MC10EP05 D

MC10EP05, MC100EP05
3.3V / 5V ECL 2-Input
Differential AND/NAND
Description
The MC10/100EP05 is a 2−input differential AND/NAND gate.
The device is functionally equivalent to the EL05 and LVEL05
devices. With AC performance much faster than the LVEL05 device,
the EP05 is ideal for applications requiring the fastest
AC performance available.
The 100 Series contains temperature compensation.
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MARKING DIAGRAMS*
8
8
Features
1
• 220 ps Typical Propagation Delay
• Maximum Frequency > 3 GHz Typical
• PECL Mode Operating Range: VCC = 3.0 V to 5.5 V
SOIC−8
D SUFFIX
CASE 751
1
8
HEP05
ALYWG
G
KEP05
ALYWG
G
1
with VEE = 0 V
1
TSSOP−8
DT SUFFIX
CASE 948R
1
8
HP05
ALYWG
G
1
KP05
ALYWG
G
5I DG
G
•
•
•
•
8
8
with VEE = −3.0 V to −5.5 V
Open Input Default State
Safety Clamp on Inputs
Q Output Will Default LOW with Inputs Open or at VEE
Pb−Free Packages are Available
DFN8
MN SUFFIX
CASE 506AA
H
K
5I
2X
D
= MC10
= MC100
= MC10
= MC100
= Date Code
2X DG
G
• NECL Mode Operating Range: VCC = 0 V
1
4
1
4
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
August, 2008 − Rev. 9
1
Publication Order Number:
MC10EP05/D
MC10EP05, MC100EP05
Table 1. PIN DESCRIPTION
D0
D0
D1
1
8
2
7
6
3
Pin
VCC
Q
Function
D0*, D1*, D0**, D1**
ECL Data Inputs
Q, Q
ECL Data Outputs
VCC
Positive Supply
VEE
Negative Supply
EP
(DFN8 only) Thermal exposed pad
must be connected to a sufficient
thermal conduit. Electrically connect
to the most negative supply (GND) or
leave unconnected, floating open.
Q
* Pins will default LOW when left open.
** Pins will default to VCC/2when left open.
D1
4
5
VEE
Table 2. TRUTH TABLE
Figure 1. 8−Lead Pinout (Top View) and Logic
Diagram
D0
D1
D0
D1
Q
Q
L
L
H
H
L
H
L
H
H
H
L
L
H
L
H
L
L
L
L
H
H
H
H
L
Table 3. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
75 kW
Internal Input Pullup Resistor
ESD Protection
37.5 kW
Human Body Model
Machine Model
Charged Device Model
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
SOIC−8
TSSOP−8
DFN8
Flammability Rating
Oxygen Index: 28 to 34
Transistor Count
> 4 kV
> 200 V
> 2 kV
Pb Pkg
Pb−Free Pkg
Level 1
Level 1
Level 1
Level 1
Level 3
Level 1
UL 94 V−0 @ 0.125 in
137 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
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2
MC10EP05, MC100EP05
Table 4. MAXIMUM RATINGS
Rating
Unit
VCC
Symbol
PECL Mode Power Supply
Parameter
VEE = 0 V
Condition 1
6
V
VEE
NECL Mode Power Supply
VCC = 0 V
−6
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
6
−6
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−8
SOIC−8
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SOIC−8
41 to 44
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
41 to 44
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol
Wave Solder
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
qJC
Thermal Resistance (Junction−to−Case)
35 to 40
°C/W
Pb
Pb−Free
Condition 2
VI v VCC
VI w VEE
(Note 2)
DFN8
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
Table 5. 10EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 3)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
20
24
29
20
24
29
20
24
29
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 4)
2165
2290
2415
2230
2355
2480
2290
2415
2540
mV
VOL
Output LOW Voltage (Note 4)
1365
1490
1615
1430
1555
1680
1490
1615
1740
mV
VIH
Input HIGH Voltage (Single−Ended)
2090
2415
2155
2480
2215
2540
mV
VIL
Input LOW Voltage (Single−Ended)
1365
1690
1460
1755
1490
1815
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 5)
2.0
3.3
2.0
3.3
2.0
3.3
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
D
D
0.5
−150
150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
3. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V.
