SANYO LV5681P

Ordering number : ENA1902A
Monolithic Linear IC
LV5681P
For Car Audio Systems
Multi-Power Supply System IC
Overview
The LV5681P is a multi-power supply system IC that provides four regulator outputs and two high side switches as well as
a number of protection functions including overcurrent protection, overvoltage protection and overheat protection. It is an
optimal power supply IC for car audio and car entertainment systems and similar products.
Features
• Four regulator output systems
For microcontroller: 5.7V output voltage, 200mA maximum output current
For CD drive: 7.0V output voltage, 1300mA maximum output current
For illumination: 8 to 12V output voltage (output can be set with external resistors), 300mA maximum output current
For audio systems: 8 to 9V output voltage (output voltage can be set with external resistors), 300mA maximum
output current
• Two VCC-linked high side switch systems
EXT: 350mA maximum output current, 0.5V voltage difference between input and output.
ANT: 300mA maximum output current, 0.5V voltage difference between input and output.
• Two VDD 5V-linked high side switch systems
SW5V: 200mA maximum output current, 0.2V voltage difference between input and output.
ACC (accessory voltage detection output): 100mA maximum output current, 0.2V voltage difference between input
and output.
• Overcurrent protection function
• Overvoltage protection function, typ 21V (excluding VDD 5V output)
• Overheat protection function, typ 175ºC
• On-chip accessory voltage detection circuit
• P-channel LDMOS used for power output block
CAUTION)
The protection functions are provided in order to improve the ability of the ICs to withstand breakdown, and they are not intended to guarantee safety
when used under conditions outside the safe operating area or rated operating conditions.
Use of the ICs under any conditions exceeding the safe operating area or above the IOmax, and especially use in overcurrent protection areas or under
conditions in which they are subject to thermal protection, may reduce their reliability and result in permanent breakdown.
Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to
"standard application", intended for the use as general electronics equipment. The products mentioned herein
shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life,
aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system,
safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives
in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any
guarantee thereof. If you should intend to use our products for new introduction or other application different
from current conditions on the usage of automotive device, communication device, office equipment, industrial
equipment etc. , please consult with us about usage condition (temperature, operation time etc.) prior to the
intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely
responsible for the use.
Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate
the performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer ' s products or
equipment.
O2611 SY 20111014-S00003/D2210 SY 20101201-S00005 No.A1902-1/14
LV5681P
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Conditions
Conditions
Ratings
Supply voltage
VCC max
Peak supply voltage
VCC peak
See below for the waveform applied.
Allowable Power dissipation
Pd max
Independent IC
Ta ≤ 25°C
Al heat sink *
With an infinity heat sink
Unit
36
V
50
V
1.5
W
5.6
W
32.5
W
Junction temperature
Tj max
150
°C
Operating ambient temperature
Topr
-40 to +85
°C
Storage temperature
Tstg
-55 to +150
°C
* : When the Aluminum heat sink (50mm × 50mm × 1.5mm) is used
Allowable Operating range at Ta = 25°C
Parameter
Conditions
Ratings
Unit
Operating supply voltage 1
VDD output, SW output, ACC output
7.5 to 16
Operating supply voltage 2
ILM output at 10V
12 to 16
V
ILM output at 8V
10 to 16
V
Operating supply voltage 3
Audio output at 9V
10 to 16
V
Operating supply voltage 4
CD output (CD output current = 1.3A)
10.5 to 16
V
10 to 16
V
CD output (CD output current ≤ 1A)
V
Electrical Characteristics at Ta = 25°C, VCC = 14.4V
*: All the specifications are defined based on the tests that Tj is almost equal to Ta (=25°C). To suppress the rise of Tj in the junction
temperature as much as possible, it tests by the pulse loading.
Ratings
Parameter
Symbol
Conditions
Unit
min
Current drain
ICC
typ
VDD no load, CTRL1/2 = ⎡L/L⎦, ACC = 0V
max
400
800
μA
CTRL1 Input
Low input voltage
VIL1
0.4
V
M1 input voltage
VIM11
0.8
0
1.1
1.4
V
M2 input voltage
VIM21
1.9
2.2
2.5
V
High input voltage
VIH1
2.9
3.3
5.5
V
Input impedance
RIH1
350
500
650
kΩ
0.5
V
1.65
2.1
V
CTRL2 Input
Low input voltage
VIL2
0
M input voltage
VIM2
1.1
High input voltage
VIH2
2.5
3.3
5.5
V
Input impedance
RIH2
350
500
650
kΩ
VDD 5.7V Output *1
The VDD 5.7V output supplies the output currents of SW 5.7V and ACC 5.7V.
