IP4302CX2/A Low profile bidirectional low capacitance ESD protection diode Rev. 1 — 28 November 2011 Product data sheet 1. Product profile 1.1 General description The IP4302CX2/A is a bidirectional diode which is designed to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages as high as 15 kV contact discharge according to the IEC 61000-4-2 model, far exceeding standard level 4. The device is fabricated using monolithic silicon technology and integrates one pair of back-to-back diodes in a 0.4 mm pitch Wafer-Level Chip-Scale Package (WLCSP). These features make the IP4302CX2/A ideal for use in applications requiring the utmost in miniaturization such as mobile phone handsets, cordless telephones and other portable electronic devices. 1.2 Features and benefits Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant) Bidirectional ESD protection of one line Integrated ESD protection withstanding 15 kV contact discharge, far exceeding IEC 61000-4-2 level 4 Ultra low height of 0.40 mm only 0.52 mm 0.7 mm size package 1.3 Applications Cellular handsets and accessories Portable electronics Subscriber Identity Module (SIM) card protection Communication systems Computers and peripherals IP4302CX2/A NXP Semiconductors Low profile bidirectional ESD protection diode 1.4 Quick reference data Table 1. Quick reference data Tamb = 25 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VBR breakdown voltage IR = 1 mA 14.0 16.5 - V IR = 1 mA - 16.5 14.0 V Cd diode capacitance f = 1 MHz; VR = 0 V - - 10 pF VESD electrostatic discharge voltage contact discharge 15 - +15 kV [1][2] [1] Device is qualified with 1000 pulses of 15 kV contact discharges each, according to the IEC 61000-4-2 model and far exceeds the specified level 4 (8 kV contact discharge). [2] A special robust test is performed stressing the devices with 1000 contact discharges according to the IEC 61000-4-2 model and far exceeds the specified level 4 (8 kV contact discharge). 2. Pinning information Table 2. Pin Pinning Description Simplified outline 1 cathode (diode 1) 2 cathode (diode 2) Graphic symbol [1] 1 2 006aab041 A1 A1 (1) (2) 001aao233 [1] The device is electrically and mechanically symmetrical. Thus no marking is needed. 3. Ordering information Table 3. Ordering information Type number Package Name Description IP4302CX2/A WLCSP2 wafer level chip-size package; 2 bumps (A1-A1) IP4302CX2_A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 28 November 2011 Version IP4302CX2/A © NXP B.V. 2011. All rights reserved. 2 of 10 IP4302CX2/A NXP Semiconductors Low profile bidirectional ESD protection diode 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VESD Conditions electrostatic discharge voltage Min Max Unit 15 +15 kV 15 +15 kV contact discharge 8 +8 kV air discharge 15 +15 kV [1][2] contact discharge air discharge IEC 61000-4-2 level 4 4 +4 kV Tj junction temperature - 150 C Tamb ambient temperature 35 +85 C Tstg storage temperature 65 +150 C MIL-STD-883D (method 3015) HBM [1] Device is qualified with 1000 pulses of 15 kV contact discharges each, according to the IEC 61000-4-2 model and far exceeds the specified level 4 (8 kV contact discharge). [2] A special robust test is performed stressing the devices with 1000 contact discharges according to the IEC 61000-4-2 model and far exceeds the specified level 4 (8 kV contact discharge). 5. Characteristics Table 5. Characteristics Tamb = 25 C; unless otherwise specified. Symbol Parameter ILR IP4302CX2_A Product data sheet reverse leakage current Conditions Min Typ Max Unit VRWM = 5 V - - 20 nA VRWM = 5 V 20 - - nA 14.0 16.5 - V VBR breakdown voltage IR = 1 mA IR = 1 mA - 16.5 14.0 V Cd diode capacitance f = 1 MHz; VR = 0 V - - All information provided in this document is subject to legal disclaimers. Rev. 1 — 28 November 2011 10 pF © NXP B.V. 2011. All rights reserved. 