MC33375 D

MC33375, NCV33375 Series
300 mA, Low Dropout
Voltage Regulator with
On/Off Control
The MC33375 series are micropower low dropout voltage
regulators available in a wide variety of output voltages as well as
packages, SOT−223 and SOP−8. These devices feature a very low
quiescent current and are capable of supplying output currents up to
300 mA. Internal current and thermal limiting protection are provided
by the presence of a short circuit at the output and an internal thermal
shutdown circuit.
The MC33375 has a control pin that allows a logic level signal to
turn−off or turn−on the regulator output.
Due to the low input−to−output voltage differential and bias current
specifications, these devices are ideally suited for battery powered
computer, consumer, and industrial equipment where an extension of
useful battery life is desirable.
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LOW DROPOUT
MICROPOWER VOLTAGE
REGULATOR
MARKING
DIAGRAMS
4
1
Features:
SOT−223
ST SUFFIX
CASE 318E
• Low Quiescent Current (0.3 A in OFF mode; 125 A in ON mode)
• Low Input−to−Output Voltage Differential of 25 mV at IO = 10 mA,
•
•
•
•
•
•
and 260 mV at IO = 300 mA
Extremely Tight Line and Load Regulation
Stable with Output Capacitance of only 0.33 F for 2.5 V Output
Voltage
Internal Current and Thermal Limiting
Logic Level ON/OFF Control
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These are Pb−Free Devices
Vin
Vout
1
8
8
1
375xx
ALYW
G
SOIC−8
D SUFFIX
CASE 751
1
A = Assembly Location
Y = Year
M = Date Code
L = Wafer Lot
W = Work Week
xx = Voltage Version
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the
package dimensions section on page 11 of this data sheet.
Thermal &
Anti−sat
Protection
On/Off
AYM
375xx G
G
Rint
On/Off
Block
1.23 V
V. Ref.
54 K
GND
This device contains 41 active transistors
Figure 1. Simplified Block Diagram
© Semiconductor Components Industries, LLC, 2013
October, 2013 − Rev. 16
1
Publication Order Number:
MC33375/D
MC33375, NCV33375 Series
PIN CONNECTIONS
Gnd
4
Input
Gnd
Gnd
1
ON/OFF
2
3
Vin ON/ Vout
OFF
1
8
2
7
3
6
4
5
Output
Gnd
Gnd
N/C
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VCC
13
Vdc
PD
Internally Limited
W
RJA
RJC
160
25
°C/W
°C/W
RJA
RJC
245
15
°C/W
°C/W
Output Current
IO
300
mA
Maximum Junction Temperature
TJ
150
°C
Operating Ambient Temperature Range
TA
− 40 to +125
°C
Storage Temperature Range
Tstg
− 65 to +150
°C
Input Voltage
Power Dissipation and Thermal Characteristics
TA = 25°C
Maximum Power Dissipation
Case 751 (SOP−8) D Suffix
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Case 318E (SOT−223) ST Suffix
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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2
MC33375, NCV33375 Series
ELECTRICAL CHARACTERISTICS (CL = 1.0 F, TA = 25°C, for min/max values TJ = −40°C to +125°C, Note 1)
Symbol
Characteristic
Output Voltage
1.8 V Suffix
2.5 V Suffix
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
IO = 0 mA to 250 mA
TA = 25°C, Vin = [VO + 1] V
VO
Min
Typ
Max
1.782
2.475
2.970
3.267
4.950
1.80
2.50
3.00
3.30
5.00
1.818
2.525
3.030
3.333
5.05
1.764
2.450
2.940
3.234
4.900
−
−
−
−
−
1.836
2.550
3.060
3.366
5.100
Unit
Vdc
1.8 V Suffix
2.5 V Suffix
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
Vin = [VO + 1] V, 0 < IO < 100 mA
2% Tolerance from TJ = −40 to +125°C
