Ordering number : ENA1902A Monolithic Linear IC LV5681P For Car Audio Systems Multi-Power Supply System IC Overview The LV5681P is a multi-power supply system IC that provides four regulator outputs and two high side switches as well as a number of protection functions including overcurrent protection, overvoltage protection and overheat protection. It is an optimal power supply IC for car audio and car entertainment systems and similar products. Features • Four regulator output systems For microcontroller: 5.7V output voltage, 200mA maximum output current For CD drive: 7.0V output voltage, 1300mA maximum output current For illumination: 8 to 12V output voltage (output can be set with external resistors), 300mA maximum output current For audio systems: 8 to 9V output voltage (output voltage can be set with external resistors), 300mA maximum output current • Two VCC-linked high side switch systems EXT: 350mA maximum output current, 0.5V voltage difference between input and output. ANT: 300mA maximum output current, 0.5V voltage difference between input and output. • Two VDD 5V-linked high side switch systems SW5V: 200mA maximum output current, 0.2V voltage difference between input and output. ACC (accessory voltage detection output): 100mA maximum output current, 0.2V voltage difference between input and output. • Overcurrent protection function • Overvoltage protection function, typ 21V (excluding VDD 5V output) • Overheat protection function, typ 175ºC • On-chip accessory voltage detection circuit • P-channel LDMOS used for power output block CAUTION) The protection functions are provided in order to improve the ability of the ICs to withstand breakdown, and they are not intended to guarantee safety when used under conditions outside the safe operating area or rated operating conditions. Use of the ICs under any conditions exceeding the safe operating area or above the IOmax, and especially use in overcurrent protection areas or under conditions in which they are subject to thermal protection, may reduce their reliability and result in permanent breakdown. Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to "standard application", intended for the use as general electronics equipment. The products mentioned herein shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee thereof. If you should intend to use our products for new introduction or other application different from current conditions on the usage of automotive device, communication device, office equipment, industrial equipment etc. , please consult with us about usage condition (temperature, operation time etc.) prior to the intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely responsible for the use. Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer ' s products or equipment. O2611 SY 20111014-S00003/D2210 SY 20101201-S00005 No.A1902-1/14 LV5681P Specifications Absolute Maximum Ratings at Ta = 25°C Parameter Conditions Conditions Ratings Supply voltage VCC max Peak supply voltage VCC peak See below for the waveform applied. Allowable Power dissipation Pd max Independent IC Ta ≤ 25°C Al heat sink * With an infinity heat sink Unit 36 V 50 V 1.5 W 5.6 W 32.5 W Junction temperature Tj max 150 °C Operating ambient temperature Topr -40 to +85 °C Storage temperature Tstg -55 to +150 °C * : When the Aluminum heat sink (50mm × 50mm × 1.5mm) is used Allowable Operating range at Ta = 25°C Parameter Conditions Ratings Unit Operating supply voltage 1 VDD output, SW output, ACC output 7.5 to 16 Operating supply voltage 2 ILM output at 10V 12 to 16 V ILM output at 8V 10 to 