LV56801P D

Ordering number : ENA1901A
LV56801P
Monolithic Linear IC
Multi-Power Supply System IC
for Car Audio Systems
http://onsemi.com
Overview
The LV56801P is a multi-power supply system IC that provides four regulator outputs and two high side switches as
well as a number of protection functions including overcurrent protection, overvoltage protection and overheat
protection. It is an optimal power supply IC for car audio and car entertainment systems and similar products.
Features
• Four regulator output systems
For microcontroller: 3.3V output voltage, 200mA maximum output current
For CD drive: 8.0V output voltage, 1300mA maximum output current
For illumination: 8 to 12V output voltage (output can be set with external resistors), 300mA maximum output
current
For audio systems: 8 to 9V output voltage (output voltage can be set with external resistors), 300mA maximum
output current
• Two VCC-linked high side switch systems
EXT: 350mA maximum output current, 0.5V voltage difference between input and output.
ANT: 300mA maximum output current, 0.5V voltage difference between input and output.
• Two VDD 3.3V-linked high side switch systems
SW5V: 200mA maximum output current, 0.25V voltage difference between input and output.
ACC (accessory voltage detection output): 100mA maximum output current, 0.25V voltage difference between
input and output.
• Overcurrent protection function
• Overvoltage protection function, typ 21V (excluding VDD 3.3V output)
• Overheat protection function, typ 175ºC
• On-chip accessory voltage detection circuit
• P-channel LDMOS used for power output block
CAUTION)
The protection functions are provided in order to improve the ability of the ICs to withstand breakdown, and they are not intended to guarantee
safety when used under conditions outside the safe operating area or rated operating conditions.
Use of the ICs under any conditions exceeding the safe operating area or above the IOmax, and especially use in overcurrent protection areas or
under conditions in which they are subject to thermal protection, may reduce their reliability and result in permanent breakdown.
Semiconductor Components Industries, LLC, 2013
August, 2013
O2611 SY 20111014-S00003/D2210 SY 20101201-S00007 No.A1901-1/14
LV56801P
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Conditions
Conditions
Ratings
Supply voltage
VCC max
Peak supply voltage
VCC peak
See below for the waveform applied.
Allowable Power dissipation
Pd max
Independent IC
Ta ≤ 25°C
Al heat sink *
With an infinity heat sink
Unit
36
V
50
V
1.5
W
5.6
W
32.5
W
Junction temperature
Tj max
150
°C
Operating ambient temperature
Topr
-40 to +85
°C
Storage temperature
Tstg
-55 to +150
°C
* : When the Aluminum heat sink (50mm × 50mm × 1.5mm) is used
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Allowable Operating range at Ta = 25°C
Parameter
Conditions
Ratings
Unit
Operating supply voltage 1
VDD output, SW output, ACC output
7.5 to 16
Operating supply voltage 2
ILM output at 10V
12 to 16
V
ILM output at 8V
10 to 16
V
Operating supply voltage 3
Audio output at 9V
Operating supply voltage 4
CD output (CD output current = 1.3A)
CD output (CD output current ≤ 1A)
V
10 to 16
V
10.5 to 16
V
10 to 16
V
Electrical Characteristics at Ta = 25°C, VCC = 14.4V
*: All the specifications are defined based on the tests that Tj is almost equal to Ta (=25°C). To suppress the rise of Tj in the junction
temperature as much as possible, it tests by the pulse loading.
Parameter
Symbol
Ratings
Conditions
min
Current drain
ICC
typ
VDD no load, CTRL1/2 = ⎡L/L⎦, ACC = 0V
Unit
max
μA
400
800
0.5
V
1.4
V
V
CTRL1 Input
Low input voltage
VIL1
M1 input voltage
VIM11
0.8
0
1.1
M2 input voltage
VIM21
1.9
2.2
2.5
High input voltage
VIH1
2.9
3.3
5.5
V
Input impedance
RIH1
350
500
650
kΩ
0.5
V
1.65
2.1
V
CTRL2 Input
Low input voltage
VIL2
0
M input voltage
VIM2
1.1
High input voltage
VIH2
2.5
3.3
5.5
V
Input impedance
RIH2
350
500
650
kΩ
VDD 3.3V Output *1
The VDD 3.3V output supplies the output currents of SW 3.3V and ACC 3.3V.