Output voltage 1
VO1
IO1 = 200mA, IO7, IO8 = 0A
5.4
5.7
6.0
V
Output voltage 2
VO1’
IO1 = 200mA, IO7 = 200mA, IO8 = 100mA
5.4
5.7
6.0
V
500
Output total current
Ito1
VO1 ≥ 5.4V, Ito1 = IO1+IO7+IO8
Line regulation
ΔVOLN1
7.5V < VCC < 16V, IO1 = 200mA *2
30
90
mV
Load regulation
ΔVOLD1
1mA < IO1 < 200mA *2
70
150
mV
Dropout voltage 1
VDROP1
IO1 = 200mA *2
1.0
1.5
V
Dropout voltage 2
VDROP1’
IO1 = 100mA *2
0.7
1.05
V
Dropout voltage 3
VDROP1”
IO1+IO7+IO8 = 500mA
2.5
3.75
V
Ripple rejection
RREJ1
f = 120Hz, IO1 = 200mA *2
VO2
IO2 = 1000mA
mA
40
50
6.65
7.0
dB
CD Output ; CTRL2 = ⎡H⎦
Output voltage
7.35
V
*1 : The VDD 5.7V output also supplies the output currents of SW 5.7V and ACC 5.7V. Therefore, the current supply capability of the VDD 5.7V output and its
other electrical characteristics are affected by the output statuses of SW 5.7V and ACC 5.7V.
*2 : SW 5V and ACC 5.7V are not subject to a load.
Continued on next page.
No.A1902-2/14
LV5681P
Continued from preceding page.
Ratings
Parameter
Symbol
Conditions
Unit
min
Output current
IO2
VO2 ≥ 6.65V
Line regulation
ΔVOLN2
10.5V < VCC < 16V, IO2 = 1000mA
Load regulation
ΔVOLD2
Dropout voltage 1
Dropout voltage 2
Ripple rejection
RREJ2
f = 120Hz, IO2 = 1000mA
typ
max
1300
mA
50
100
mV
10mA < IO2 < 1000mA
100
200
mV
VDROP2
IO2 = 1000mA
1.0
1.5
V
VDROP2’
IO2 = 500mA
0.5
0.75
40
50
1.222
1.260
V
dB
AUDIO (8-9V) Output ; CTRL2 = ⎡M⎦
AUDIO_F pin voltage
VI 3
AUDIO_F pin inflow current
IIN3
1.298
V
1
μA
AUDIO output voltage 1
VO3
IO3 = 200mA, R2 = 30kΩ, R3 = 5.6kΩ *3
7.65
8.0
8.35
V
AUDIO output voltage 2
VO3’
IO3’ = 200mA, R2 = 27kΩ, R3 = 4.7kΩ *3
AUDIO output voltage 3
VO3”
IO3” = 200mA, R2 = 24kΩ, R3 = 3.9kΩ *3
8.13
8.5
8.87
V
8.6
9.0
9.4
AUDIO output current
IO3
Line regulation
ΔVOLN3
10V < VCC < 16V, IO3 = 200mA
30
90
mV
Load regulation
ΔVOLD3
1mA < IO3 < 200mA
70
150
mV
Dropout voltage 1
VDROP3
IO3 = 200mA
0.3
0.45
V
0.15
0.23
-1
300
Dropout voltage 2
VDROP3’
IO3 = 100mA
Ripple rejection
RREJ3
f = 120Hz, IO3 = 200mA
V
mA
40
50
V
dB
ILM (8-12V) Output ; CTRL1 = ⎡M1⎦
ILM_F pin voltage
VI4
1.222
1.260
1.298
V
ILM output voltage 1
VO4
IO4 = 200mA, R2 = 30kΩ, R3 = 5.6kΩ *3
7.65
8.0
8.35
V
ILM output voltage 2
VO4’
IO4’ = 200mA, R2 = 27kΩ, R3 = 3.9kΩ *3
9.55
10.0
10.45
V
ILM output voltage 3
VO4”
IO4” = 200mA, R2 = 33kΩ, R3 = 3.9kΩ *3
11.36
11.9
12.44
ILM output current
IO4
Line regulation
ΔVOLN4
12V < VCC < 16V, IO4 = 200mA
30
90
mV
Load regulation
ΔVOLD4
1mA < IO4 < 200mA
70
150
mV
Dropout voltage 1
VDROP4
IO4 = 200mA
0.7
1.05
V
Dropout voltage 2
VDROP4’
IO4 = 100mA
0.35
0.53
Ripple rejection
RREJ4
f = 120Hz, IO4 = 200mA
Output voltage
VO5
IO5 = 350mA
Output current
IO5
VO5 ≥ VCC-1.0
Output voltage
VO6
IO6 = 300mA
Output current
IO6
VO6 ≥ VCC-1.0
Output voltage 1
VO7
IO7 = 1mA, IO1, IO8 = 0A *4
VO1-0.25
VO1
V
