MC100LVEL05 D

MC100LVEL05
3.3V ECL 2‐Input Differential
AND/NAND
Description
The MC100LVEL05 is a 2-input differential AND/NAND gate. The
device is functionally equivalent to the MC100EL05 device and
operates from a 3.3 V supply voltage. With propagation delays and
output transition times equivalent to the EL05, the LVEL05 is ideally
suited for those applications which require the ultimate in AC
performance at low voltage power supplies.
Because a negative 2-input NAND is equivalent to a 2-input OR
function, the differential inputs and outputs of the device allows the
LVEL05 to also be used as a 2-input differential OR/NOR gate.
• 340 ps Propagation Delay
• High Bandwidth Output Transitions
• ESD Protection: >4 kV Human Body Model,
•
•
•
•
•
•
•
8
8
1
1
8
8
>200 V Machine Model
The 100 Series Contains Temperature Compensation
PECL Mode Operating Range: VCC = 3.0 V to 3.8 V
with VEE = 0 V
NECL Mode Operating Range: VCC = 0 V
with VEE = −3.0 V to −3.8 V
Internal Input Pulldown Resistors
Q Output will Default LOW with All Inputs Open or at VEE
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Moisture Sensitivity Level 1
For Additional Information, see Application Note AND8003/D
Flammability Rating: UL 94 V−0 @ 0.125 in,
Oxygen Index: 28 to 34
Transistor Count = 69 devices
Pb−Free Packages are Available
KVL05
ALYW
G
1
TSSOP−8
DT SUFFIX
CASE 948R
1
KV05
ALYWG
G
3Y M G
G
•
MARKING
DIAGRAMS*
SOIC−8
D SUFFIX
CASE 751
Features
•
•
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1
4
DFN8
MN SUFFIX
CASE 506AA
A
L
Y
W
M
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
August, 2008 − Rev. 4
1
Publication Order Number:
MC100LVEL05/D
MC100LVEL05
Table 1. PIN DESCRIPTION
D0
1
8
VCC
PIN
FUNCTION
D0, D0; D1, D1
Q, Q
VCC
VEE
ECL Data Inputs
ECL Data Outputs
Positive Supply
Negative Supply
EP
(DFN8 only) Thermal exposed pad
must be connected to a sufficient
thermal conduit. Electrically connect
to the most negative supply (GND) or
leave unconnected, floating open.
D0
2
7
Q
D1
3
6
Q
D1
4
5
VEE
Figure 1. Logic Diagram and Pinout Assignment
Table 2. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
8 to 0
V
−8 to 0
V
6 to 0
−6 to 0
V
V
50
100
mA
mA
−40 to +85
°C
VCC
PECL Mode Power Supply
VEE = 0 V
VEE
NECL Mode Power Supply
VCC = 0 V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
Iout
Output Current
Continuous
Surge
TA
Operating Temperature Range
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
8 SOIC
8 SOIC
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
8 SOIC
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
8 TSSOP
8 TSSOP
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
8 TSSOP
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol
Wave Solder
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
qJC
Thermal Resistance (Junction−to−Case)
35 to 40
°C/W
Pb
Pb−Free
(Note 1)
VI VCC
VI VEE
DFN8
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
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MC100LVEL05
Table 3. LVPECL DC CHARACTERISTICS VCC = 3.3 V; VEE = 0.0 V (Note 1)
−40°C
Symbol
Characteristic
Min
25°C
Typ
Max
18
25
Min
85°C
Typ
Max
18
25
Min
Typ
Max
Unit
19
26
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 2)
2215
2295
2420
2275
2345
2420
2275
2345
2420
mV
VOL
Output LOW Voltage (Note 2)
1470
1605
1745
1490
1595
1680
1490
1595
1680
mV
VIH
Input HIGH Voltage (Single−Ended)
2135
2420
2135
2420
2135
2420
mV
VIL
Input LOW Voltage (Single−Ended)
1490
1825
1490
1825
1490
1825
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential) (Note 6)
Vpp < 500 mV
Vpp y 500 mV
1.2
1.5
2.9
2.9
1.1
1.4
2.9
2.9
1.1
1.4
2.9
2.9
V
V
150
mA
IIH
Input HIGH Current
IIL
Input LOW Current
150
0.5
150
0.5
0.5
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary ±0.3 V.
2. Outputs are terminated through a 50 ohm resistor to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal.
Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin and 1V.