4. All loading with 50 W to VCC − 2.0 V.
5. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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3
MC10EP05, MC100EP05
Table 6. 10EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 6)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
20
24
29
20
24
29
20
24
29
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 7)
3865
3990
4115
3930
4055
4180
3990
4115
4240
mV
VOL
Output LOW Voltage (Note 7)
3065
3190
3315
3130
3255
3380
3190
3315
3440
mV
VIH
Input HIGH Voltage (Single−Ended)
3790
4115
3855
4180
3915
4240
mV
VIL
Input LOW Voltage (Single−Ended)
3065
3390
3130
3455
3190
3515
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 8)
2.0
5.0
2.0
5.0
2.0
5.0
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
D
D
150
0.5
−150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
6. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V.
7. All loading with 50 W to VCC − 2.0 V.
8. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 7. 10EP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = −5.5 V to −3.0 V (Note 9)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
20
24
29
20
24
29
20
24
29
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 10)
−1135
−1010
−885
−1070
−945
−820
−1010
−885
−760
mV
VOL
Output LOW Voltage (Note 10)
−1935
−1810
−1685
−1870
−1745
−1620
−1810
−1685
−1560
mV
VIH
Input HIGH Voltage (Single−Ended)
−1210
−885
−1145
−820
−1085
−760
mV
VIL
Input LOW Voltage (Single−Ended)
−1935
−1610
−1870
−1545
−1810
−1485
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 11)
0.0
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
VEE+2.0
0.0
VEE+2.0
150
D
D
0.5
−150
0.0
VEE+2.0
150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
9. Input and output parameters vary 1:1 with VCC.
10. All loading with 50 W to VCC − 2.0 V.
11. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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4
MC10EP05, MC100EP05
Table 8. 100EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 12)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
15
25
32
17
27
36
19
28
38
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 13)
2155
2280
2405
2155
2280
2405
2155
2280
2405
mV
VOL
Output LOW Voltage (Note 13)
1355
1480
1605
1355
1480
1605
1355
1480
1605
mV
VIH
Input HIGH Voltage (Single−Ended)
2075
2420
2075
2420
2075
2420
mV
VIL
Input LOW Voltage (Single−Ended)
1355
1675
1355
1675
1355
1675
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 14)
2.0
3.3
2.0
3.3
2.0
3.3
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
D
D
0.5
−150
150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
12. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V.
13. All loading with 50 W to VCC − 2.0 V.
14. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 9. 100EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 15)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
15
25
32
17
27
36
19
28
38
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 16)
3855
3980
4105
3855
3980
4105
3855
3980
4105
mV
VOL
Output LOW Voltage (Note 16)
3055
3180
3305
3055
3180
3305
3055
3180
3305
mV
VIH
Input HIGH Voltage (Single−Ended)
3775
4120
3775
4120
3775
4120
mV
VIL
Input LOW Voltage (Single−Ended)
3055
3375
3055
3375
3055
3375
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 17)
2.0
5.0
2.0
5.0
2.0
5.0
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
D
D
0.5
−150
150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
15. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V.
16. All loading with 50 W to VCC − 2.0 V.
17. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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5
MC10EP05, MC100EP05
Table 10. 100EP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = −5.5 V to −3.0 V (Note 18)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
15
25
32
17
27
36
19
28
38
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 19)
−1145
−1020
−895
−1145
−1020
−895
−1145
−1020
−895
mV
VOL
Output LOW Voltage (Note 19)
−1945
−1820
−1695
−1945
−1820
−1695
−1945
−1820
−1695
mV
VIH
Input HIGH Voltage (Single−Ended)
−1225
−880
−1225
−880
−1225
−880
mV
VIL
Input LOW Voltage (Single−Ended)
−1945
−1625
−1945
−1625
−1945
−1625
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 20)
0.0
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
VEE+2.0
0.0
VEE+2.0
0.0
150
D
D
0.5
−150
VEE+2.0
150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
18. Input and output parameters vary 1:1 with VCC.
19. All loading with 50 W to VCC − 2.0 V.
20. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 11. AC CHARACTERISTICS VCC = 0 V; VEE = −3.0 V to −5.5 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 21)
−40°C
Symbol
Characteristic
Min
fmax
Maximum Frequency
(Figure 2)
tPLH,
tPHL
Propagation Delay to
Output Differential
tJITTER
Random Clock Jitter
(Figure 2)
VPP
Input Voltage Swing (Differential Configuration)
tr
tf
Output Rise/Fall Times
(20% − 80%)
Typ
25°C
Max
Min
>3
160
Q
Typ
85°C
Max
Min
>3
210
260
0.2
<1
150
800
1200
70
120
170
170
Typ
Max
>3
220
270
0.2
<1
150
800
1200
80
130
180
210
Unit
GHz
260
320
ps
0.2
1.5
ps
150
800
1200
mV
100
150
200
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
21. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V.