16 V Operating supply voltage 3 Audio output at 9V 10 to 16 V Operating supply voltage 4 CD output (CD output current = 1.3A) 10.5 to 16 V 10 to 16 V CD output (CD output current ≤ 1A) V Electrical Characteristics at Ta = 25°C, VCC = 14.4V *: All the specifications are defined based on the tests that Tj is almost equal to Ta (=25°C). To suppress the rise of Tj in the junction temperature as much as possible, it tests by the pulse loading. Ratings Parameter Symbol Conditions Unit min Current drain ICC typ VDD no load, CTRL1/2 = ⎡L/L⎦, ACC = 0V max 400 800 μA CTRL1 Input Low input voltage VIL1 0.4 V M1 input voltage VIM11 0.8 0 1.1 1.4 V M2 input voltage VIM21 1.9 2.2 2.5 V High input voltage VIH1 2.9 3.3 5.5 V Input impedance RIH1 350 500 650 kΩ 0.5 V 1.65 2.1 V CTRL2 Input Low input voltage VIL2 0 M input voltage VIM2 1.1 High input voltage VIH2 2.5 3.3 5.5 V Input impedance RIH2 350 500 650 kΩ VDD 5.7V Output *1 The VDD 5.7V output supplies the output currents of SW 5.7V and ACC 5.7V. Output voltage 1 VO1 IO1 = 200mA, IO7, IO8 = 0A 5.4 5.7 6.0 V Output voltage 2 VO1’ IO1 = 200mA, IO7 = 200mA, IO8 = 100mA 5.4 5.7 6.0 V 500 Output total current Ito1 VO1 ≥ 5.4V, Ito1 = IO1+IO7+IO8 Line regulation ΔVOLN1 7.5V < VCC < 16V, IO1 = 200mA *2 30 90 mV Load regulation ΔVOLD1 1mA < IO1 < 200mA *2 70 150 mV Dropout voltage 1 VDROP1 IO1 = 200mA *2 1.0 1.5 V Dropout voltage 2 VDROP1’ IO1 = 100mA *2 0.7 1.05 V Dropout voltage 3 VDROP1” IO1+IO7+IO8 = 500mA 2.5 3.75 V Ripple rejection RREJ1 f = 120Hz, IO1 = 200mA *2 VO2 IO2 = 1000mA mA 40 50 6.65 7.0 dB CD Output ; CTRL2 = ⎡H⎦ Output voltage 7.35 V *1 : The VDD 5.7V output also supplies the output currents of SW 5.7V and ACC 5.7V. Therefore, the current supply capability of the VDD 5.7V output and its other electrical characteristics are affected by the output statuses of SW 5.7V and ACC 5.7V. *2 : SW 5V and ACC 5.7V are not subject to a load. Continued on next page. No.A1902-2/14 LV5681P Continued from preceding page. Ratings Parameter Symbol Conditions Unit min Output current IO2 VO2 ≥ 6.65V Line regulation ΔVOLN2 10.5V < VCC < 16V, IO2 = 1000mA Load regulation ΔVOLD2 Dropout voltage 1 Dropout voltage 2 Ripple rejection RREJ2 f = 120Hz, IO2 = 1000mA typ max 1300 mA 50 100 mV 10mA < IO2 < 1000mA 100 200 mV VDROP2 IO2 = 1000mA 1.0 1.5 V VDROP2’ IO2 = 500mA 0.5 0.75 40 50 1.222 1.260 V dB AUDIO (8-9V) Output ; CTRL2 = ⎡M⎦ AUDIO_F pin voltage VI 3 AUDIO_F pin inflow current IIN3 1.298 V 1 μA AUDIO output voltage 1 VO3 IO3 = 200mA, R2 = 30kΩ, R3 = 5.6kΩ *3 7.65 8.0 8.35 V AUDIO output voltage 2 VO3’ IO3’ = 200mA, R2 = 27kΩ, R3 = 4.7kΩ *3 AUDIO output voltage 3 VO3” IO3” = 200mA, R2 = 24kΩ, R3 = 3.9kΩ *3 8.13 8.5 8.87 V 8.6 9.0 9.4 AUDIO output current IO3 Line regulation ΔVOLN3 10V < VCC < 16V, IO3 = 200mA 30 90 mV Load regulation ΔVOLD3 1mA < IO3 < 200mA 70 150 mV Dropout voltage 1 VDROP3 IO3 = 200mA 0.3 0.45 V 0.15 0.23 -1 300 Dropout voltage 2 VDROP3’ IO3 = 100mA Ripple rejection RREJ3 f = 120Hz, IO3 = 200mA V mA 40 50 V dB ILM (8-12V) Output ; CTRL1 = ⎡M1⎦ ILM_F pin voltage VI4 1.222 1.260 1.298 V ILM output voltage 1 VO4 IO4 = 200mA, R2 = 30kΩ, R3 = 5.6kΩ *3 7.65 8.0 8.35 V ILM output voltage 2 VO4’ IO4’ = 200mA, R2 = 27kΩ, R3 = 3.9kΩ *3 9.55 10.0 10.45 V ILM output voltage 3 VO4” IO4” = 200mA, R2 = 33kΩ, R3 = 3.9kΩ *3 11.36 11.9 12.44 ILM output current IO4 Line regulation ΔVOLN4 12V < VCC < 16V, IO4 = 200mA 30 90 mV Load regulation ΔVOLD4 1mA < IO4 < 200mA 70 150 mV Dropout voltage 1 VDROP4 IO4 = 200mA 0.7 1.05 V Dropout voltage 2 VDROP4’ IO4 = 100mA 0.35 0.53 Ripple rejection RREJ4 f = 120Hz, IO4 = 