MC74LCX16374 D

MC74LCX16374
Low-Voltage CMOS 16-Bit
D-Type Flip-Flop
With 5 V−Tolerant Inputs and Outputs
(3−State, Non−Inverting)
The MC74LCX16374 is a high performance, non−inverting 16−bit
D−type flip−flop operating from a 2.3 V to 3.6 V supply. The device is
byte controlled. Each byte has separate Output Enable and Clock Pulse
inputs. These control pins can be tied together for full 16−bit operation.
High impedance TTL compatible inputs significantly reduce current
loading to input drivers while TTL compatible outputs offer improved
switching noise performance. A VI specification of 5.5 V allows
MC74LCX16374 inputs to be safely driven from 5.0 V devices.
The MC74LCX16374 consists of 16 edge−triggered flip−flops with
individual D−type inputs and 5.0 V−tolerant 3−state true outputs. The
buffered clocks (CPn) and buffered Output Enables (OEn) are common
to all flip−flops within the respective byte. The flip−flops will store the
state of individual D inputs that meet the setup and hold time
requirements on the LOW−to−HIGH Clock (CP) transition. With the
OE LOW, the contents of the flip−flops are available at the outputs.
When the OE is HIGH, the outputs go to the high impedance state. The
OE input level does not affect the operation of the flip−flops.
Features
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October, 2012 − Rev. 10
48
1
TSSOP−48
DT SUFFIX
CASE 1201
MARKING DIAGRAM
48
LCX16374G
AWLYYWW
1
Designed for 2.3 to 3.6 V VCC Operation
6.2 ns Maximum tpd
5.0 V Tolerant − Interface Capability With 5.0 V TTL Logic
Supports Live Insertion and Withdrawal
IOFF Specification Guarantees High Impedance When VCC = 0 V
LVTTL Compatible
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current in All Three Logic States (20 mA)
Substantially Reduces System Power Requirements
Latchup Performance Exceeds 500 mA
ESD Performance:
♦ Human Body Model >2000 V
♦ Machine Model >200 V
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
© Semiconductor Components Industries, LLC, 2012
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1
A
WL
YY
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Publication Order Number:
MC74LCX16374/D
MC74LCX16374
1
OE1 1
48 CP1
O0 2
47 D0
O1 3
46 D1
GND 4
45 GND
O2 5
44 D2
O3 6
43 D3
VCC 7
42 VCC
O4 8
41 D4
O5 9
40 D5
GND 10
39 GND
O6 11
38 D6
O7 12
37 D7
O8 13
36 D8
O9 14
35 D9
GND 15
34 GND
O10 16
33 D10
O11 17
32 D11
VCC 18
31 VCC
O12 19
30 D12
O13 20
29 D13
GND 21
28 GND
O14 22
27 D14
O15 23
26 D15
OE2 24
25 CP2
24
OE1
CP1
OE2
48
CP2
2
nCP
47
36
D8
D
D1
35
D9
D
O2
Q
D2
O3
Q
D3
O5
Q
D5
D7
26
D15
D
O14
23
nCP
O7
Q
22
Q
D
12
nCP
37
O13
Q
27
D14
D
20
nCP
nCP
O6
Q
O12
D
11
nCP
38
D6
29
D13
D
19
Q
D
9
nCP
40
O11
Q
30
D12
D
17
nCP
nCP
O4
Q
O10
Q
D
8
nCP
41
D4
32
D11
D
16
nCP
D
6
nCP
43
33
D10
D
O9
Q
D
5
nCP
44
14
nCP
O1
Q
O8
Q
D
3
nCP
46
13
nCP
O0
Q
D0
25
O15
Q
D
Figure 2. Logic Diagram
Figure 1. Pinout: 48−Lead
(Top View)
Table 1. PIN NAMES
Pins
Function
OEn
Output Enable Inputs
CPn
Clock Pulse Inputs
D0−D15
Inputs
O0−O15
Outputs
Outputs
Inputs
TRUTH TABLE
Inputs
Outputs
CP1
OE1
D0:7
O0:7
CP2
OE2
D8:15
O8:15
↑
L
H
H
↑
L
H
H
↑
L
L
L
↑
L
L
L
L
L
X
O0
L
L
X
O0
X
H
X
Z
X
H
X
Z
H = High Voltage Level
L = Low Voltage Level
Z = High Impedance State
↑ = Low−to−High Transition
X = High or Low Voltage Level and Transitions Are Acceptable; for ICC reasons, DO NOT FLOAT Inputs
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MC74LCX16374
ORDERING INFORMATION
Package
Shipping†
MC74LCX16374DTG
TSSOP−48
(Pb−Free)
39 Units / Rail
M74LCX16374DTR2G
TSSOP−48
(Pb−Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MAXIMUM RATINGS
Symbol
VCC
Parameter
Value
DC Supply Voltage
Condition
Units
−0.5 to +7.0
V
V
VI
DC Input Voltage
−0.5 ≤ VI ≤ +7.0
VO
DC Output Voltage
−0.5 ≤ VO ≤ +7.0
Output in 3−State
−0.5 ≤ VO ≤ VCC + 0.5
Output in HIGH or LOW State. (Note 1)
V
IIK
DC Input Diode Current
−50
VI < GND
mA
IOK
DC Output Diode Current
−50
VO < GND
mA
+50
VO > VCC
mA
V
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
±100
mA
−65 to +150
°C
IGND
DC Ground Current Per Ground Pin
TSTG
Storage Temperature Range
MSL
Moisture Sensitivity
Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. IO absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
Operating
Data Retention Only
Min
Typ
Max
2.0
1.5
2.5, 3.3
2.5, 3.3
3.6
3.6
VI
Input Voltage
0
5.5
VO
Output Voltage
(HIGH or LOW State)
(3−State)
0
0
VCC
5.5
IOH
HIGH Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
−24
−12
−8
IOL
LOW Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
+24
+12
+8
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V
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3
Units
V
V
V
mA
mA
−55
+125
°C
0
10
ns/V
MC74LCX16374
DC ELECTRICAL CHARACTERISTICS
TA = −55°C to +125°C
Symbol
VIH
VIL
VOH
VOL
Condition
Min
2.3 V ≤ VCC ≤ 2.7 V
1.7
2.7 V ≤ VCC ≤ 3.6 V
2.0
Characteristic
HIGH Level Input Voltage (Note 2)
LOW Level Input Voltage (Note 2)