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6
MC10EP05, MC100EP05
10
5V
9
750
8
3.3 V
650
7
6
550
450
350
5
4
JITTEROUT ps (RMS)
VOUTamplitude (mVpp)
850
ÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
3
2
1
(JITTER)
250
1.0
0
1.5
2.0
2.5
FREQUENCY (GHz)
3.0
Figure 2. Fmax/Jitter @ 255C
Q
Zo = 50 W
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 2.0 V
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
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7
MC10EP05, MC100EP05
ORDERING INFORMATION
Package
Shipping†
SOIC−8
98 Units / Rail
MC10EP05DG
SOIC−8
(Pb−Free)
98 Units / Rail
MC10EP05DR2
SOIC−8
2500 / Tape & Reel
MC10EP05DR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
MC10EP05DT
TSSOP−8
100 Units / Rail
MC10EP05DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC10EP05DTR2
TSSOP−8
2500 / Tape & Reel
MC10EP05DTR2G
TSSOP−8
(Pb−Free)
2500 / Tape & Reel
MC10EP05MNR4
DFN8
1000 / Tape & Reel
DFN8
(Pb−Free)
1000 / Tape & Reel
SOIC−8
98 Units / Rail
MC100EP05DG
SOIC−8
(Pb−Free)
98 Units / Rail
MC100EP05DR2
SOIC−8
2500 / Tape & Reel
MC100EP05DR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
MC100EP05DT
TSSOP−8
100 Units / Rail
MC100EP05DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC100EP05DTR2
TSSOP−8
2500 / Tape & Reel
MC100EP05DTR2G
TSSOP−8
(Pb−Free)
2500 / Tape & Reel
MC100EP05MNR4
DFN8
1000 / Tape & Reel
DFN8
(Pb−Free)
1000 / Tape & Reel
Device
MC10EP05D
MC10EP05MNR4G
MC100EP05D
MC100EP05MNR4G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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8
MC10EP05, MC100EP05
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AH
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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9
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
MC10EP05, MC100EP05
PACKAGE DIMENSIONS
TSSOP−8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R−02
ISSUE A
8x
0.15 (0.006) T U
0.10 (0.004)
S
2X
L/2
L
8
5
1
PIN 1
IDENT
0.15 (0.006) T U
K REF
M
T U
V
S
0.25 (0.010)
B
−U−
4
M
A
−V−
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
S
F
DETAIL E
C
0.10 (0.004)
−T− SEATING
PLANE
D
−W−
G
DETAIL E
http://onsemi.com
10
DIM
A
B
C
D
F
G
K
L
M
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
0.80
1.10
0.05
0.15
0.40
0.70
0.65 BSC
0.25
0.40
4.90 BSC
0_
6_
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
0.031
0.043
0.002
0.006
0.016
0.028
0.026 BSC
0.010
0.016
0.193 BSC
0_
6_
MC10EP05, MC100EP05
PACKAGE DIMENSIONS
DFN8
CASE 506AA−01
ISSUE D
D
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION:
MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED
BETWEEN 0.25 AND 0.30 MM FROM
TERMINAL.
4. COPLANARITY APPLIES TO THE
EXPOSED PAD AS WELL AS THE
TERMINALS.
B
PIN ONE
REFERENCE
2X
0.10 C
2X
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
E
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
TOP VIEW
0.10 C
A
0.10 C
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.10
1.30
2.00 BSC
0.70
0.90
0.50 BSC
0.20
−−−
0.25
0.35
8X
0.08 C
SEATING
PLANE
(A3)
SIDE VIEW
A1
C
D2
e
e/2
4
1
8X
L
E2
K
8
5
8X
b
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
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MC10EP05/D