200mA Output voltage VO5 IO5 = 350mA Output current IO5 VO5 ≥ VCC-1.0 Output voltage VO6 IO6 = 300mA Output current IO6 VO6 ≥ VCC-1.0 Output voltage 1 VO7 IO7 = 1mA, IO1, IO8 = 0A *4 VO1-0.25 VO1 V Output voltage 2 VO7’ IO7 = 200mA, IO1, IO8 = 0A *4 VO1-0.45 VO1-0.2 V Output current IO7 VO7 ≥ 4.55 300 V mA 40 50 VCC-1.0 VCC-0.5 V dB Remoto (EXT) ; CTRL1 = ⎡M2⎦ V 350 mA ANT remoto ; CTRL1 = ⎡H⎦ VCC-1.0 VCC-0.5 V 300 mA SW 5V Output ; CTRL2 = ⎡M⎦ 200 mA ACC Detection ; ACC Integration 5V output ACC detection voltage VTH8 2.75 3.0 3.25 V Hysteresis width VHIS8 0.2 0.3 0.4 V 78 kΩ Input impedance ZI8 (Pull-down resistance internal) 42 60 ACC output voltage 1 VO8 IO8 = 0.5mA, IO1, IO7 = 0A *4 VO1-0.25 VO1 V ACC output voltage 2 VO8’ IO8 = 100mA, IO1, IO7 = 0A *4 VO1-0.45 VO1-0.2 V ACC output voltage IO8 VO8 ≥ 4.55 100 mA *3 : When a component with a resistance accuracy of ±1% is used <Reference> When a component with a resistance accuracy of ±0.5% is used, VO3” is 8.67V ≤ 9.0V ≤ 9.33V. *4 : Since the SW 5.7V and ACC 5.7V are output from VDD 5.7V through the SW, the voltage drops by an amount equivalent to the ON resistance of the SW. No.A1902-3/14 LV5681P Package Dimensions unit : mm (typ) 3395 • Allowable power dissipation derating curve Pd max -- Ta (20.0) HEAT SPREADER HEAT SINK (15.8) 3.0 (11.0) 3.35 12.4 (9.05) (14.55) 17.9 (9.6) (R1.75) 1 0.4 15 (1.91) 1.27 2.54 2.54 0.7 Allowable power dissipation, Pd max -- W 8 21.6 Aluminum heat sink mounting conditions tightening torque : 39N⋅cm, using silicone grease 7 Aluminum heat sink (50 × 50 × 1.5mm3) when using 6 5.6 5 4 3 2 Independent IC 1.5 1 0 0 20 40 60 80 100 120 140 150 160 Ambient temperature, Ta -- °C SANYO : HZIP15J • Waveform applied during surge test 50V 90% 10% 16V 5msec 100msec No.A1902-4/14 LV5681P Block Diagram +B VCC + C1 7 C2 EXT out Remote EXT(VCC-0.5V) D1 350mA 15 ANT out Over Voltage Protection Start up Vref D2 ANT Remote (VCC-0.5V) D3 300mA 14 + D4 C4 + ILM output (8V to 12V) 300mA 1 + R1 C5 C6 2 ILM_F R2 + AUDIO output (8V to 9V) 300mA 5 + R3 C7 C8 4 AUDIO_F R4 + 3 CD output (7V) 1300mA + C9 C10 12 VDD output (5.7V) 200mA + C11 C12 CTRL1 8 (four-value control) OUTPUT CTRL2 6 (three-value control) + C3 Control + Thermal Shut Down GND 9 SW output (5.7V) 13 200mA ACC 10 + ACC output (5.7V) 11 Output Current Limit Circuit 100mA Pin Function Pin No. 1 Pin name ILM Description ILM output pin ON when CTRL1 = M1, M2, H Equivalent Circuit 7 VCC 8.0 to12.0V/300mA 1 2 ILM_F ILM output voltage adjustment pin 2 9 GND Continued on next page. No.A1902-5/14 LV5681P Continued from preceding page. Pin No. 3 Pin name CD Description Equivalent Circuit CD output pin VCC 7 ON when CTRL2 = M, H 7.0V/1.3A 3 4 AUDIO_F 9 GND 7 VCC AUIDO output voltage adjustment pin 5 5 AUDIO AUDIO output pin ON when CTRL2 = M, H 4 8.0 to 9.0V/300mA 9 6 CTRL2 GND CTRL2 input pin VCC 7 three-value input 6 500kΩ 9 7 VCC 8 CTRL1 GND Supply terminal CTRL1 input pin four-value input VCC 7 8 500kΩ 9 9 GND GND GND pin Continued on next page. No.A1902-6/14 LV5681P Continued from preceding page. Pin No. 10 Pin name ACC Description Equivalent Circuit Accessory input VCC 7 10 45kΩ 15kΩ 9 11 12 ACC5V VDD5V GND Accessory detection output ON when ACC > 3V 7 VDD5.7V output pin 5.7V/500mA 12 VCC 11 13 SW5V SW5.7V output pin 13 ON when CTRL2 = M, H 9 14 ANT GND ANT output pin ON when CTRL1 = H 7 VCC VCC-0.5V/300mA 14 15 EXT EXT output pin ON when CTRL1 = M2, H 9 GND 7 VCC VCC-0.5V/350mA 15 9 GND No.A1902-7/14 LV5681P CTRL Pin Output Truth Table CTRL1 ANT EXT ILM CTRL2 CD AUDIO SW5 L OFF OFF OFF L OFF OFF OFF M1 OFF OFF ON M OFF ON