Line Regulation
Vin = [VO + 1] V to 12 V, IO = 250 mA,
All Suffixes TA = 25°C
Regline
−
2.0
10
mV
Load Regulation
Vin = [VO + 1] V, IO = 0 mA to 250 mA,
All Suffixes TA = 25°C
Regload
−
5.0
25
mV
−
−
−
−
25
115
220
260
100
200
400
500
65
75
−
−
−
160
46
−
−
IQOn
−
125
200
A
IQOff
−
0.3
4.0
A
−
−
−
1500
1500
1500
2000
2000
2000
−
450
−
2.4
−
−
−
−
−
−
0.5
0.3
−
150
−
Dropout Voltage (Note 3)
TJ = −40°C to +125°C
IO = 10 mA
IO = 100 mA
IO = 250 mA
IO = 300 mA
Ripple Rejection (120 Hz)
Vin − VO
Vin(peak−peak) = [VO + 1.5] V to [VO + 5.5] V
Output Noise Voltage
CL = 1.0 F
IO = 50 mA (10 Hz to 100 kHz)
CL = 200 F
−
Vn
mV
dB
Vrms
CURRENT PARAMETERS
Quiescent Current ON Mode
Vin = [VO + 1] V, IO = 0 mA
Quiescent Current OFF Mode
Quiescent Current ON Mode SAT
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
Vin = [VO − 0.5] V, IO = 0 mA (Notes 2, 4)
IQSAT
Current Limit
Vin = [VO + 1] V, VO Shorted
ILIMIT
A
mA
ON/OFF INPUTS
On/Off Input Voltage
Logic “1” (Regulator On) Vout = VO ± 2%
Logic “0” (Regulator Off) Vout < 0.03 V
Logic “0” (Regulator Off) Vout < 0.05 V (1.8 V Option)
VCTRL
V
THERMAL SHUTDOWN
Thermal Shutdown
1.
2.
3.
4.
−
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Quiescent Current is measured where the PNP pass transistor is in saturation. Vin = [VO − 0.5] V guarantees this condition.
For 1.8 V version VDO is constrained by the minimum input voltage of 2.5 V.
For 1.8 V and 2.5 V versions, IQSAT is constrained by the minimum input voltage of 2.5 V.
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3
°C
MC33375, NCV33375 Series
DEFINITIONS
Load Regulation − The change in output voltage for a
change in load current at constant chip temperature.
Dropout Voltage − The input/output differential at which
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential), dropout voltage is affected
by junction temperature, load current and minimum input
supply requirements.
Output Noise Voltage − The RMS AC voltage at the
output with a constant load and no input ripple, measured
over a specified frequency range.
Maximum Power Dissipation − The maximum total
dissipation for which the regulator will operate within
specifications.
Quiescent Current − Current which is used to operate the
regulator chip and is not delivered to the load.
Line Regulation − The change in output voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
Maximum Package Power Dissipation − The maximum
package power dissipation is the power dissipation level at
which the junction temperature reaches its maximum value
i.e. 150°C. The junction temperature is rising while the
difference between the input power (VCC X ICC) and the
output power (Vout X Iout) is increasing.
Depending on ambient temperature, it is possible to
calculate the maximum power dissipation and so the
maximum current as following:
T –T
Pd + J A
R
JA
The maximum operating junction temperature TJ is
specified at 150°C, if TA = 25°C, then PD can be found. By
neglecting the quiescent current, the maximum power
dissipation can be expressed as:
I out +
P
D
V – Vout
CC
The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
Then you can calculate the power dissipation by
subtracting the output power from the input power. All
variables are then well known: power dissipation, thermal
shutdown temperature (150°C for MC33375) and ambient
temperature.