Table 4. LVNECL DC CHARACTERISTICS VCC = 0.0 V; VEE = −3.3 V (Note 4)
−40°C
Symbol
Characteristic
Min
25°C
Typ
Max
18
25
Min
85°C
Typ
Max
18
25
Min
Typ
Max
Unit
19
26
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 5)
−1085
−1005
−880
−1025
−955
−880
−1025
−955
−880
mV
VOL
Output LOW Voltage (Note 5)
−1830
−1695
−1555
−1810
−1705
−1620
−1810
−1705
−1620
mV
VIH
Input HIGH Voltage (Single−Ended)
−1165
−880
−1165
−880
−1165
−880
mV
VIL
Input LOW Voltage (Single−Ended)
−1810
−1475
−1810
−1475
−1810
−1475
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential) (Note 6)
Vpp < 500 mV
Vpp y 500 mV
−2.1
−1.8
−0.4
−0.4
−2.2
−1.9
−0.4
−0.4
−2.2
−1.9
−0.4
−0.4
V
V
150
mA
IIH
Input HIGH Current
IIL
Input LOW Current
150
0.5
150
0.5
0.5
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
4. Input and output parameters vary 1:1 with VCC. VEE can vary ±0.3 V.
5. Outputs are terminated through a 50 ohm resistor to VCC − 2.0 V.
6. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal.
Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin and 1V.
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MC100LVEL05
Table 5. AC CHARACTERISTICS VCC = 3.3 V; VEE = 0.0 V or VCC = 0.0 V; VEE = −3.3 V (Note 7)
−405C
Symbol
Characteristic
Min
Typ
25°C
Max
Min
440
240
fmax
Maximum Toggle Frequency
tPLH
tPHL
Propagation Delay to Output
TBD
tJITTER
Cycle−to−Cycle Jitter
VPP
Input Swing (Note 8)
150
1000
150
tr
tf
Output Rise/Fall Times Q
(20% − 80%)
100
320
100
240
260
85°C
Typ
Max
Min
440
250
TBD
TBD
Typ
Max
TBD
340
TBD
GHz
450
TBD
210
Unit
ps
ps
1000
150
1000
320
100
320
mV
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
7. VEE can vary ±0.3 V.
8. VPP(min) is the minimum input swing for which AC parameters are guaranteed. The device has a DC gain of ≈40.
Q
Zo = 50 W
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 3.0 V
Figure 2. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
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MC100LVEL05
ORDERING INFORMATION
Package
Shipping†
SOIC−8
98 Units / Rail
MC100LVEL05DG
SOIC−8
(Pb−Free)
98 Units / Rail
MC100LVEL05DR2
SOIC−8
2500 / Tape & Reel
MC100LVEL05DR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
MC100LVEL05DT
TSSOP−8
100 Units / Rail
MC100LVEL05DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC100LVEL05DTR2
TSSOP−8
2500 / Tape & Reel
MC100LVEL05DTR2G
TSSOP−8
(Pb−Free)
2500 / Tape & Reel
MC100LVEL05MNR4
DFN8
1000 / Tape & Reel
DFN8
(Pb−Free)
1000 / Tape & Reel
Device
MC100LVEL05D
MC100LVEL05MNR4G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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MC100LVEL05
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AH
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
MC100LVEL05
PACKAGE DIMENSIONS
TSSOP−8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R−02
ISSUE A
8x
0.15 (0.006) T U
0.10 (0.004)
S
2X
L/2
L
8
5
1
PIN 1
IDENT
0.15 (0.006) T U
K REF
M
T U
V
S
0.25 (0.010)
B
−U−
4
M
A
−V−
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
S
F
DETAIL E
C
0.10 (0.004)
−T− SEATING
PLANE
D
−W−
G
DETAIL E
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7
DIM
A
B
C
D
F
G
K
L
M
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
0.80
1.10
0.05
0.15
0.40
0.70
0.65 BSC
0.25
0.40
4.90 BSC
0_
6_
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
0.031
0.043
0.002
0.006
0.016
0.028
0.026 BSC
0.010
0.016
0.193 BSC
0_
6_
MC100LVEL05
PACKAGE DIMENSIONS
DFN8
CASE 506AA−01
ISSUE D
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
PIN ONE
REFERENCE
2X
0.10 C
2X
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
TOP VIEW
0.10 C
0.08 C
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.10
1.30
2.00 BSC
0.70
0.90
0.50 BSC
0.20
−−−
0.25
0.35
A
0.10 C
8X
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
E
(A3)
SIDE VIEW
A1
C
D2
e
e/2
4
1
8X
L
E2
K
8
5
8X
b
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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MC100LVEL05/D