3 of 10 IP4302CX2/A NXP Semiconductors Low profile bidirectional ESD protection diode IPP −VCL −VBR −VRWM IR ILR −ILR −IR VRWM VBR VCL − + −IPP 008aaa270 Fig 1. V-I characteristics for a bidirectional ESD protection diode 6. Application information The IP4302CX2/A is designed for the protection of one bidirectional data or signal line from the damage caused by ESD. The device may be used on lines where the signal polarities are both, positive and negative with respect to ground. line to be protected DUT GND 008aaa272 Fig 2. Application diagram of IP4302CX2/A 6.1 Printed-Circuit Board (PCB) layout and protection device placement PCB layout is critical for the suppression of ESD and Electric Fast Transient (EFT). The following guidelines are recommended: 1. Place the device as close as possible to the input terminal or connector 2. The path length between the device and the protected line should be minimized 3. Keep parallel signal paths to a minimum 4. Avoid running protected conductors in parallel with unprotected conductors 5. Minimize all PCB conductive loops including power and ground loops 6. Minimize the length of the transient return path to ground 7. Avoid using shared transient return paths to a common ground point IP4302CX2_A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 28 November 2011 © NXP B.V. 2011. All rights reserved. 4 of 10 IP4302CX2/A NXP Semiconductors Low profile bidirectional ESD protection diode 8. Ground planes should be used whenever possible; for multilayer PCBs use ground vias 7. Package outline WLCSP2: wafer level chip-size package; 2 bumps (A1-A1) D E A A2 A1 detail X b1 A1 b e A1 X European projection wlcsp2_a1-a1_po Fig 3. Table 6. Package outline IP4302CX2/A (WLCSP2) Dimensions for Figure 3 Symbol Min Typ Max Unit A 0.37 0.40 0.43 mm A1 0.05 0.06 0.07 mm A2 0.32 0.34 0.36 mm b - 0.14 - mm b1 - 0.35 - mm D 0.49 0.52 0.55 mm E 0.67 0.70 0.73 mm e - 0.4 - mm IP4302CX2_A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 28 November 2011 © NXP B.V. 2011. All rights reserved. 5 of 10 IP4302CX2/A NXP Semiconductors Low profile bidirectional ESD protection diode 8. Soldering 8.1 Reflow soldering recommendation T (°C) Treflow(peak) 250 230 cooling rate 217 preheat t1 t (s) t2 t3 t4 t5 001aai943 The device is capable of withstanding at least three reflows with this profile. Fig 4. Pb-free solder reflow profile Table 7. IP4302CX2_A Product data sheet Characteristics Symbol Parameter Treflow(peak) peak reflow temperature t1 time 1 t2 time 2 t3 t4 Min Typ Max Unit 230 - 260 C soak time 60 - 180 s time during T 250 C - - 30 s time 3 time during T 230 C 10 - 50 s time 4 time during T > 217 C 30 - 150 s t5 time 5 dT/dt rate of change of temperature Conditions - - 540 s cooling rate - - 6 C/s preheat 2.5 - 4.0 C/s All information provided in this document is subject to legal disclaimers. Rev. 1 — 28 November 2011 © NXP B.V. 2011. All rights reserved. 6 of 10 IP4302CX2/A NXP Semiconductors Low profile bidirectional ESD protection diode 9. Abbreviations Table 8. Abbreviations Acronym Description DUT Device Under Test EFT Electric Fast Transient ESD ElectroStatic Discharge HBM Human Body Model PCB Printed-Circuit Board RoHS Restriction of Hazardous Substances SIM Subscriber Identity Module WLCSP Wafer-Level Chip-Scale Package 10. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes IP4302CX2_A v.1 20111128 Product data sheet - - IP4302CX2_A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 28 November 2011 © NXP B.V. 2011. All rights reserved. 7 of 10 IP4302CX2/A NXP Semiconductors Low profile bidirectional ESD protection diode 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 11.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. IP4302CX2_A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 28 November 2011 © NXP B.V. 2011. All rights reserved. 8 of 10 IP4302CX2/A NXP Semiconductors Low profile bidirectional ESD protection diode Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. ESD protection devices — These products are only intended for protection against ElectroStatic Discharge (ESD) pulses and are not intended for any other usage including, without limitation, voltage regulation applications. NXP Semiconductors accepts no liability for use in such applications and therefore such use is at the customer’s own risk. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] IP4302CX2_A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 28 November 2011 © NXP B.V. 2011. All rights reserved. 9 of 10 IP4302CX2/A NXP Semiconductors Low profile bidirectional ESD protection diode 13. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 6.1 7 8 8.1 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 4 Printed-Circuit Board (PCB) layout and protection device placement . . . . . . . . . . . 4 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Reflow soldering recommendation . . . . . . . . . . 6 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 28 November 2011 Document identifier: IP4302CX2_A