Output voltage 1
VO1
IO1 = 200mA, IO7, IO8 = 0A
3.13
3.3
3.47
Output voltage 2
VO1’
IO1 = 200mA, IO7 = 200mA, IO8 = 100mA
3.13
3.3
3.47
Output total current
Ito1
VO1 ≥ 3.13V, Ito1 = IO1+IO7+IO8
500
Line regulation
ΔVOLN1
7.5V < VCC < 16V, IO1 = 200mA *2
30
90
mV
Load regulation
ΔVOLD1
1mA < IO1 < 200mA *2
70
150
mV
Dropout voltage 1
VDROP1
IO1 = 200mA *2
1.0
1.5
V
Dropout voltage 2
VDROP1’
IO1 = 100mA *2
0.7
1.05
V
2.5
3.75
Dropout voltage 3
VDROP1”
IO1+IO7+IO8 = 500mA
Ripple rejection
RREJ1
f = 120Hz, IO1 = 200mA *2
40
V
V
mA
50
V
dB
CD Output ; CTRL2 = ⎡H⎦
Output voltage
VO2
IO2 = 1000mA
7.6
8.0
8.4
V
*1 : The VDD 3.3V output also supplies the output currents of SW 3.3V and ACC 3.3V. Therefore, the current supply capability of the VDD 3.3V output and its
other electrical characteristics are affected by the output statuses of SW 3.3V and ACC 3.3V.
*2 : SW 3.3V and ACC 3.3V are not subject to a load.
Continued on next page.
No.A1901-2/14
LV56801P
Continued from preceding page.
Parameter
Symbol
Ratings
Conditions
min
Output current
IO2
VO2 ≥ 7.6V
Line regulation
ΔVOLN2
10.5V < VCC < 16V, IO2 = 1000mA
Load regulation
ΔVOLD2
Dropout voltage 1
Dropout voltage 2
Ripple rejection
RREJ2
f = 120Hz, IO2 = 1000mA
typ
Unit
max
1300
mA
50
100
mV
10mA < IO2 < 1000mA
100
200
mV
VDROP2
IO2 = 1000mA
1.0
1.5
V
VDROP2’
IO2 = 500mA
0.5
0.75
40
50
1.222
1.260
V
dB
AUDIO (8-9V) Output ; CTRL2 = ⎡M⎦
AUDIO_F pin voltage
VI 3
AUDIO_F pin inflow current
IIN3
AUDIO output voltage 1
VO3
AUDIO output voltage 2
AUDIO output voltage 3
AUDIO output current
IO3
Line regulation
ΔVOLN3
10V < VCC < 16V, IO3 = 200mA
30
90
mV
Load regulation
ΔVOLD3
1mA < IO3 < 200mA
70
150
mV
Dropout voltage 1
VDROP3
IO3 = 200mA
0.3
0.45
V
0.15
0.23
-1
1.298
V
1
μA
IO3 = 200mA, R2 = 30kΩ, R3 = 5.6kΩ *3
7.65
8.0
8.35
V
VO3’
IO3 = 200mA, R2 = 27kΩ, R3 = 4.7kΩ *3
8.13
8.5
8.87
V
VO3”
IO3 = 200mA, R2 = 24kΩ, R3 = 3.9kΩ *3
8.6
9.0
9.4
300
Dropout voltage 2
VDROP3’
IO3 = 100mA
Ripple rejection
RREJ3
f = 120Hz, IO3 = 200mA