R
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4
T –T
+ J A
JA
P
D
MC33375, NCV33375 Series
7
150
TA = 25° C
6 CL = 33 F
IL = 10 mA
5 Vout = 3.3 V
100
4
50
3
0
2
Vout
-50
1
0
0
20
40
60
80
100
120
140
160
70
60
Vin
Vin , INPUT VOLTAGE (V)
Vin
200
40
4
30
3
20
10
2
0
Vout
1
0
50
100
Figure 3. Line Transient Response
1.0
300
0
-300
Vout
CHANGE
-400 CL = 1.0 F
Vout = 3.3 V
-500 TA = 25° C
-600 Vin = 4.3 V
0
50
-0.2
-0.4
-0.6
-0.8
100
150
200
250
300
350
LOAD CURRENT (mA)
LOAD CURRENT (mA)
0.2
LOAD CURRENT
150
-50
0.04
-150
-0.01
-250
-350
CL = 33.0 F
Vout = 3.3 V
TA = 25° C
Vin = 4.3 V
Vout
CHANGE
-450
-550
-0.06
-0.11
-650
-750
-1.0
400
-0.16
0
50
TIME (S)
100
150
200
250
300
TIME (S)
Figure 5. Load Transient Response
Figure 4. Load Transient Response
300
3.5
3.0
IL = 1 mA
2.5
DROPOUT VOLTAGE (mV)
OUTPUT VOLTAGE (V)
0.09
50
OUTPUT VOLTAGE CHANGE (V)
0.4
-200
0.14
250
0.6
OUTPUT VOLTAGE CHANGE (V)
LOAD
CURRENT
-100
-700
350
0.8
0
-20
200
150
TIME (S)
Figure 2. Line Transient Response
100
-10
0
-100
180 200
TIME (S)
200
50
OUTPUT VOLTAGE CHANGE (mV)
TA = 25° C
6 CL = 0.47 F
IL = 10 mA
5 Vout = 3.3 V
OUTPUT VOLTAGE CHANGE (mV)
Vin , INPUT VOLTAGE (V)
7
IL = 250 mA
2.0
1.5
1.0
250
200
150
100
50
0.5
0
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
1
4.5 5.0
10
100
1000
INPUT VOLTAGE (V)
IO, OUTPUT CURRENT (mA)
Figure 6. Output Voltage versus Input Voltage
Figure 7. Dropout Voltage versus Output Current
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5
MC33375, NCV33375 Series
12
250
10
IL = 300 mA
8
200
Ignd (mA)
DROPOUT VOLTAGE (mV)
300
IL = 250 mA
150
IL = 100 mA
100
50
4
0
IL = 100 mA
2
IL = 10 mA
0
-40
IL = 300 mA
6
IL = 50 mA
25
0
85
0
1
2
3
TEMPERATURE (°C)
4
5
6
7
8
Vin (VOLTS)
Figure 9. Ground Pin Current versus
Input Voltage
Figure 8. Dropout Voltage versus Temperature
2.5
8
7
IL = 250 mA
IO = 0
2.495
Vout (VOLTS)
Ignd (mA)
6
5
4
3
IL = 100 mA
2.49
IO = 250 mA
2.485
2.48
2
IL = 50 mA
1
0
-40
-20
0
20
40
60
80
100
120
2.475
2.47
-40
140
0
25
TA (°C)
TEMPERATURE (°C)
Figure 10. Ground Pin Current versus
Ambient Temperature
Figure 11. Output Voltage versus Ambient
Temperature (Vin = Vout + 1V)
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6
85
MC33375, NCV33375 Series
2.5
IO = 0
2.495
Vout (VOLTS)
2.49
IO = 250 mA
2.485
2.48
2.475
2.47
2.465
-40
0
25
85
TEMPERATURE (°C)
Figure 12. Output Voltage versus Ambient
Temperature (Vin = 12 V)
70
70
60
50
IL = 1 mA
dB
30
20
20
10
10
1
10
IL = 250 mA
40
30
0
0.1
IL = 100 mA
50
40
0
0.1
100
1
10
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 13. Ripple Rejection
Figure 14. Ripple Rejection
5
ENABLE
4.5
4
VOLTAGE (V)
dB
60
IL = 10 mA
3.5
CL = 1.0 F
3
2.5
CL = 33 F
2
1.5
1
0.5
0
0
100
200
300
400
TIME (S)
Figure 15. Enable Transient
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7
500
100
MC33375, NCV33375 Series
1.8 V Option
2.0
1.85
ILOAD = 100 mA
1.8
VOUT, OUTPUT VOLTAGE (V)
VOUT , OUTPUT VOLTAGE (V)
1.84
1.83
1.82
1.81
1.80
1.79
1.78
1.77
1.76
1.75
-40
1.6
1.4
1.2
1.0
0.8
0.6
TA = 25° C
ILOAD = 0 mA
0.4
0.2
0
-20
0
20
40
60
80
100
120
1
0
3
2
TA, AMBIENT TEMPERATURE (°C)
Figure 16. Output Voltage versus Temperature
140
10
120
TA = 25° C
VCC = 3 V
IQ ( A)
Ignd , (mA)
100
6
4
80
60
40
2
TA = 25° C
ILOAD = 0 mA
20
0
0
50
0
100
150
200
250
300
350
0
1
3
2
ILOAD, (mA)
5
4
6
VCC, (V)
Figure 19. Quiescent Current versus Input Voltage
Figure 18. Ground Current versus Load Current
80
VCC = 3 V
ILOAD = 1 mA
TA = 25°C
COUT = 1 F
2V
70
60
PSRR (dB)
6
Figure 17. Output Voltage versus Input Voltage
12
8
5
4
VCC, (V)
50
ENABLE
VOUT
40
30
20
0V
10
0
0.1
1
10
100
0
1000
5
10
15
20
25
30
35
40
f, FREQUENCY (kHz)
t, TIME (s)
Figure 20. PSRR versus Frequency
Figure 21. Enable Response
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8
45
50
MC33375, NCV33375 Series
VCC = 3 V
ILOAD = 1 mA to 100 mA
TA = 25°C
1.82 V
1.80 V
