MC74AC00, MC74ACT00 Quad 2-Input NAND Gate High−Performance Silicon−Gate CMOS Features • • • • • • • Output Drive Capability: $24 mA Operating Voltage Range: 2 to 6 V AC00; 4.5 to 5.5 ACT00 Low Input Current: 1.0 mA High Noise Immunity Characteristic of CMOS Devices In Compliance With the JEDEC Standard No. 7A Requirements Chip Complexity: 32 FETs These are Pb−Free Devices www.onsemi.com MARKING DIAGRAMS 14 14 A1 B1 1 3 2 SOIC−14 D SUFFIX CASE 751A xxx00G AWLYWW 1 1 Y1 14 A2 B2 A3 B3 A4 B4 4 6 5 Y2 Y = AB 9 8 10 xxx 00 ALYWG G TSSOP−14 DT SUFFIX CASE 948G 1 14 Y3 1 12 11 13 xxx = AC or ACT A = Assembly Location WL or L = Wafer Lot Y = Year WW or W = Work Week G or G = Pb−Free Package Y4 PIN 14 = VCC PIN 7 = GND Figure 1. Logic Diagram (Note: Microdot may be in either location) VCC B4 A4 Y4 B3 A3 Y3 14 13 12 11 10 9 8 FUNCTION TABLE Inputs 1 2 3 4 5 6 7 A1 B1 Y1 A2 B2 Y2 GND Output A B Y L L H H L H L H H H H L Figure 2. Pinout: 14−Lead Packages (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2015 January, 2015 − Rev. 10 1 Publication Order Number: MC74AC00/D MC74AC00, MC74ACT00 MAXIMUM RATINGS Symbol Parameter Value Unit *0.5 to )7.0 V *0.5 v VI v VCC )0.5 V *0.5 v VO v VCC )0.5 V DC Input Diode Current $20 mA IOK DC Output Diode Current $50 mA IO DC Output Sink/Source Current $50 mA ICC DC Supply Current per Output Pin $50 mA IGND DC Ground Current per Output Pin $50 mA TSTG Storage Temperature Range *65 to )150 °C TL Lead temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction temperature under Bias )150 °C qJA Thermal Resistance (Note 2) SOIC TSSOP 125 170 °C/W PD Power Dissipation in Still Air at 85°C SOIC TSSOP 125 170 mW MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) > 2000 > 200 > 1000 V ILatch−Up Latch−Up Performance Above VCC and Below GND at 85°C (Note 6) $100 mA VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK (Note 1) Level 1 Oxygen Index: 30% − 35% UL 94 V−0 @ 0.125 in Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. The package thermal impedance is calculated in accordance with JESD51−7. 3. Tested to EIA/JESD22−A114−A. 4. Tested to EIA/JESD22−A115−A. 5. Tested to JESD22−C101−A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter MC74AC00 MC74ACT00 Min Typ Max Unit 2.0 4.5 5.0 5.0 6.0 5.5 V 0 − VCC V VCC Supply Voltage Vin, Vout DC Input Voltage, Output Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 7) MC74AC00 VCC @ 3.0 V VCC @ 4.5 V VCC @ 5.5 V − − − 150 40 25 − − − ns/V tr, tf Input Rise and Fall Time (Note 8) MC74ACT00 VCC @ 4.5 V VCC @ 5.5 V − − 10 8.0 − − ns/V TJ Junction Temperature − − 150 °C TA Operating Ambient Temperature Range −55 25 125 °C IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 7. Vin from 30% to 70% VCC. 8. Vin from 0.8 V to 2.0 V. www.onsemi.com 2 MC74AC00, MC74ACT00 DC CHARACTERISTICS MC74AC00 Symbol Parameter VCC (V) TA = +255C TA = −405C to +855C Typ TA = −555C + 1255C Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 2.9 4.4 5.4 V IOUT = −50 mA V 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 2.4 3.7 4.7 *VIN = VIL or VIH −12 mA −24 mA IOH −24 mA 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V IOUT = 50 mA V 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 0.5 0.5 0.5 *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA VOL Maximum Low Level Output Voltage IIN Maximum Input Leakage Current 5.5 − $0. 