V
mA
V
40
50
dB
1.222
1.260
1.298
V
11.4
12.0
12.6
V
8.5
10.0
11.5
V
8.0
9.2
ILM (8-12V) Output ; CTRL1 = ⎡M1⎦
ILM_F pin voltage
VI4
ILM output voltage 1
VO4
IO4 = 200mA
ILM output voltage 2
VO4’
IO4 = 200mA, R1 = 270kΩ *4
ILM output voltage 3
VO4”
IO4 = 200mA, R1 = 100kΩ *4
6.8
ILM output current
IO4
R1 = 270kΩ
300
V
Line regulation
ΔVOLN4
12V < VCC < 16V, IO4 = 200mA, R1 = 270kΩ
30
90
mV
Load regulation
ΔVOLD4
1mA < IO4 < 200mA
70
150
mV
Dropout voltage 1
VDROP4
IO4 = 200mA
0.7
1.05
V
Dropout voltage 2
VDROP4’
IO4 = 100mA
0.35
0.53
Ripple rejection
RREJ4
f = 120Hz, IO4 = 200mA
Output voltage
VO5
IO5 = 350mA
Output current
IO5
VO5 ≥ VCC-1.0
Output voltage
VO6
IO6 = 300mA
Output current
IO6
VO6 ≥ VCC-1.0
Output voltage 1
VO7
IO7 = 1mA, IO1, IO8 = 0A *5
VO1-0.1
VO1
V
Output voltage 2
VO7’
IO7 = 80mA, IO1, IO8 = 0A *5
VO1-0.22
VO1-0.1
V
VO1-0.55
VO1-0.25
mA
40
50
VCC-1.0
VCC-0.5
V
dB
Remoto (EXT) ; CTRL1 = ⎡M2⎦
V
350
mA
ANT remoto ; CTRL1 = ⎡H⎦
VCC-1.0
VCC-0.5
V
300
mA
SW 3.3V Output ; CTRL2 = ⎡M⎦
Output voltage 3
VO7’’
IO7 = 200mA, IO1, IO8 = 0A *5
Output current
IO7
VO7 ≥ 2.88
V
200
mA
ACC Detection ; ACC Integration 3.3V output
ACC detection voltage
VTH8
2.75
3.0
3.25
Hysteresis width
VHIS8
Input impedance
ZI8
(Pull-down resistance internal)
ACC output voltage 1
VO8
ACC output voltage 2
ACC output voltage 3
ACC output voltage
0.2
0.3
0.4
V
42
60
78
kΩ
IO8 = 0.5mA, IO1, IO7 = 0A *5
VO1-0.1
VO1
V
VO8’
IO8 = 40mA, IO1, IO7 = 0A *5
VO1-0.22
VO1-0.1
V
VO8’’
IO8 = 100mA, IO1, IO7 = 0A *5
VO1-0.55
VO1-0.25
IO8
VO8 ≥ 2.88
100
V
V
mA
*3 : When a component with a resistance accuracy of ±1% is used
<Reference> When a component with a resistance accuracy of ±0.5% is used, VO3” is 8.67V ≤ 9.0V ≤ 9.33V.
*4 : When a component with a resistance accuracy of ±1% is used
The absolute accuracy of the internal resistance is ±15%.
*5 : Since the SW 3.3V and ACC 3.3V are output from VDD 3.3V through the SW, the voltage drops by an amount equivalent to the ON resistance of the SW.
