Ordering number : ENA1901A LV56801P Monolithic Linear IC Multi-Power Supply System IC for Car Audio Systems http://onsemi.com Overview The LV56801P is a multi-power supply system IC that provides four regulator outputs and two high side switches as well as a number of protection functions including overcurrent protection, overvoltage protection and overheat protection. It is an optimal power supply IC for car audio and car entertainment systems and similar products. Features • Four regulator output systems For microcontroller: 3.3V output voltage, 200mA maximum output current For CD drive: 8.0V output voltage, 1300mA maximum output current For illumination: 8 to 12V output voltage (output can be set with external resistors), 300mA maximum output current For audio systems: 8 to 9V output voltage (output voltage can be set with external resistors), 300mA maximum output current • Two VCC-linked high side switch systems EXT: 350mA maximum output current, 0.5V voltage difference between input and output. ANT: 300mA maximum output current, 0.5V voltage difference between input and output. • Two VDD 3.3V-linked high side switch systems SW5V: 200mA maximum output current, 0.25V voltage difference between input and output. ACC (accessory voltage detection output): 100mA maximum output current, 0.25V voltage difference between input and output. • Overcurrent protection function • Overvoltage protection function, typ 21V (excluding VDD 3.3V output) • Overheat protection function, typ 175ºC • On-chip accessory voltage detection circuit • P-channel LDMOS used for power output block CAUTION) The protection functions are provided in order to improve the ability of the ICs to withstand breakdown, and they are not intended to guarantee safety when used under conditions outside the safe operating area or rated operating conditions. Use of the ICs under any conditions exceeding the safe operating area or above the IOmax, and especially use in overcurrent protection areas or under conditions in which they are subject to thermal protection, may reduce their reliability and result in permanent breakdown. Semiconductor Components Industries, LLC, 2013 August, 2013 O2611 SY 20111014-S00003/D2210 SY 20101201-S00007 No.A1901-1/14 LV56801P Specifications Absolute Maximum Ratings at Ta = 25°C Parameter Conditions Conditions Ratings Supply voltage VCC max Peak supply voltage VCC peak See below for the waveform applied. Allowable Power dissipation Pd max Independent IC Ta ≤ 25°C Al heat sink * With an infinity heat sink Unit 36 V 50 V 1.5 W 5.6 W 32.5 W Junction temperature Tj max 150 °C Operating ambient temperature Topr -40 to +85 °C Storage temperature Tstg -55 to +150 °C * : When the Aluminum heat sink (50mm × 50mm × 1.5mm) is used Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Allowable Operating range at Ta = 25°C Parameter Conditions Ratings Unit Operating supply voltage 1 VDD output, SW output, ACC output 7.5 to 16 Operating supply voltage 2 ILM output at 10V 12 to 16 V ILM output at 8V 10 to 16 V Operating supply voltage 3 Audio output at 9V Operating supply voltage 4 CD output (CD output current = 1.3A) CD output (CD output current ≤ 1A) V 10 to 16 V 10.5 to 16 V 10 to 16 V Electrical Characteristics at Ta = 25°C, VCC = 14.4V *: All the specifications are defined based on the tests that Tj is almost equal to Ta (=25°C). To suppress the rise of Tj in the junction temperature as much as possible, it tests by the pulse loading. Parameter Symbol Ratings Conditions