1.78 V
100 mA
1 mA
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
t, TIME (ms)
Figure 22. Load Transient Response
APPLICATIONS INFORMATION
ON/OFF
Vout
Vin
MC33375−xx
Cin
Cout
LOAD
GND
Figure 23. Typical Application Circuit
frequencies. A 0.33 F or larger tantalum, mylar, ceramic,
or other capacitor having low internal impedance at high
frequencies should be chosen. The bypass capacitor should
be mounted with shortest possible lead or track length
directly across the regulator’s input terminals. Figure 16
shows the ESR that allows the LDO to remain stable for
various load currents.
The MC33375 regulators are designed with internal
current limiting and thermal shutdown making them
user−friendly. Figure 15 is a typical application circuit. The
output capability of the regulator is in excess of 300 mA,
with a typical dropout voltage of less than 260 mV. Internal
protective features include current and thermal limiting.
EXTERNAL CAPACITORS
These regulators require only a 0.33 F (or greater)
capacitance between the output and ground for stability for
1.8 V, 2.5 V, 3.0 V, and 3.3 V output voltage options. Output
voltage options of 5.0 V require only 0.22 F for stability.
The output capacitor must be mounted as close as possible
to the MC33375. If the output capacitor must be mounted
further than two centimeters away from the MC33375, then
a larger value of output capacitor may be required for
stability. A value of 0.68 F or larger is recommended. Most
type of aluminum, tantalum, or multilayer ceramic will
perform adequately. Solid tantalums or appropriate
multilayer ceramic capacitors are recommended for
operation below 25°C. An input bypass capacitor is
recommended to improve transient response or if the
regulator is connected to the supply input filter with long
wire lengths, more than 4 inches. This will reduce the
circuit’s sensitivity to the input line impedance at high
ESR (ohm)
100
Vout = 3.0 V
Cout = 1.0 F
Cin = 1.0 F
10
Stable Region
1.0
0.1
0
50
100
150
200
250
300
LOAD CURRENT (mA)
Figure 24. ESR for Vout = 3.0V
Applications should be tested over all operating
conditions to insure stability.
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9
MC33375, NCV33375 Series
THERMAL PROTECTION
The internal current limit will typically limit current to
450 mA. If during current limit the junction exceeds 150°C,
the thermal protection will protect the device also. Current
limit is not a substitute for proper heatsinking.
Internal thermal limiting circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated, typically at
150°C, the output is disabled. There is no hysteresis built
into the thermal protection. As a result the output will appear
to be oscillating during thermal limit. The output will turn
off until the temperature drops below the 150°C then the
output turns on again. The process will repeat if the junction
increases above the threshold. This will continue until the
existing conditions allow the junction to operate below the
temperature threshold.
OUTPUT NOISE
In many applications it is desirable to reduce the noise
present at the output. Reducing the regulator bandwidth by
increasing the size of the output capacitor will reduce the
noise on the MC33375.
ON/OFF PIN
Thermal limit is not a substitute for proper
heatsinking.
1.6
160
1.4
PD(max) for TA = 50°C
140
L
100
80
60
RJA
0
5.0
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
1.2
2.0 oz. Copper
L
Minimum
Size Pad
120
10
15
20
25
L, LENGTH OF COPPER (mm)
1.0
0.8
0.6
0.4
30
Figure 25. SOT−223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
R θ JA, THERMAL RESISTANCE, JUNCTION‐TO‐AIR (°C/W)
RJA, THERMAL RESISTANCE,
JUNCTION−TO−AIR (°CW)
180
PD, MAXIMUM POWER DISSIPATION (W)
When this pin is pulled low, the MC33375 is off. This pin
should not be left floating. The pin should be pulled high for
the MC33375 to operate.