No.A1901-3/14
LV56801P
Package Dimensions
unit : mm (typ)
3395
• Allowable power dissipation derating curve
Pd max -- Ta
(20.0)
HEAT SPREADER
HEAT SINK
(15.8)
3.0
(11.0)
3.35
12.4
(9.05)
(14.55)
17.9
(9.6)
(R1.75)
1
0.4
15
(1.91)
1.27
2.54 2.54
0.7
Allowable power dissipation, Pd max -- W
8
21.6
Aluminum heat sink mounting conditions
tightening torque : 39N⋅cm, using silicone grease
7
Aluminum heat sink (50 × 50 × 1.5mm3) when using
6
5.6
5
4
3
2
Independent IC
1.5
1
0
0
20
40
60
80
100
120
140 150 160
Ambient temperature, Ta -- °C
SANYO : HZIP15J
• Waveform applied during surge test
50V
90%
10%
16V
5msec
100msec
No.A1901-4/14
LV56801P
Block Diagram
+B
VCC
+
C1
7
C2
EXT
out
Remote EXT (VCC-0.5V)
D1 350mA
15
ANT
out
Over
Voltage
Protection
D2
ANT Remote (VCC-0.5V)
D3 300mA
14
+
D4
C4
Start
up
+
Vref
+
C3
1
ILM output (8V to 12V)
300mA
+
R1 C5
C6
2
ILM_F
+
5
CTRL1
8
(four-value control)
AUDIO output (8V to 9V)
300mA
+
R2 C7
C8
4
AUDIO_F
R3
OUTPUT
CTRL2
6
(three-value control)
Control
+
3
+
Thermal
CD output (8V)
1300mA
+
C9
C10
VDD output (3.3V)
200mA
12
+
C11
C12
Shut Down
GND
9
SW output (3.3V)
13
200mA
ACC
10
+
ACC output (3.3V)
11
Output Current Limit Circuit
100mA
Pin Function
Pin No.
1
Pin name
ILM
Description
Equivalent Circuit
ILM output pin
ON when CTRL1 = M1, M2, H
VCC
7
12.0V/300mA
1
59.67kΩ
2
ILM_F
ILM output voltage adjustment pin
2
7kΩ
9
GND
Continued on next page.
No.A1901-5/14
LV56801P
Continued from preceding page.
Pin No.
3
Pin name
CD
Description
Equivalent Circuit
CD output pin
VCC
7
ON when CTRL2 = M, H
8.0V/1.3A
3
214kΩ
40kΩ
4
AUDIO_F
9
GND
7
VCC
AUIDO output voltage adjustment pin
5
5
AUDIO
AUDIO output pin
ON when CTRL2 = M, H
4
9
6
CTRL2
GND
CTRL2 input pin
VCC
7
three-value input
6
500kΩ
9
7
VCC
8
CTRL1
GND
Supply terminal
CTRL1 input pin
four-value input
VCC
7
8
500kΩ
9
9
GND
GND
GND pin
Continued on next page.
No.A1901-6/14
LV56801P
Continued from preceding page.
Pin No.
10
Pin name
ACC
Description
Equivalent Circuit
Accessory input
VCC
7
10
45kΩ
15kΩ
9
11
12
ACC3.3V
VDD3.3V
GND
Accessory detection output
ON when ACC > 3V
7
VDD3.3V output pin
3.3V/200mA
12
VCC
371kΩ
11
13
SW3.3V
SW3.3V output pin
13
125kΩ
ON when CTRL2 = M, H
50kΩ 50kΩ
9
14
ANT
GND
ANT output pin
ON when CTRL1 = H
7
VCC
VCC-0.5V/300mA
14
15
EXT
EXT output pin
ON when CTRL1 = M2, H
9
GND
7
VCC
VCC-0.5V/350mA
15
9
GND
No.A1901-7/14
LV56801P
CTRL Pin Output Truth Table
CTRL1
ANT
EXT
ILM
CTRL2
CD
AUDIO
SW5
L
OFF
OFF
OFF
L
OFF
OFF
OFF
M1
OFF
OFF
ON
M
OFF
ON
ON
M2
OFF
ON
ON
H
ON
ON
ON
H
ON
ON
ON
Timing Chart
21V
VCC
(Pin 7)
VDD3.3V output
(Pin 12)
CTRL1 input
(Pin 8)
CTRL2 input
(Pin 6)
CD output