ON M2 OFF ON ON H ON ON ON H ON ON ON Timing Chart 21V VCC (Pin 7) VDD5.7V output (Pin 12) CTRL1 input (Pin 8) CTRL2 input (Pin 6) CD output (Pin 3) AUDIO output (Pin 5) ILM output (Pin 1) EXT output (Pin 15) ANT output (Pin 14) SW5.7V output (Pin 13) ACC input (Pin 10) 3.0V 2.7V ACC output (Pin 11) No.A1902-8/14 LV5681P C11 C12 + R4 R2 ILM CD 12 11 ANT EXT 10 9 SW5.7V VDD5.7V ACC5.7V ACC CTRL1 8 7 14 13 15 R3 + C4 CTRL2 C5 + C6 GND 6 5 VCC 4 3 R1 CTRL2 AUDIO 2 1 CD ILM ILM_F AUDIO_F Recommended Operation Circuit C7 + C8 AUDIO CTRL1 ACC ACC5.7V C1 + C2 + C3 SW5.7V D3 D1 D4 D2 C11 + C12 VCC VDD5.7V ANT EXT Peripheral parts list Name of part Recommended value Remarks C1 Power supply bypass capacitor Description 100μF or more These capacitors must be placed near C2 Oscillation prevention capacitor 0.22μF or more the VCC and GND pins. C3 EXT output stabilization capacitor 2.2μF or more C4 ANT output stabilization capacitor 2.2μF or more C5, C57 C9, C11 Output stabilization capacitor 4.7μF or more Electrolytic capacitor * C6, C8, C10, C12 Output stabilization capacitor 0.22μF or more Ceramic capacitor * R1,R2 Resistor for ILM voltage adjustment R1/R2 A resistor with resistance accuracy as :30kΩ/5.6kΩ = 8.0V low as less than ±1% must be used. :27kΩ/3.9kΩ = 10.0V :33kΩ/3.9kΩ = 11.9V R3/R4 R3, R4 Resistor for AUDIO voltage setting :30kΩ/5.6kΩ = 8.0V A resistor with resistance accuracy as :27kΩ/4.7kΩ = 8.5V low as less than ±1% must be used. :24kΩ/3.9kΩ = 9.0V D1, D2, D3, D4 Diode for internal device breakdown protection * : In order to stabilize the regulator outputs, it is recommended that the electrolytic capacitor and ceramic capacitor be connected in parallel. Furthermore, the values listed above do not guarantee stabilization during the overcurrent protection operations of the regulator, so oscillation may occur during an overcurrent protection operation. No.A1902-9/14 LV5681P • AUDIO/ILM output voltage setting method Formula for AUDIO voltage calculation AUDIO = 5 1.26[V ] × R1 + 1.26[V ] R2 R1 ( AUDIO − 1.26 ) = 1.26 R2 AUDIO R1 1.26V 4 The circuit must be designed in such a way that the R1:R2 ratio satisfies the formula given above for the AUDIO voltage that has been set. AUDIO_F R2 Example : AUDIO = 8.5V setting method The AUDIO_F voltage is determined by the internal band gap voltage of the IC (typ = 1.26V). R1 (8.5 − 1.26 ) = ≅ 5.75 R2 1.26 R1 27 kΩ = ≅ 5.74 R2 4.7 kΩ AUDIO = 1.26V × 5.74 + 1.26V ≅ 8.49V The ILM output voltage can be set by the above-mentioned method. Note : In the above, the typical values are given in all instances for the values used and, as such, they will vary due to the effects of production-related variations of the IC and external resistors. No.A1902-10/14 LV5681P • CTRL1 Application Circuit Example (1) 3.3V input: R1 = 4.7kΩ, R2 = 10kΩ R1 A R2 CTRL1 B A B 0V 0V CTRL1 0V 0V 3.3V 1.05V 3.3V 0V 2.23V 3.3V 3.3V 3.20V 500kΩ • CTRL2 Application Circuit Example (1) 3.3V input: R3 = R4 = 4.7kΩ C R3 R4 CTRL2 D A B CTRL2 0V 0V 0V 0V 3.3V 1.61V 3.3V 0V 1.61V 3.3V 3.3V 3.29V 500kΩ Caution for implementing LV5681P to a system board In HZIP15J, the package used in this IC, there are several metal exposure other than the connection pins and heat-sinks as shown in the following diagrams. In the diagrams, the electric potential of 2 and 3 are the same as Pin15 and Pin1, respectively. 