MC74HC1GU04 D

MC74HC1GU04
Single Unbuffered Inverter
The MC74HC1GU04 is a high speed CMOS unbuffered inverter
fabricated with silicon gate CMOS technology.
The MC74HC1GU04 output drive current is 1/2 compared to
MC74HC series.
High Speed: tPD = 7 ns (Typ) at VCC = 5 V
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25_C
http://onsemi.com
High Noise Immunity
MARKING
DIAGRAMS
Balanced Propagation Delays (tpLH = tpHL)
Symmetrical Output Impedance (IOH = IOL = 2 mA)
Chip Complexity: FET = 105
These Devices are Pb−Free and are RoHS Compliant
NC
5
1
IN A
2
GND
3
5
SC−88A / SOT−353 / SC−70
DF SUFFIX
CASE 419A
5
H6 M G
G
TSOP−5 / SOT−23 / SC−59
DT SUFFIX
CASE 483
1
1
H6 = Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
OUT Y
4
H6 M G
G
1
VCC
Figure 1. Pinout
IN A
M
•
•
•
•
•
•
•
PIN ASSIGNMENT
OUT Y
Figure 2. Logic Symbol
1
NC
2
IN A
3
GND
4
OUT Y
5
VCC
FUNCTION TABLE
Input A
Output Y
L
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
May, 2011 − Rev. 9
1
Publication Order Number:
MC74HC1GU04/D
MC74HC1GU04
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
*0.5 to )7.0
V
VIN
DC Input Voltage
*0.5 to VCC )0.5
V
VOUT
DC Output Voltage
*0.5 to VCC )0.5
V
IIK
DC Input Diode Current
$20
mA
IOK
DC Output Diode Current
$20
mA
IOUT
DC Output Sink Current
$12.5
mA
ICC
DC Supply Current per Supply Pin
$25
mA
TSTG
Storage Temperature Range
*65 to )150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
_C
TJ
Junction Temperature Under Bias
qJA
Thermal Resistance
PD
Power Dissipation in Still Air at 85_C
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ESD Withstand Voltage
ILATCHUP
Latchup Performance
)150
_C
SC70−5/SC−88A/SOT−353 (Note 1)
SOT23−5/TSOP−5/SC59−5
350
230
_C/W
SC70−5/SC−88A/SOT−353
SOT23−5/TSOP−5/SC59−5
150
200
mW
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
u2000
u200
N/A
V
Above VCC and Below GND at 125_C (Note 5)
$500
mA
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Min
Max
Unit
VCC
DC Supply Voltage
Parameter
2.0
6.0
V
VIN
DC Input Voltage
0.0
VCC
V
VOUT
DC Output Voltage
TA
Operating Temperature Range
tr , tf
Input Rise and Fall Time
0.0
VCC
V
*55
)125
_C
0
0
0
0
1000
600
500
400
ns
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
TJ = 80_C
1,032,200
TJ = 90_C
80
TJ = 100_C
Time, Years
TJ = 110_C
Time, Hours
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 120_C
Junction
Temperature °C
NORMALIZED FAILURE RATE
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
TJ = 130_C
Symbol
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
http://onsemi.com
2
MC74HC1GU04
DC ELECTRICAL CHARACTERISTICS
VCC
Symbol
Parameter
Test Conditions
(V)
Min
1.7
2.45
3.60
4.80
VIH
Minimum High−Level
Input Voltage
2.0
3.0
4.5
6.0
VIL
Maximum Low−Level
Input Voltage
2.0
3.0
4.5
6.0
VOH
Minimum High−Level
Output Voltage
VIN = VIH or VIL
VIN = VIH or VIL
IOH = −20 mA
VIN = VIH or VIL
IOH = −2 mA
IOH = −2.6 mA
VOL
Maximum Low−Level
Output Voltage