min Current drain ICC typ VDD no load, CTRL1/2 = ⎡L/L⎦, ACC = 0V Unit max μA 400 800 0.5 V 1.4 V V CTRL1 Input Low input voltage VIL1 M1 input voltage VIM11 0.8 0 1.1 M2 input voltage VIM21 1.9 2.2 2.5 High input voltage VIH1 2.9 3.3 5.5 V Input impedance RIH1 350 500 650 kΩ 0.5 V 1.65 2.1 V CTRL2 Input Low input voltage VIL2 0 M input voltage VIM2 1.1 High input voltage VIH2 2.5 3.3 5.5 V Input impedance RIH2 350 500 650 kΩ VDD 3.3V Output *1 The VDD 3.3V output supplies the output currents of SW 3.3V and ACC 3.3V. Output voltage 1 VO1 IO1 = 200mA, IO7, IO8 = 0A 3.13 3.3 3.47 Output voltage 2 VO1’ IO1 = 200mA, IO7 = 200mA, IO8 = 100mA 3.13 3.3 3.47 Output total current Ito1 VO1 ≥ 3.13V, Ito1 = IO1+IO7+IO8 500 Line regulation ΔVOLN1 7.5V < VCC < 16V, IO1 = 200mA *2 30 90 mV Load regulation ΔVOLD1 1mA < IO1 < 200mA *2 70 150 mV Dropout voltage 1 VDROP1 IO1 = 200mA *2 1.0 1.5 V Dropout voltage 2 VDROP1’ IO1 = 100mA *2 0.7 1.05 V 2.5 3.75 Dropout voltage 3 VDROP1” IO1+IO7+IO8 = 500mA Ripple rejection RREJ1 f = 120Hz, IO1 = 200mA *2 40 V V mA 50 V dB CD Output ; CTRL2 = ⎡H⎦ Output voltage VO2 IO2 = 1000mA 7.6 8.0 8.4 V *1 : The VDD 3.3V output also supplies the output currents of SW 3.3V and ACC 3.3V. Therefore, the current supply capability of the VDD 3.3V output and its other electrical characteristics are affected by the output statuses of SW 3.3V and ACC 3.3V. *2 : SW 3.3V and ACC 3.3V are not subject to a load. Continued on next page. No.A1901-2/14 LV56801P Continued from preceding page. Parameter Symbol Ratings Conditions min Output current IO2 VO2 ≥ 7.6V Line regulation ΔVOLN2 10.5V < VCC < 16V, IO2 = 1000mA Load regulation ΔVOLD2 Dropout voltage 1 Dropout voltage 2 Ripple rejection RREJ2 f = 120Hz, IO2 = 1000mA typ Unit max 1300 mA 50 100 mV 10mA < IO2 < 1000mA 100 200 mV VDROP2 IO2 = 1000mA 1.0 1.5 V VDROP2’ IO2 = 500mA 0.5 0.75 40 50 1.222 1.260 V dB AUDIO (8-9V) Output ; CTRL2 = ⎡M⎦ AUDIO_F pin voltage VI 3 AUDIO_F pin inflow current IIN3 AUDIO output voltage 1 VO3 AUDIO output voltage 2 AUDIO output voltage 3 AUDIO output current IO3 Line regulation ΔVOLN3 10V < VCC < 16V, IO3 = 200mA 30 90 mV Load regulation ΔVOLD3 1mA < IO3 < 200mA 70 150 mV Dropout voltage 1 VDROP3 IO3 = 200mA 0.3 0.45 V 0.15 0.23 -1 1.298 V 1 μA IO3 = 200mA, R2 = 30kΩ, R3 = 5.6kΩ *3 7.65 8.0 8.35 V VO3’ IO3 = 200mA, R2 = 27kΩ, R3 = 4.7kΩ *3 8.13 8.5 8.87 V VO3” IO3 = 200mA, R2 = 24kΩ, R3 = 3.9kΩ *3 8.6 9.0 9.4 300 Dropout voltage 2 VDROP3’ IO3 = 100mA Ripple rejection RREJ3 f = 120Hz, IO3 = 200mA V mA V 40 50 dB 1.222 1.260 1.298 V 11.4 12.0 12.6 V 8.5 10.0 11.5 V 8.0 9.2 ILM (8-12V) Output ; CTRL1 = ⎡M1⎦ ILM_F pin voltage VI4 ILM output voltage 1 VO4 IO4 = 200mA ILM output voltage 2 VO4’ IO4 = 200mA, R1 = 270kΩ *4 ILM output voltage 3 VO4” IO4 = 200mA, R1 = 100kΩ *4 6.8 ILM output current IO4 R1 = 270kΩ 300 V Line regulation ΔVOLN4 12V < VCC < 16V, IO4 = 200mA, R1 = 270kΩ 30 90 mV Load regulation ΔVOLD4 1mA < IO4 < 200mA 70 150 mV Dropout voltage 1 VDROP4 IO4 = 200mA 0.7 1.05 V Dropout voltage 2 VDROP4’ IO4 = 100mA 0.35 0.53 Ripple rejection RREJ4 f = 120Hz, IO4 = 200mA Output voltage VO5 IO5 = 350mA Output current IO5 VO5 ≥ VCC-1.0 Output voltage VO6 IO6 = 300mA Output current IO6 VO6 ≥ VCC-1.0 Output voltage 1 VO7 IO7 = 1mA, IO1, IO8 = 0A *5 VO1-0.1 VO1 V Output voltage 2 VO7’ IO7 = 80mA, IO1, IO8 = 0A *5 VO1-0.22 VO1-0.1 V VO1-0.55 VO1-0.25 mA 40 50 VCC-1.0 VCC-0.5 V dB Remoto (EXT) ; CTRL1 = ⎡M2⎦ V 350 mA ANT remoto ; CTRL1 = ⎡H⎦ VCC-1.0 VCC-0.5 V 300 mA SW 3.3V