CM1242-33CP 1-Channel ESD Protection Device in 0201 CSP Description The CM1242−33CP is a 2−bump ESD protection device in 0201 CSP form factor. It is fully compliant with IEC 61000−4−2. The CM1242−33CP is also RoHS II compliant and has a pure tin finish. http://onsemi.com Table 1. PIN DESCRIPTIONS Pin Description A ESD Channel Pin 1 B ESD Channel Pin 2 WLCSP2 CP SUFFIX CASE 567AV BLOCK DIAGRAM A PACKAGE / PINOUT DIAGRAMS Top View (Bumps Down) Y B MARKING DIAGRAM A Y Bottom View (Bumps Up) Y B = Specific Device Code ORDERING INFORMATION Device CM1242−33CP Package Shipping CSP 10,000/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2012 January, 2012 − Rev. 6 1 Publication Order Number: CM1242−33CP/D CM1242−33CP SPECIFICATIONS Table 2. STANDARD OPERATING CONDITIONS Rating Units Storage Temperature Range Parameter −55 to +150 °C Operating Temperature Range −40 to +85 °C ±5.5 V Maximum Input Voltage Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol VB ILEAK CIN VESD VCL RDYN Parameter Conditions Breakdown Voltage IF = +10 mA IF = −10 mA Channel Leakage Current VIN = ±3.3 V Channel Input Capacitance At 1 MHz, VIN = 0 V ESD Protection Peak Discharge Voltage at any channel input a) Contact Discharge per IEC 61000−4−2 standard b) Air Discharge per IEC 61000−4−2 standard (Note 2) Channel Clamp Voltage Positive Transients Negative Transients IPP = 1 A, tp = 8/20 ms Dynamic Resistance Positive Transients Negative Transients IPP = 1 A, tp = 8/20 ms Min Typ Max Units 6.0 −9.0 7.6 −7.6 9.0 −6.0 V ±0.1 ±0.5 mA 55 66 pF 45 kV ±30 ±30 1. TA = 25°C unless otherwise specified. 2. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W. http://onsemi.com 2 +8.6 −8.6 0.4 0.4 V W CM1242−33CP MECHANICAL SPECIFICATIONS CM1242−33CP Mechanical Specifications The CM1242−33CP is supplied in a 2−bump Chip Scale Package (CSP). Dimensions are presented below. Table 4. CSP TAPE AND REEL SPECIFICATIONS Pocket Size (mm) Tape Width Part Number Chip Size (mm) B0 X A0 X K0 W Reel Diameter Qty per Reel P0 P1 CM1242−33CP 0.60 X 0.30 X 0.275 0.67 X 0.37 X 0.35 8 mm 178 mm (7″) 10,000 4 mm 2 mm 10 Pitches Cumulative Tolerance on Tape ±0.2 mm P0 Top Cover Tape + + A0 B0 K0 W P1 User Direction of Feed Center Lines of Gravity Figure 1. Tape and Reel Mechanical Data http://onsemi.com 3 CM1242−33CP PACKAGE DIMENSIONS WLCSP2, 0.6x0.3 CASE 567AV ISSUE O D 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. A B 0.02 C 2X DIM A A1 b D E e L E 0.02 C TOP VIEW 0.02 C A 0.02 C A1 C SIDE VIEW e 2X MILLIMETERS MIN MAX 0.25 0.30 0.00 0.05 0.14 0.17 0.60 BSC 0.30 BSC 0.36 BSC 0.19 0.24 SEATING PLANE RECOMMENDED SOLDER FOOTPRINT* L 2X 0.33 2X b 0.05 C A B BOTTOM VIEW 2X 0.28 0.81 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 4 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CM1242−33CP/D