VIN = VIH or VIL
VIN = VIH or VIL
IOL = 20 mA
TA = 25_C
Typ
TA v 85_C
Max
Min
*55_C v TA v 125_C
Max
Min
1.7
2.45
3.60
4.80
0.3
0.5
0.9
1.20
1.7
2.45
3.60
4.80
0.3
0.5
0.9
1.20
1.8
2.7
4.0
5.5
2.0
3.0
4.5
5.9
1.8
2.7
4.0
5.5
1.8
2.7
4.0
5.5
4.5
6.0
4.18
5.68
4.33
5.76
4.13
5.63
4.08
5.58
0.0
0.0
0.0
0.0
Unit
V
0.3
0.5
0.9
1.20
2.0
3.0
4.5
6.0
2.0
3.0
4.5
6.0
Max
V
V
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
VIN = VIH or VIL
IOL = 2 mA
IOL = 2.6 mA
4.5
6.0
0.26
0.26
0.33
0.33
0.40
0.40
V
IIN
Maximum Input
Leakage Current
VIN = 6.0 V or GND
6.0
±0.1
±1.0
±1.0
mA
ICC
Maximum Quiescent
Supply Current
VIN = VCC or GND
6.0
1.0
10
40
mA
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 6.0 ns)
TA = 25_C
TA v 85_C
*55_C v TA v 125_C
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Symbol
Parameter
tPLH,
tPHL
Maximum
Propagation Delay,
Input A or B to Y
tTLH,
tTHL
Output Transition
Time
CIN
Maximum Input
Capacitance
Test Conditions
Min
Typ
Max
Min
Max
Min
Max
Unit
ns
VCC = 5.0 V
CL = 15 pF
3
15
20
25
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
CL = 50 pF
17
9
7
6.5
100
27
20
17
125
35
25
21
155
90
35
26
VCC = 5.0 V
CL = 15 pF
4
10
15
20
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
CL = 50 pF
25
16
12
10
125
35
25
21
155
45
31
26
200
60
38
32
5
10
10
10
ns
pF
Typical @ 25_C, VCC = 5.0 V
CPD
Power Dissipation Capacitance (Note 6)
10
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
http://onsemi.com
3
MC74HC1GU04
tr
tf
VCC
90%
50%
10%
INPUT A
OUTPUT
GND
CL*
tPLH
tPHL
OUTPUT Y
INPUT
90%
50%
10%
tTHL
tTLH
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended for
propagation delay tests.
Figure 4. Switching Waveforms
Figure 5. Test Circuit
DEVICE ORDERING INFORMATION
Device Nomenclature
Device Order
Number
Logic
Circuit
Indicator
Temp
Range
Identifier
Technology
Device
Function
Package
Suffix
Tape and
Reel
Suffix
MC74HC1GU04DFT1G
MC
74
HC1G
U04
DF
MC74HC1GU04DFT2G
MC
74
HC1G
U04
MC74HC1GU04DTT1G
MC
74
HC1G
U04
Package
Type
Tape and
Reel Size†
T1
SC70−5/SC−88A/
SOT−353
(Pb−Free)
178 mm (7 in)
3000 Unit
DF
T2
SC70−5/SC−88A/
SOT−353
(Pb−Free)
178 mm (7 in)
3000 Unit
DT
T1
SOT23−5/TSOP−5/
SC59−5
(Pb−Free)
178 mm (7 in)
3000 Unit
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
4
MC74HC1GU04
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE K
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
M
B
M
N
J
C
H
K
http://onsemi.com
5
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
MC74HC1GU04
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE H
D 5X
NOTE 5
2X
0.10 T
2X
0.20 T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
0.20 C A B
M
5
1
4
2
L
3
B
S
K
DETAIL Z
G
A
DIM
A
B
C
D
G
H
J
K
L
M
S
DETAIL Z
J
C
0.05
SEATING
PLANE
H
T
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
1.25
1.55
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
6
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MC74HC1GU04/D