3.2
170
150
130
110
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
2.4
Graph Represents Symmetrical Layout 2.0
90
L
70
0
10
2.0 oz.
Copper
3.0
mm
L
RJA
50
30
2.8
PD(max) for TA = 50°C
20
30
40
1.6
1.2
0.8
50
0.4
L, LENGTH OF COPPER (mm)
Figure 26. SOP−8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
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10
MC33375, NCV33375 Series
ORDERING INFORMATION
Operating
Temperature Range,
Tolerance
Package
Shipping†
SOT−223
(Pb−Free)
4000 / Tape & Reel
SOIC−8
(Pb−Free)
98 Units / Rail
SOIC−8
(Pb−Free)
2500 / Tape & Reel
MC33375ST−2.5T3G
SOT−223
(Pb−Free)
4000 / Tape & Reel
MC33375D−3.0G
SOIC−8
(Pb−Free)
98 Units / Rail
1% Tolerance
at TA = 25°C
SOIC−8
(Pb−Free)
2500 / Tape & Reel
2% Tolerance at
TJ from −40 to +125°C
SOT−223
(Pb−Free)
4000 / Tape & Reel
SOIC−8
(Pb−Free)
98 Units / Rail
SOIC−8
(Pb−Free)
2500 / Tape & Reel
SOT−223
(Pb−Free)
4000 / Tape & Reel
SOIC−8
(Pb−Free)
98 Units / Rail
SOIC−8
(Pb−Free)
2500 / Tape & Reel
SOT−223
(Pb−Free)
4000 / Tape & Reel
Device
Type
MC33375ST−1.8T3G
1.8 V
(Fixed Voltage)
NCV33375ST1.8T3G*
MC33375D−2.5G
MC33375D−2.5R2G
2.5 V
(Fixed Voltage)
NCV33375D−2.5R2G*
MC33375D−3.0R2G
3.0 V
(Fixed Voltage)
MC33375ST−3.0T3G
MC33375D−3.3G
MC33375D−3.3R2G
3.3 V
(Fixed Voltage)
NCV33375D−3.3R2G*
MC33375ST−3.3T3G
NCV33375ST3.3T3G*
MC33375D−5.0G
5.0 V
(Fixed Voltage)
MC33375D−5.0R2G
MC33375ST−5.0T3G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable
DEVICE MARKING
Device
Version
Marking (1st line)
MC33375, NCV33375
1.8 V
37518
MC33375, NCV33375
2.5 V
37525
MC33375
3.0 V
37530
MC33375, NCV33375
3.3 V
37533
MC33375
5.0 V
37550
TAPE AND REEL SPECIFICATIONS†
Device
Reel Size
Tape Width
Quantity
MC33375D, NCV33375D
13″
12 mm Embossed Tape
2500 Units
MC33375ST, NCV33375ST
13″
8 mm Embossed Tape
4000 Units
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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11
MC33375, NCV33375 Series
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE N
D
b1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
4
HE
1
2
3
b
e1
e
A1
C
q
A
0.08 (0003)
DIM
A
A1
b
b1
c
D
E
e
e1
L
L1
HE
E
q
L
MIN
1.50
0.02
0.60
2.90
0.24
6.30
3.30
2.20
0.85
0.20
1.50
6.70
0°
MILLIMETERS
NOM
MAX
1.63
1.75
0.06
0.10
0.75
0.89
3.06
3.20
0.29
0.35
6.50
6.70
3.50
3.70
2.30
2.40
0.94
1.05
−−−
−−−
1.75
2.00
7.00
7.30
10°
−
L1
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
12
MIN
0.060
0.001
0.024
0.115
0.009
0.249
0.130
0.087
0.033
0.008
0.060
0.264
0°
INCHES
NOM
0.064
0.002
0.030
0.121
0.012
0.256
0.138
0.091
0.037
−−−
0.069
0.276
−
MAX
0.068
0.004
0.035
0.126
0.014
0.263
0.145
0.094
0.041
−−−
0.078
0.287
10°
MC33375, NCV33375 Series
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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MC33375/D