(Pin 3)
AUDIO output
(Pin 5)
ILM output
(Pin 1)
EXT output
(Pin 15)
ANT output
(Pin 14)
SW3.3V output
(Pin 13)
ACC input
(Pin 10)
3.0V
2.7V
ACC output
(Pin 11)
No.A1901-8/14
LV56801P
R1
R3
C11 + C12
ILM
CD
EXT
12
11
ANT
SW3.3V
VDD3.3V
CTRL1
ACC
10
9
14
13
R2
15
+
C4
CTRL2
C6 + C7
8
7
ACC3.3V
6
5
GND
4
3
VCC
CTRL2
AUDIO
2
1
CD
ILM
ILM_F
AUDIO_F
Recommended Operation Circuit
C9 + C10
AUDIO
CTRL1
ACC ACC3.3V
+
C3
SW3.3V
D3
D1
D4
D2
C13 + C14
C1 + C2
VDD3.3V
VCC
ANT
EXT
Peripheral parts list
Name of part
Recommended value
Remarks
C1
Power supply bypass capacitor
Description
100μF or more
These capacitors must be placed near
C2
Oscillation prevention capacitor
0.22μF or more
the VCC and GND pins.
C3
EXT output stabilization capacitor
2.2μF or more
C4
ANT output stabilization capacitor
2.2μF or more
C5, C7, C9, C11
Output stabilization capacitor
4.7μF or more
Electrolytic capacitor *
C6, C8, C10, C12
Output stabilization capacitor
0.22μF or more
Ceramic capacitor *
R1
Resistor for ILM voltage adjustment
ILM output voltage
A resistor with resistance accuracy as
R1:without = 12.0V
low as less than ±1% must be used.
:270kΩ = 10.0V
:100kΩ = 8.0V
AUDIO output voltage
R2, R3
Resistor for AUDIO voltage setting
R2/R3:30kΩ/5.6kΩ = 8.0V
:27kΩ/4.7kΩ = 8.5V
A resistor with resistance accuracy as
low as less than ±1% must be used.
:24kΩ/3.9kΩ = 9.0V
D1, D2, D3, D4
Diode for internal device breakdown protection
* : In order to stabilize the regulator outputs, it is recommended that the electrolytic capacitor and ceramic capacitor be connected in parallel.
Furthermore, the values listed above do not guarantee stabilization during the overcurrent protection operations of the regulator, so oscillation may occur
during an overcurrent protection operation.
No.A1901-9/14
LV56801P
• ILM output voltage setting method
Formula for ILM voltage calculation
Z1 = R2 //R3 =
1
ILM
R2 59.67kΩ
ILM =
R3
Z1=R2/R3
1.26V
2
ILM_F
Z1 =
R2 ⋅ R3
R2 + R3
1.26[V ]
× Z1 + 1.26[V ]
R1
(ILM − 1.26) ⋅ R1
1.26
R3 =
R2 ⋅ Z 1
R2 − Z 1
Example : ILM = 9V setting method
R1 7kΩ
Z1 =
(9V − 1.26V )⋅ 7kΩ ≅ 43kΩ
1.26V
The ILM_F voltage is determined by the
internal band gap voltage of the IC (typ = 1.26V).
When R3 = 150k, the ILM output voltage will be as follows:
59.67 kΩ ⋅150kΩ
Z1′ =
≅ 42.69kΩ
59.67 kΩ + 150kΩ
ILM =
1.26V
× 42.69kΩ + 1.26V ≅ 8.94V
7 kΩ
• AUDIO output voltage setting method
Formula for AUDIO voltage calculation
AUDIO =
5
1.26[V ]
× R1 + 1.26[V ]
R2
R1 ( AUDIO − 1.26 )
=
1.26
R2
AUDIO
R1
1.26V
4
The circuit must be designed in such a way that the R1:R2 ratio
satisfies the formula given above for the AUDIO voltage that
has been set.