Output ; CTRL2 = ⎡M⎦ Output voltage 3 VO7’’ IO7 = 200mA, IO1, IO8 = 0A *5 Output current IO7 VO7 ≥ 2.88 V 200 mA ACC Detection ; ACC Integration 3.3V output ACC detection voltage VTH8 2.75 3.0 3.25 Hysteresis width VHIS8 Input impedance ZI8 (Pull-down resistance internal) ACC output voltage 1 VO8 ACC output voltage 2 ACC output voltage 3 ACC output voltage 0.2 0.3 0.4 V 42 60 78 kΩ IO8 = 0.5mA, IO1, IO7 = 0A *5 VO1-0.1 VO1 V VO8’ IO8 = 40mA, IO1, IO7 = 0A *5 VO1-0.22 VO1-0.1 V VO8’’ IO8 = 100mA, IO1, IO7 = 0A *5 VO1-0.55 VO1-0.25 IO8 VO8 ≥ 2.88 100 V V mA *3 : When a component with a resistance accuracy of ±1% is used <Reference> When a component with a resistance accuracy of ±0.5% is used, VO3” is 8.67V ≤ 9.0V ≤ 9.33V. *4 : When a component with a resistance accuracy of ±1% is used The absolute accuracy of the internal resistance is ±15%. *5 : Since the SW 3.3V and ACC 3.3V are output from VDD 3.3V through the SW, the voltage drops by an amount equivalent to the ON resistance of the SW. No.A1901-3/14 LV56801P Package Dimensions unit : mm (typ) 3395 • Allowable power dissipation derating curve Pd max -- Ta (20.0) HEAT SPREADER HEAT SINK (15.8) 3.0 (11.0) 3.35 12.4 (9.05) (14.55) 17.9 (9.6) (R1.75) 1 0.4 15 (1.91) 1.27 2.54 2.54 0.7 Allowable power dissipation, Pd max -- W 8 21.6 Aluminum heat sink mounting conditions tightening torque : 39N⋅cm, using silicone grease 7 Aluminum heat sink (50 × 50 × 1.5mm3) when using 6 5.6 5 4 3 2 Independent IC 1.5 1 0 0 20 40 60 80 100 120 140 150 160 Ambient temperature, Ta -- °C SANYO : HZIP15J • Waveform applied during surge test 50V 90% 10% 16V 5msec 100msec No.A1901-4/14 LV56801P Block Diagram +B VCC + C1 7 C2 EXT out Remote EXT (VCC-0.5V) D1 350mA 15 ANT out Over Voltage Protection D2 ANT Remote (VCC-0.5V) D3 300mA 14 + D4 C4 Start up + Vref + C3 1 ILM output (8V to 12V) 300mA + R1 C5 C6 2 ILM_F + 5 CTRL1 8 (four-value control) AUDIO output (8V to 9V) 300mA + R2 C7 C8 4 AUDIO_F R3 OUTPUT CTRL2 6 (three-value control) Control + 3 + Thermal CD output (8V) 1300mA + C9 C10 VDD output (3.3V) 200mA 12 + C11 C12 Shut Down GND 9 SW output (3.3V) 13 200mA ACC 10 + ACC output (3.3V) 11 Output Current Limit Circuit 100mA Pin Function Pin No. 1 Pin name ILM Description Equivalent Circuit ILM output pin ON when CTRL1 = M1, M2, H VCC 7 12.0V/300mA 1 59.67kΩ 2 ILM_F ILM output voltage adjustment pin 2 7kΩ 9 GND Continued on next page. No.A1901-5/14 LV56801P Continued from preceding page. Pin No. 3 Pin name CD Description Equivalent Circuit CD output pin VCC 7 ON when CTRL2 = M, H 8.0V/1.3A 3 214kΩ 40kΩ 4 AUDIO_F 9 GND 7 VCC AUIDO output voltage adjustment pin 5 5 AUDIO AUDIO output pin ON when CTRL2 = M, H 4 9 6 CTRL2 GND CTRL2 input pin VCC 7 three-value input 6 500kΩ 9 7 VCC 8 CTRL1 GND Supply terminal CTRL1 input pin four-value input VCC 7 8 500kΩ 9 9 GND GND GND pin Continued on next page. No.A1901-6/14 LV56801P Continued from preceding page. Pin No. 10 Pin name ACC Description Equivalent Circuit Accessory input VCC 7 10 45kΩ 15kΩ 9 11 12 ACC3.3V VDD3.3V GND Accessory detection output ON when ACC > 3V 7 VDD3.3V output pin 3.3V/200mA 12 VCC 371kΩ 11 13 SW3.3V SW3.3V output pin 13 125kΩ ON when CTRL2 = M, H 50kΩ 50kΩ 9 14 ANT GND ANT output pin ON when CTRL1 = H 7 VCC VCC-0.5V/300mA 14 15 EXT EXT output pin ON when CTRL1 = M2, H 9 GND 7 VCC VCC-0.5V/350mA 15 9 GND No.A1901-7/14 LV56801P CTRL Pin Output Truth Table CTRL1 ANT EXT ILM CTRL2 CD AUDIO SW5 L OFF OFF OFF L OFF OFF OFF M1 OFF OFF ON M OFF ON ON M2 OFF ON ON H ON