2 (=Pin15) is EXT pin and 3 (=Pin1) is ILM output (regulator). When the IC is implemented to the system, make sure that no attachment clamp touches the exposed Pin1/ Pin15. When the exposed Pin1/ Pin15 touch the attachment clamp (same electrical potential as GND), ILM output or VCC enter the same state as time when GND was shorted. The electric potential of the exposed metal connected to heat-sinks 1 is the same as that of sub board of the IC (GND). Therefore, even if the exposed metal and GND of the system board are adjacent to each other, there should be no problem. • HZIP15J external view Heat-sink 1 Same potential 2 15PIN Same potential 1PIN 3 Same potential Heat-sink 1 Same potential Heat-sink side 1 Heat-sink Same potential :Metal exposure Heat-sink side :Metal exposure <Top view of HZIP15J> <Side view of HZIP15J> PS No.A1902-11/14 LV5681P • Frame diagram (LV5681P) *In the system power supply other than LV5681P, pin assignment may differ. Metal exposure 1 Metal exposure 3 Metal exposure 2 Metal exposure 1 LV5681 Metal exposure 1 Metal exposure 1 1PIN 15PIN PS No.A1902-12/14 LV5681P HZIP15J Heat sink attachment Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be applied to the heat sink or tabs. b. Heat sink attachment · Use flat-head screws to attach heat sinks. · Use also washer to protect the package. · Use tightening torques in the ranges 39-59Ncm(4-6kgcm) . · If tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. · Do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Take care a position of via hole . · Do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Verify that there are no press burrs or screw-hole burrs on the heat sink. · Warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for either concave or convex warping. · Twisting must be limited to under 0.05 mm. · Heat sink and semiconductor device are mounted in parallel. Take care of electric or compressed air drivers · The speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. Binding head machine screw Countersunk head mashine screw Heat sink gap Via hole c. Silicone grease · Spread the silicone grease evenly when mounting heat sinks. · Sanyo recommends YG-6260 (Momentive Performance Materials Japan LLC) d. Mount · First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. · When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. e. When mounting the semiconductor device to the heat sink using jigs, etc., · Take care not to allow the device to ride onto the jig or positioning dowel. · Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device. f. Heat sink screw holes · Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. · When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. A hole diameter about 15% larger than the diameter of the screw is desirable. · When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about 15% smaller than the diameter of the screw is desirable. g. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not recommended because of possible displacement due to fluctuation of the spring force with time or vibration. PS No.A1902-13/14 LV5681P SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein. SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written consent of SANYO Semiconductor Co.,Ltd. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the SANYO Semiconductor Co.,Ltd. product that you intend to use. Upon using the technical information or products described herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's intellctual property rights which has resulted from the use of the technical information and products mentioned above. This catalog provides provides information information as as ofofDecember, October, 2011. 2010.Specifications Specifications and and information information herein herein are subject to change without notice. PS No.A1902-14/14