HIGH Level Output Voltage
LOW Level Output Voltage
IOZ
3−State Output Current
IOFF
Power Off Leakage Current
Max
V
2.3 V ≤ VCC ≤ 2.7 V
0.7
2.7 V ≤ VCC ≤ 3.6 V
0.8
2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA
VCC − 0.2
VCC = 2.3 V; IOH = −8 mA
1.8
VCC = 2.7 V; IOH = −12 mA
2.2
VCC = 3.0 V; IOH = −18 mA
2.4
VCC = 3.0 V; IOH = −24 mA
2.2
Units
V
V
2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA
0.2
V
VCC = 2.3 V; IOL = 8 mA
0.6
VCC = 2.7 V; IOL = 12 mA
0.4
VCC = 3.0 V; IOL = 16 mA
0.4
VCC = 3.0 V; IOL = 24 mA
0.55
VCC = 3.6 V, VIN = VIH or VIL,
VOUT = 0 to 5.5 V
±5
mA
VCC = 0, VIN = 5.5 V or VOUT = 5.5 V
10
mA
IIN
Input Leakage Current
VCC = 3.6 V, VIN = 5.5 V or GND
±5
mA
ICC
Quiescent Supply Current
VCC = 3.6 V, VIN = 5.5 V or GND
10
mA
2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V
500
mA
DICC
Increase in ICC per Input
2. These values of VI are used to test DC electrical characteristics only.
AC CHARACTERISTICS (tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W)
TA = −55°C to +125°C
VCC = 3.3 V ± 0.3 V
CL = 50 pF
Symbol
Parameter
Waveform
Min
Max
VCC = 2.7 V
CL = 50 pF
Min
Max
VCC = 2.5 V ± 0.2 V
CL = 30 pF
Min
Max
Units
fmax
Clock Pulse Frequency
1
170
tPLH
tPHL
Propagation Delay
CP to On
1
1.5
1.5
6.2
6.2
1.5
1.5
6.5
6.5
1.5
1.5
7.4
7.4
ns
tPZH
tPZL
Output Enable Time to
High and Low Level
2
1.5
1.5
6.1
6.1
1.5
1.5
6.3
6.3
1.5
1.5
7.9
7.9
ns
tPHZ
tPLZ
Output Disable Time From
High and Low Level
2
1.5
1.5
6.0
6.0
1.5
1.5
6.2
6.2
1.5
1.5
7.2
7.2
ns
ts
Setup Time, HIGH or LOW Dn to
CP
1
2.5
2.5
3.0
ns
th
Hold Time, HIGH or LOW Dn to CP
1
1.5
1.5
2.0
ns
tw
CP Pulse Width, HIGH
3
3.0
3.0
3.5
ns
tOSHL
tOSLH
Output−to−Output Skew
(Note 3)
MHz
1.0
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
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MC74LCX16374
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25°C
Symbol
Characteristic
Min
Condition
Typ
Max
Units
VOLP
Dynamic LOW Peak Voltage
(Note 4)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V
0.8
0.6
V
VOLV
Dynamic LOW Valley Voltage
(Note 4)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V
−0.8
−0.6
V
4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol
CIN
Parameter
Condition
Typical
Units
Input Capacitance
VCC = 3.3 V, VI = 0 V or VCC
7
pF
COUT
Output Capacitance
VCC = 3.3 V, VI = 0 V or VCC
8
pF
CPD
Power Dissipation Capacitance