Output voltage 2
VO7’
IO7 = 200mA, IO1, IO8 = 0A *4
VO1-0.45
VO1-0.2
V
Output current
IO7
VO7 ≥ 4.55
300
V
mA
40
50
VCC-1.0
VCC-0.5
V
dB
Remoto (EXT) ; CTRL1 = ⎡M2⎦
V
350
mA
ANT remoto ; CTRL1 = ⎡H⎦
VCC-1.0
VCC-0.5
V
300
mA
SW 5V Output ; CTRL2 = ⎡M⎦
200
mA
ACC Detection ; ACC Integration 5V output
ACC detection voltage
VTH8
2.75
3.0
3.25
V
Hysteresis width
VHIS8
0.2
0.3
0.4
V
78
kΩ
Input impedance
ZI8
(Pull-down resistance internal)
42
60
ACC output voltage 1
VO8
IO8 = 0.5mA, IO1, IO7 = 0A *4
VO1-0.25
VO1
V
ACC output voltage 2
VO8’
IO8 = 100mA, IO1, IO7 = 0A *4
VO1-0.45
VO1-0.2
V
ACC output voltage
IO8
VO8 ≥ 4.55
100
mA
*3 : When a component with a resistance accuracy of ±1% is used
<Reference> When a component with a resistance accuracy of ±0.5% is used, VO3” is 8.67V ≤ 9.0V ≤ 9.33V.
*4 : Since the SW 5.7V and ACC 5.7V are output from VDD 5.7V through the SW, the voltage drops by an amount equivalent to the ON resistance of the SW.
No.A1902-3/14
LV5681P
Package Dimensions
unit : mm (typ)
3395
• Allowable power dissipation derating curve
Pd max -- Ta
(20.0)
HEAT SPREADER
HEAT SINK
(15.8)
3.0
(11.0)
3.35
12.4
(9.05)
(14.55)
17.9
(9.6)
(R1.75)
1
0.4
15
(1.91)
1.27
2.54 2.54
0.7
Allowable power dissipation, Pd max -- W
8
21.6
Aluminum heat sink mounting conditions
tightening torque : 39N⋅cm, using silicone grease
7
Aluminum heat sink (50 × 50 × 1.5mm3) when using
6
5.6
5
4
3
2
Independent IC
1.5
1
0
0
20
40
60
80
100
120
140 150 160
Ambient temperature, Ta -- °C
SANYO : HZIP15J
• Waveform applied during surge test
50V
90%
10%
16V
5msec
100msec
No.A1902-4/14
LV5681P
Block Diagram
+B
VCC
+
C1
7
C2
EXT
out
Remote EXT(VCC-0.5V)
D1 350mA
15
ANT
out
Over
Voltage
Protection
Start
up
Vref
D2
ANT Remote (VCC-0.5V)
D3 300mA
14
+
D4
C4
+
ILM output (8V to 12V)
300mA
1
+
R1 C5
C6
2
ILM_F
R2
+
AUDIO output (8V to 9V)
300mA
5
+
R3 C7
C8
4
AUDIO_F
R4
+
3
CD output (7V)
1300mA
+
C9
C10
12
VDD output (5.7V)
200mA
+
C11
C12
CTRL1
8
(four-value control)
OUTPUT
CTRL2
6
(three-value control)
+
C3
Control
+
Thermal
Shut Down
GND
9
SW output (5.7V)
13
200mA
ACC
10
+
ACC output (5.7V)
11
Output Current Limit Circuit
100mA
Pin Function
Pin No.
1
Pin name
ILM
Description
ILM output pin
ON when CTRL1 = M1, M2, H
Equivalent Circuit
7
VCC
8.0 to12.0V/300mA
1
2
ILM_F
ILM output voltage adjustment pin
2
9
GND
Continued on next page.
No.A1902-5/14
LV5681P
Continued from preceding page.
Pin No.
3
Pin name
CD
Description
Equivalent Circuit
CD output pin
VCC
7
ON when CTRL2 = M, H
7.0V/1.3A
3
4
AUDIO_F
9
GND
7
VCC
AUIDO output voltage adjustment pin
5
5
AUDIO
AUDIO output pin
ON when CTRL2 = M, H
4
8.0 to 9.0V/300mA
9
6
CTRL2
GND
CTRL2 input pin
VCC
7
three-value input
6
500kΩ
9
7
VCC
8
CTRL1
GND
Supply terminal
CTRL1 input pin
four-value input
VCC
7
8
500kΩ
9
9
GND
GND
GND pin
Continued on next page.