ON ON H ON ON ON Timing Chart 21V VCC (Pin 7) VDD3.3V output (Pin 12) CTRL1 input (Pin 8) CTRL2 input (Pin 6) CD output (Pin 3) AUDIO output (Pin 5) ILM output (Pin 1) EXT output (Pin 15) ANT output (Pin 14) SW3.3V output (Pin 13) ACC input (Pin 10) 3.0V 2.7V ACC output (Pin 11) No.A1901-8/14 LV56801P R1 R3 C11 + C12 ILM CD EXT 12 11 ANT SW3.3V VDD3.3V CTRL1 ACC 10 9 14 13 R2 15 + C4 CTRL2 C6 + C7 8 7 ACC3.3V 6 5 GND 4 3 VCC CTRL2 AUDIO 2 1 CD ILM ILM_F AUDIO_F Recommended Operation Circuit C9 + C10 AUDIO CTRL1 ACC ACC3.3V + C3 SW3.3V D3 D1 D4 D2 C13 + C14 C1 + C2 VDD3.3V VCC ANT EXT Peripheral parts list Name of part Recommended value Remarks C1 Power supply bypass capacitor Description 100μF or more These capacitors must be placed near C2 Oscillation prevention capacitor 0.22μF or more the VCC and GND pins. C3 EXT output stabilization capacitor 2.2μF or more C4 ANT output stabilization capacitor 2.2μF or more C5, C7, C9, C11 Output stabilization capacitor 4.7μF or more Electrolytic capacitor * C6, C8, C10, C12 Output stabilization capacitor 0.22μF or more Ceramic capacitor * R1 Resistor for ILM voltage adjustment ILM output voltage A resistor with resistance accuracy as R1:without = 12.0V low as less than ±1% must be used. :270kΩ = 10.0V :100kΩ = 8.0V AUDIO output voltage R2, R3 Resistor for AUDIO voltage setting R2/R3:30kΩ/5.6kΩ = 8.0V :27kΩ/4.7kΩ = 8.5V A resistor with resistance accuracy as low as less than ±1% must be used. :24kΩ/3.9kΩ = 9.0V D1, D2, D3, D4 Diode for internal device breakdown protection * : In order to stabilize the regulator outputs, it is recommended that the electrolytic capacitor and ceramic capacitor be connected in parallel. Furthermore, the values listed above do not guarantee stabilization during the overcurrent protection operations of the regulator, so oscillation may occur during an overcurrent protection operation. No.A1901-9/14 LV56801P • ILM output voltage setting method Formula for ILM voltage calculation Z1 = R2 //R3 = 1 ILM R2 59.67kΩ ILM = R3 Z1=R2/R3 1.26V 2 ILM_F Z1 = R2 ⋅ R3 R2 + R3 1.26[V ] × Z1 + 1.26[V ] R1 (ILM − 1.26) ⋅ R1 1.26 R3 = R2 ⋅ Z 1 R2 − Z 1 Example : ILM = 9V setting method R1 7kΩ Z1 = (9V − 1.26V )⋅ 7kΩ ≅ 43kΩ 1.26V The ILM_F voltage is determined by the internal band gap voltage of the IC (typ = 1.26V). When R3 = 150k, the ILM output voltage will be as follows: 59.67 kΩ ⋅150kΩ Z1′ = ≅ 42.69kΩ 59.67 kΩ + 150kΩ ILM = 1.26V × 42.69kΩ + 1.26V ≅ 8.94V 7 kΩ • AUDIO output voltage setting method Formula for AUDIO voltage calculation AUDIO = 5 1.26[V ] × R1 + 1.26[V ] R2 R1 ( AUDIO − 1.26 ) = 1.26 R2 AUDIO R1 1.26V 4 The circuit must be designed in such a way that the R1:R2 ratio satisfies the formula given above for the AUDIO voltage that has been set. AUDIO_F R2 Example : AUDIO = 8.5V setting method The AUDIO_F voltage is determined by the internal band gap voltage of the IC (typ = 1.26V). R1 (8.5 − 1.26 ) = ≅ 5.75 R2 1.26 R1 27 kΩ = ≅ 5.74 R2 4.7 kΩ AUDIO = 1.26V × 5.74 + 1.26V ≅ 8.49V Note : In the above, the typical values are given in all instances for the values used and, as such, they will vary due to the effects of production-related variations of the IC and external resistors. No.A1901-10/14 LV56801P • CTRL1 Application Circuit Example (1) 3.3V input: R1 = 4.7kΩ, R2 = 10kΩ R1 A R2 CTRL1 B A B 0V 0V CTRL1 0V 0V 3.3V 1.05V 3.3V 0V 2.23V 3.3V 3.3V 3.20V 500kΩ • CTRL2 Application Circuit Example (1) 3.3V input: R3 = R4 = 4.7kΩ C R3 R4 CTRL2 D A B CTRL2 0V 0V 0V 0V 3.3V 1.61V 3.3V 0V 1.61V 3.3V 3.3V 3.29V 500kΩ Caution for implementing LV56801P to a system board In HZIP15J, the package used in this IC, there are several metal exposure other than the connection pins and heat-sinks as shown in the following diagrams. In the diagrams, the electric potential of 2 and 3 are the same as Pin15 and Pin1, respectively. 