1 $1.0 $1.0 mA VI = VCC, GND IOLD †Minimum Dynamic Output Current 5.5 − − 75 50 mA VOLD = 1.65 V Max 5.5 − − −75 −50 mA VOHD = 3.85 V Min Maximum Quiescent Supply Current 5.5 − 4.0 40 40 mA VIN = VCC or GND IOHD ICC Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. AC CHARACTERISTICS (tr = tf = 3.0 nS; CL = 50 pF; see Figures 3 and 4 for Waveforms) MC74AC00 Symbol Parameter TA = +255C TA = −405C to +855C TA = −555C to + 1255C VCC* (V) Min Typ Max Min Max Min Max Unit tPLH Propagation Delay 3.3 5.0 2.0 1.5 7.0 6.0 9.5 8.0 2.0 1.5 10.0 8.5 1.0 1.0 11.0 8.5 ns tPHL Propagation Delay 3.3 5.0 1.5 1.5 5.5 4.5 8.0 6.5 1.0 1.0 8.5 7.0 1.0 1.0 9.0 7.0 ns *Voltage Range 3.3 V is 3.3 V $0.3 V. Voltage Range 5.0 V is 5.0 V $0.5 V. www.onsemi.com 3 MC74AC00, MC74ACT00 DC CHARACTERISTICS MC74ACT00 Symbol Parameter VCC (V) TA = +255C TA = −405C to +855C Typ TA = −555C to + 1255C Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 4.4 5.4 V IOUT = −50 mA V 4.5 5.5 − − 3.86 4.86 3.76 4.76 3.7 4.7 *VIN = VIL or VIH IOH −24 mA −24 mA 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 V IOUT = 50 mA V 4.5 5.5 − − 0.36 0.36 0.44 0.44 0.5 0.5 *VIN = VIL or VIH IOL 24 mA 24 mA VOL Maximum Low Level Output Voltage IIN Maximum Input Leakage Current 5.5 − $0.1 $1.0 $1.0 mA VI = VCC, GND DICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 1.6 mA VI = VCC − 2.1 V IOLD †Minimum Dynamic Output Current 5.5 − − 75 50 mA VOLD = 1.65 V Max 5.5 − − −75 −50 mA VOHD = 3.85 V Min Maximum Quiescent Supply Current 5.5 − 4.0 40 40 mA VIN = VCC or GND IOHD ICC Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. AC CHARACTERISTICS (tr = tf = 3.0 nS; CL = 50 pF; see Figures 3 and 4 for Waveforms) MC74ACT00 Parameter Symbol TA = +255C TA = −405C to +855C TA = −555C to +1255C VCC* (V) Min Typ Max Min Max Min Max Unit tPLH Propagation Delay 5.0 1.5 5.5 9.0 1.0 9.5 1.0 9.5 ns tPHL Propagation Delay 5.0 1.5 4.0 7.0 1.0 8.0 1.0 8.0 ns *Voltage Range 5.0 V is 5.0 V $0.5 V. CAPACITANCE Symbol Parameter Value Typ Test Conditions Unit CIN Input Capacitance 4.5 VCC = 5.0 V pF CPD Power Dissipation Capacitance 30 VCC = 5.0 V pF www.onsemi.com 4 MC74AC00, MC74ACT00 tf tr VCC 90% INPUT A OR B Vmi 10% GND tPLH OUTPUT Y tPHL 50% Vmi = 50% for MC74AC00 = 1.5 V for MC74ACT00 Figure 3. Switching Waveforms INPUT OUTPUT DEVICE UNDER TEST 450 W 50 W Scope Test Point CL * *Includes all probe and jig capacitance Figure 4. Test Circuit ORDER INFORMATION Package Shipping† MC74AC00DG SOIC−14 (Pb−Free) 55 Units / Rail MC74AC00DR2G SOIC−14 (Pb−Free) MC74AC00DTR2G TSSOP−14 (Pb−Free) MC74ACT00DG SOIC−14 (Pb−Free) MC74ACT00DR2G SOIC−14 (Pb−Free) MC74ACT00DTR2G TSSOP−14 (Pb−Free) Device 2500 / Tape and Reel 55 Units / Rail 2500 / Tape and Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 5 MC74AC00, MC74ACT00 PACKAGE DIMENSIONS SOIC−14 NB CASE 751A−03 ISSUE K D A B 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 8 A3 E H L 1 0.25 M DETAIL A 7 B 13X M b 0.25 M C A S B S X 45 _ M A1 e DETAIL A h A C SEATING PLANE DIM A A1 A3 b D E e H h L M SOLDERING FOOTPRINT* 6.50 14X 1.18 1 1.27 PITCH 14X 0.58 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.19 0.25 0.35 0.49 8.55 8.75 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ INCHES MIN MAX 0.054 0.068 0.004 0.010 0.008 0.010 0.014 0.019 0.337 0.344 0.150 0.157 0.050 BSC 0.228 0.244 0.010 0.019 0.016 0.049 0_ 7_ MC74AC00, MC74ACT00 PACKAGE DIMENSIONS TSSOP−14 CASE 948G ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S N 2X 14 L/2 0.25 (0.010) 8 M B −U− L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 J J1 DIM A B C D F G H J J1 K K1 L M SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7 MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74AC00, MC74ACT00 ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 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