No.A1902-6/14
LV5681P
Continued from preceding page.
Pin No.
10
Pin name
ACC
Description
Equivalent Circuit
Accessory input
VCC
7
10
45kΩ
15kΩ
9
11
12
ACC5V
VDD5V
GND
Accessory detection output
ON when ACC > 3V
7
VDD5.7V output pin
5.7V/500mA
12
VCC
11
13
SW5V
SW5.7V output pin
13
ON when CTRL2 = M, H
9
14
ANT
GND
ANT output pin
ON when CTRL1 = H
7
VCC
VCC-0.5V/300mA
14
15
EXT
EXT output pin
ON when CTRL1 = M2, H
9
GND
7
VCC
VCC-0.5V/350mA
15
9
GND
No.A1902-7/14
LV5681P
CTRL Pin Output Truth Table
CTRL1
ANT
EXT
ILM
CTRL2
CD
AUDIO
SW5
L
OFF
OFF
OFF
L
OFF
OFF
OFF
M1
OFF
OFF
ON
M
OFF
ON
ON
M2
OFF
ON
ON
H
ON
ON
ON
H
ON
ON
ON
Timing Chart
21V
VCC
(Pin 7)
VDD5.7V output
(Pin 12)
CTRL1 input
(Pin 8)
CTRL2 input
(Pin 6)
CD output
(Pin 3)
AUDIO output
(Pin 5)
ILM output
(Pin 1)
EXT output
(Pin 15)
ANT output
(Pin 14)
SW5.7V output
(Pin 13)
ACC input
(Pin 10)
3.0V
2.7V
ACC output
(Pin 11)
No.A1902-8/14
LV5681P
C11 C12
+
R4
R2
ILM
CD
12
11
ANT
EXT
10
9
SW5.7V
VDD5.7V
ACC5.7V
ACC
CTRL1
8
7
14
13
15
R3
+
C4
CTRL2
C5 + C6
GND
6
5
VCC
4
3
R1
CTRL2
AUDIO
2
1
CD
ILM
ILM_F
AUDIO_F
Recommended Operation Circuit
C7 + C8
AUDIO
CTRL1
ACC ACC5.7V
C1 + C2
+
C3
SW5.7V
D3
D1
D4
D2
C11 + C12
VCC
VDD5.7V
ANT
EXT
Peripheral parts list
Name of part
Recommended value
Remarks
C1
Power supply bypass capacitor
Description
100μF or more
These capacitors must be placed near
C2
Oscillation prevention capacitor
0.22μF or more
the VCC and GND pins.
C3
EXT output stabilization capacitor
2.2μF or more
C4
ANT output stabilization capacitor
2.2μF or more
C5, C57 C9, C11
Output stabilization capacitor
4.7μF or more
Electrolytic capacitor *
C6, C8, C10, C12
Output stabilization capacitor
0.22μF or more
Ceramic capacitor *
R1,R2
Resistor for ILM voltage adjustment
R1/R2
A resistor with resistance accuracy as
:30kΩ/5.6kΩ = 8.0V
low as less than ±1% must be used.
:27kΩ/3.9kΩ = 10.0V
:33kΩ/3.9kΩ = 11.9V
R3/R4
R3, R4
Resistor for AUDIO voltage setting
:30kΩ/5.6kΩ = 8.0V
A resistor with resistance accuracy as
:27kΩ/4.7kΩ = 8.5V
low as less than ±1% must be used.
:24kΩ/3.9kΩ = 9.0V
D1, D2, D3, D4
Diode for internal device breakdown protection
* : In order to stabilize the regulator outputs, it is recommended that the electrolytic capacitor and ceramic capacitor be connected in parallel.
Furthermore, the values listed above do not guarantee stabilization during the overcurrent protection operations of the regulator, so oscillation may occur
during an overcurrent protection operation.
No.A1902-9/14
LV5681P
• AUDIO/ILM output voltage setting method
Formula for AUDIO voltage calculation
AUDIO =
5
1.26[V ]
× R1 + 1.26[V ]
R2
R1 ( AUDIO − 1.26 )
=
1.26
R2
AUDIO
R1
1.26V
4
The circuit must be designed in such a way that the R1:R2 ratio
satisfies the formula given above for the AUDIO voltage that
has been set.
AUDIO_F
R2
Example : AUDIO = 8.5V setting method
The AUDIO_F voltage is determined by the
internal band gap voltage of the IC (typ = 1.26V).