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
20
pF
VCC
VCC
Dn
0V
th
ts
tPZH
tPHZ
VCC
Vmo
On
Vmo
VOH
VHZ
0V
fmax
tPZL
tPLH, tPHL
On
Vmi
Vmi
0V
CPn
Vmi
OEn
tPLZ
VOH
Vmo
On
Vmo
VHZ
VOL
VOL
WAVEFORM 1 − PROPAGATION DELAYS, SETUP AND HOLD TIMES
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
WAVEFORM 2 − OUTPUT ENABLE AND DISABLE TIMES
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
VCC
CPn
Vmi
Vmi
tw
0V
VCC
tw
Vmo
CPn
Vmo
0V
WAVEFORM 3 − PULSE WIDTH
tR = tF = 2.5 ns (or fast as required) from 10% to 90%;
Output requirements: VOL ≤ 0.8 V, VOH ≥ 2.0 V
Figure 3. AC Waveforms
Table 2. AC WAVEFORMS
VCC
Symbol
3.3 V ± 0.3 V
2.7 V
2.5 V ± 0.2 V
Vmi
1.5 V
1.5 V
VCC / 2
Vmo
1.5 V
1.5 V
VCC / 2
VHZ
VOL + 0.3 V
VOL + 0.3 V
VOL + 0.15 V
VLZ
VOH − 0.3 V
VOH − 0.3 V
VOH − 0.15 V
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MC74LCX16374
VCC
R1
PULSE
GENERATOR
DUT
RT
CL
RL
Figure 4. Test Circuit
Table 3. TEST CIRCUIT
Test
Switch
tPLH, tPHL
Open
tPZL, tPLZ
6 V at VCC = 3.3 ± 0.3 V
6 V at VCC = 2.5 ± 0.2 V
Open Collector/Drain tPLH and tPHL
6V
tPZH, tPHZ
GND
CL =
CL =
RL =
RT =
50 pF at VCC = 3.3 ± 0.3 V or equivalent (includes jig and probe capacitance)
30 pF at VCC = 2.5 ± 0.2 V or equivalent (includes jig and probe capacitance)
R1 = 500 W or equivalent
ZOUT of pulse generator (typically 50 W)
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6
6 V or VCC × 2
OPEN
GND
MC74LCX16374
PACKAGE DIMENSIONS
48X
TSSOP−48
DT SUFFIX
CASE 1201−01
ISSUE B
K REF
0.12 (0.005)
M
T U
S
V
S
T U
48
25
SECTION N−N
B
−U−
L
1
N
24
A
−V−
PIN 1
IDENT.
DETAIL E
D
0.076 (0.003)
−T− SEATING
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
N
F
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSIONS A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
J J1
M
0.254 (0.010)
K
K1
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
S
C
M
0.25 (0.010)
−W−
DETAIL E
H
G
MILLIMETERS
MIN
MAX
12.40
12.60
6.00
6.20
−−−
1.10
0.05
0.15
0.50
0.75
0.50 BSC
0.37
−−−
0.09
0.20
0.09
0.16
0.17
0.27
0.17
0.23
7.95
8.25
0_
8_
INCHES
MIN
MAX
0.488
0.496
0.236
0.244
−−−
0.043
0.002
0.006
0.020
0.030
0.0197 BSC
0.015
−−−
0.004
0.008
0.004
0.006
0.007
0.011
0.007
0.009
0.313
0.325
0_
8_
RECOMMENDED
SOLDERING FOOTPRINT
48X
48X
0.32
1.00
8.45
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
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MC74LCX16374/D