is done by starting a Byte Write sequence, whereby the Master creates a START condition, then broadcasts a Slave address with the R/W bit set to ‘0’ and then sends two address bytes to the Slave. Rather than completing the Byte N O BUS ACTIVITY: S T A MASTER R T S A T CO K P SLAVE ADDRESS P S A C K SLAVE SCL 8 SDA DATA BYTE 9 8th Bit DATA OUT NO ACK STOP Figure 10. Immediate Read Sequence and Timing BUS ACTIVITY: S T A MASTER R T ADDRESS BYTE SLAVE ADDRESS S T A R T ADDRESS BYTE S N O A C K SLAVE ADDRESS P S A C K SLAVE A C K A C K A C K DATA BYTE Figure 11. Selective Read Sequence N O A C K BUS ACTIVITY: MASTER A C K SLAVE ADDRESS A C K A C K S T O P P SLAVE A C K DATA BYTE n DATA BYTE n+1 DATA BYTE n+2 Figure 12. Sequential Read Sequence www.onsemi.com 7 S T O P DATA BYTE n+x CAV24C64 PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD ISSUE O E1 E SYMBOL MIN A 1.35 1.75 A1 0.10 0.25 b 0.33 0.51 c 0.19 0.25 D 4.80 5.00 E 5.80 6.20 E1 3.80 4.00 MAX 1.27 BSC e PIN # 1 IDENTIFICATION NOM h 0.25 0.50 L 0.40 1.27 θ 0º 8º TOP VIEW D h A1 θ A c e b L END VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. www.onsemi.com 8 CAV24C64 PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL ISSUE O b SYMBOL MIN NOM 1.20 A E1 E MAX A1 0.05 A2 0.80 b 0.19 0.15 0.90 1.05 0.30 c 0.09 D 2.90 3.00 0.20 3.10 E 6.30 6.40 6.50 E1 4.30 4.40 4.50 e 0.65 BSC L 1.00 REF L1 0.50 θ 0º 0.60 0.75 8º e TOP VIEW D A2 c q1 A A1 L1 SIDE VIEW L END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. www.onsemi.com 9 CAV24C64 PACKAGE DIMENSIONS WLCSP4, 0.76x0.76 CASE 567JY ISSUE O ÈÈ ÈÈ A D PIN A1 REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E 2X 0.05 C 2X 0.05 C TOP VIEW DETAIL A MILLIMETERS DIM MIN MAX A −−− 0.35 A1 0.0415 0.0715 A2 0.255 REF A3 0.025 REF b 0.15 0.16 D 0.76 BSC E 0.76 BSC e 0.40 BSC A3 DIE COAT (OPTIONAL) A2 DETAIL A A2 0.05 C A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C A1 NOTE 3 4X SEATING PLANE A1 PACKAGE OUTLINE e b 0.05 C A B C SIDE VIEW e 0.40 PITCH B 0.03 C A 1 4X 0.40 PITCH 0.16 DIMENSIONS: MILLIMETERS 2 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. BOTTOM VIEW www.onsemi.com 10 CAV24C64 ORDERING INFORMATION Specific Device Marking Package Type Lead Finish Shipping† CAV24C64YE−GT3 C64F TSSOP−8 NiPdAu Tape & Reel, 3,000 Units / Reel CAV24C64YE−G (Note 9) C64F TSSOP−8 NiPdAu Tube, 100 Units / Tube 24C64F SOIC−8, JEDEC NiPdAu Tape & Reel, 3,000 Units / Reel A WLCSP4 SnAgCu Tape & Reel, 5,000 Units / Reel Device Order Number CAV24C64WE−GT3 CAV24C64C4CTR (Note 9) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 9. Please contact your nearest ON Semiconductor Sales office for availability. ON Semiconductor is licensed by Philips Corporation to carry the I2C Bus Protocol. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 11 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CAV24C64/D