AUDIO_F
R2
Example : AUDIO = 8.5V setting method
The AUDIO_F voltage is determined by the
internal band gap voltage of the IC (typ = 1.26V).
R1 (8.5 − 1.26 )
=
≅ 5.75
R2
1.26
R1 27 kΩ
=
≅ 5.74
R2 4.7 kΩ
AUDIO = 1.26V × 5.74 + 1.26V ≅ 8.49V
Note : In the above, the typical values are given in all instances for the values used and, as such, they will vary due to the
effects of production-related variations of the IC and external resistors.
No.A1901-10/14
LV56801P
• CTRL1 Application Circuit Example
(1) 3.3V input: R1 = 4.7kΩ, R2 = 10kΩ
R1
A
R2
CTRL1
B
A
B
0V
0V
CTRL1
0V
0V
3.3V
1.05V
3.3V
0V
2.23V
3.3V
3.3V
3.20V
500kΩ
• CTRL2 Application Circuit Example
(1) 3.3V input: R3 = R4 = 4.7kΩ
C
R3
R4
CTRL2
D
A
B
CTRL2
0V
0V
0V
0V
3.3V
1.61V
3.3V
0V
1.61V
3.3V
3.3V
3.29V
500kΩ
Caution for implementing LV56801P to a system board
In HZIP15J, the package used in this IC, there are several metal exposure other than the connection pins and heat-sinks as shown in
the following diagrams. In the diagrams, the electric potential of 2 and 3 are the same as Pin15 and Pin1, respectively. 2 (=Pin15) is
EXT pin and 3 (=Pin1) is ILM output (regulator). When the IC is implemented to the system, make sure that no attachment clamp
touches the exposed Pin1/ Pin15. When the exposed Pin1/ Pin15 touch the attachment clamp (same electrical potential as GND), ILM
output or VCC enter the same state as time when GND was shorted. The electric potential of the exposed metal connected to heat-sinks
1 is the same as that of sub board of the IC (GND). Therefore, even if the exposed metal and GND of the system board are adjacent to
each other, there should be no problem.
• HZIP15J external view
Heat-sink
1 Same potential
2 15PIN
Same potential
1PIN
3 Same potential
Heat-sink
1 Same potential
Heat-sink side
1
Heat-sink
Same potential
:Metal exposure
Heat-sink side
:Metal exposure
<Top view of HZIP15J>
<Side view of HZIP15J>
No.A1901-11/14
LV56801P
• Frame diagram (LV56801P) *In the system power supply other than LV56801P, pin assignment may differ.
Metal exposure 1
Metal exposure 3
Metal exposure 2
Metal exposure 1
LV56801
Metal exposure 1
Metal exposure 1
1PIN
15PIN
No.A1901-12/14
LV56801P
HZIP15J Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b.
Heat sink attachment
· Use flat-head screws to attach heat sinks.
· Use also washer to protect the package.
· Use tightening torques in the ranges 39-59Ncm(4-6kgcm) .
· If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
· Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Take care a position of via hole .
· Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Verify that there are no press burrs or screw-hole burrs on the heat sink.
· Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
· Twisting must be limited to under 0.05 mm.
· Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
· The speed of these torque wrenches should never exceed 700 rpm, and
should typically be about 400 rpm.
Binding head
machine screw
Countersunk head
mashine screw
Heat sink
gap
Via hole
c.
Silicone grease
· Spread the silicone grease evenly when mounting heat sinks.
· Our company recommends YG-6260 (Momentive Performance Materials Japan LLC)
d.
Mount
· First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
· When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e.
When mounting the semiconductor device to the heat sink using jigs, etc.,
· Take care not to allow the device to ride onto the jig or positioning dowel.
· Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device.
f.
Heat sink screw holes
· Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
· When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
· When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g.
There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
No.A1901-13/14
LV56801P
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