R1 (8.5 − 1.26 )
=
≅ 5.75
R2
1.26
R1
27 kΩ
=
≅ 5.74
R2 4.7 kΩ
AUDIO = 1.26V × 5.74 + 1.26V ≅ 8.49V
The ILM output voltage can be set by the above-mentioned method.
Note : In the above, the typical values are given in all instances for the values used and, as such, they will vary due to the
effects of production-related variations of the IC and external resistors.
No.A1902-10/14
LV5681P
• CTRL1 Application Circuit Example
(1) 3.3V input: R1 = 4.7kΩ, R2 = 10kΩ
R1
A
R2
CTRL1
B
A
B
0V
0V
CTRL1
0V
0V
3.3V
1.05V
3.3V
0V
2.23V
3.3V
3.3V
3.20V
500kΩ
• CTRL2 Application Circuit Example
(1) 3.3V input: R3 = R4 = 4.7kΩ
C
R3
R4
CTRL2
D
A
B
CTRL2
0V
0V
0V
0V
3.3V
1.61V
3.3V
0V
1.61V
3.3V
3.3V
3.29V
500kΩ
Caution for implementing LV5681P to a system board
In HZIP15J, the package used in this IC, there are several metal exposure other than the connection pins and heat-sinks as shown in
the following diagrams. In the diagrams, the electric potential of 2 and 3 are the same as Pin15 and Pin1, respectively. 2 (=Pin15) is
EXT pin and 3 (=Pin1) is ILM output (regulator). When the IC is implemented to the system, make sure that no attachment clamp
touches the exposed Pin1/ Pin15. When the exposed Pin1/ Pin15 touch the attachment clamp (same electrical potential as GND), ILM
output or VCC enter the same state as time when GND was shorted. The electric potential of the exposed metal connected to heat-sinks
1 is the same as that of sub board of the IC (GND). Therefore, even if the exposed metal and GND of the system board are adjacent to
each other, there should be no problem.
• HZIP15J external view
Heat-sink
1 Same potential
2 15PIN
Same potential
1PIN
3 Same potential
Heat-sink
1 Same potential
Heat-sink side
1
Heat-sink
Same potential
:Metal exposure
Heat-sink side
:Metal exposure
<Top view of HZIP15J>
<Side view of HZIP15J>
PS No.A1902-11/14
LV5681P
•
Frame diagram (LV5681P) *In the system power supply other than LV5681P, pin assignment may differ.
Metal exposure 1
Metal exposure 3
Metal exposure 2
Metal exposure 1
LV5681
Metal exposure 1
Metal exposure 1
1PIN
15PIN
PS No.A1902-12/14
LV5681P
HZIP15J Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b.
Heat sink attachment
· Use flat-head screws to attach heat sinks.
· Use also washer to protect the package.
· Use tightening torques in the ranges 39-59Ncm(4-6kgcm) .
· If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
· Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Take care a position of via hole .
· Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Verify that there are no press burrs or screw-hole burrs on the heat sink.
· Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
· Twisting must be limited to under 0.05 mm.
· Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
· The speed of these torque wrenches should never exceed 700 rpm, and
should typically be about 400 rpm.
Binding head
machine screw
Countersunk head
mashine screw
Heat sink
gap
Via hole
c.
Silicone grease
· Spread the silicone grease evenly when mounting heat sinks.
· Sanyo recommends YG-6260 (Momentive Performance Materials Japan LLC)
d.
Mount
· First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
· When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e.
When mounting the semiconductor device to the heat sink using jigs, etc.,
· Take care not to allow the device to ride onto the jig or positioning dowel.
· Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device.
f.
Heat sink screw holes
· Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
· When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
· When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g.
There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
PS No.A1902-13/14
LV5681P
SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using
products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition
ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd.
products described or contained herein.
SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all
semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or
malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise
to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt
safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not
limited to protective circuits and error prevention circuits for safe design, redundant design, and structural
design.
In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are
controlled under any of applicable local export control laws and regulations, such products may require the
export license from the authorities concerned in accordance with the above law.
No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise,
without the prior written consent of SANYO Semiconductor Co.,Ltd.
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the
SANYO Semiconductor Co.,Ltd. product that you intend to use.
Upon using the technical information or products described herein, neither warranty nor license shall be granted
with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third
party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's
intellctual property rights which has resulted from the use of the technical information and products mentioned
above.
This catalog provides
provides information
information as
as ofofDecember,
October, 2011.
2010.Specifications
Specifications and
and information
information herein
herein are subject
to change without notice.
PS No.A1902-14/14