2 (=Pin15) is EXT pin and 3 (=Pin1) is ILM output (regulator). When the IC is implemented to the system, make sure that no attachment clamp touches the exposed Pin1/ Pin15. When the exposed Pin1/ Pin15 touch the attachment clamp (same electrical potential as GND), ILM output or VCC enter the same state as time when GND was shorted. The electric potential of the exposed metal connected to heat-sinks 1 is the same as that of sub board of the IC (GND). Therefore, even if the exposed metal and GND of the system board are adjacent to each other, there should be no problem. • HZIP15J external view Heat-sink 1 Same potential 2 15PIN Same potential 1PIN 3 Same potential Heat-sink 1 Same potential Heat-sink side 1 Heat-sink Same potential :Metal exposure Heat-sink side :Metal exposure <Top view of HZIP15J> <Side view of HZIP15J> No.A1901-11/14 LV56801P • Frame diagram (LV56801P) *In the system power supply other than LV56801P, pin assignment may differ. Metal exposure 1 Metal exposure 3 Metal exposure 2 Metal exposure 1 LV56801 Metal exposure 1 Metal exposure 1 1PIN 15PIN No.A1901-12/14 LV56801P HZIP15J Heat sink attachment Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be applied to the heat sink or tabs. b. Heat sink attachment · Use flat-head screws to attach heat sinks. · Use also washer to protect the package. · Use tightening torques in the ranges 39-59Ncm(4-6kgcm) . · If tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. · Do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Take care a position of via hole . · Do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Verify that there are no press burrs or screw-hole burrs on the heat sink. · Warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for either concave or convex warping. · Twisting must be limited to under 0.05 mm. · Heat sink and semiconductor device are mounted in parallel. Take care of electric or compressed air drivers · The speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. Binding head machine screw Countersunk head mashine screw Heat sink gap Via hole c. Silicone grease · Spread the silicone grease evenly when mounting heat sinks. · Our company recommends YG-6260 (Momentive Performance Materials Japan LLC) d. Mount · First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. · When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. e. When mounting the semiconductor device to the heat sink using jigs, etc., · Take care not to allow the device to ride onto the jig or positioning dowel. · Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device. f. Heat sink screw holes · Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. · When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. A hole diameter about 15% larger than the diameter of the screw is desirable. · When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about 15% smaller than the diameter of the screw is desirable. g. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not recommended because of possible displacement due to fluctuation of the spring force with time or vibration. No.A1901-13/14 LV56801P ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PS No.A1901-14/14