MC12080 1.1 GHz Prescaler Description The MC12080 is a single modulus divide by 10, 20, 40, 80 prescaler for low power frequency division of a 1.1 GHz high frequency input signal. Divide ratio control inputs SW1, SW2 and SW3 select the required divide ratio of ÷10, ÷20, ÷40, or ÷80. An external load resistor is required to terminate the output. An 820 W resistor is recommended to achieve a 1.2 Vpp output swing, when dividing a 1.1 GHz input signal by the minimum divide by ratio of 10, assuming a 8.0 pF load. Output current can be minimized dependent on conditions such as output frequency, capacitive load being driven, and output voltage swing required. Typical values for load resistors are included in the Vout specification for various divide ratios at 1.1 GHz input frequency. http://onsemi.com MARKING DIAGRAM 8 8 1 1 A L Y W G Features • • • • • 1.1 GHz Toggle Frequency Supply Voltage 4.5 to 5.5 V Low Power 3.7 mA Typical at VCC = 5.0 V Operating Temperature Range of −40 to 85°C These Devices are Pb−Free and are RoHS Compliant Symbol Power Supply Voltage, Pin 2 Value −0.5 to 7.0 Vdc Operating Temperature Range TA −40 to 85 °C Storage Temperature Range Tstg −65 to 150 °C IO 10 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ESD Protection Human Body Model Machine Model Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability Rating Oxygen Index: 28 to 34 1 8 2 7 3 6 4 5 In SW3 SW2 GND (Top View) FUNCTION TABLE SW1 SW2 SW3 Divide Ratio L L L 80 L L H 40 L H L 40 Value L H H 20 > 1500 V > 100 V H L L 40 H L H 20 Level 1 H H L 20 H H H 10 Table 2. ATTRIBUTES Characteristics = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package In VCC SW1 Out Unit VCC Maximum Output Current, Pin 4 12080 ALYW G PIN CONNECTIONS Table 1. MAXIMUM RATINGS Rating SOIC−8 D SUFFIX CASE 751 UL 94 V−0 @ 0.125 in NOTE: SW1, SW2 and SW3: H = VCC, L = Open. Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. © Semiconductor Components Industries, LLC, 2013 May, 2013 − Rev. 7 1 Publication Order Number: MC12080/D MC12080 Table 3. ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 V; TA = −40 to 85°C, unless otherwise noted.) Characteristic Symbol Min Typ Max Unit Toggle Frequency (Sine Wave) ft 0.1 1.4 1.1 GHz Supply Current Output (Pin 2) ICC − 3.7 5.0 mA Input Voltage Sensitivity 100 to 250 MHz 250 to 1100 MHz Vin 400 100 − − 1000 1000 Divide Ratio Control Input High (SW1, SW2, SW3) VIH VCC − 0.5 V VCC VCC + 0.5 V V Divide Ratio Control Input Low (SW1, SW2, SW3) VIL Open Open Open − Output Voltage Swing (Note 1) RL = 820 W, IO = 4.0 mA for ÷10 RL = 1.6 kW, IO = 2.1 mA for ÷20 RL = 3.3 kW, IO = 1.1 mA for ÷40 RL = 6.2 kW, IO = 0.57 mA for ÷80 Vout 0.8 1.2 − Vpp mVpp 1. Assumes 8.0 pF load and 1.1 GHz input frequency (typical), IO at VCC = 5.0 V and TA = 25°C. In In D Q D Q D C Q C Q C Q Q 1 D Q D Q D Q D Q C Q C Q C Q C Q 0 Out SW1 SW3 SW2 Figure 1. Logic Diagram VCC = 4.5 to 5.5 V C3 Sine Wave Generator VCC C1 SW1 In SW2 50 W SW3 C2 In Out Gnd CL RL Figure 2. AC Test Circuit http://onsemi.com 2 External Components C1 = C2 = 1000 pF C3 = 0.1 mF CL = 8.0 pF (Including Scope and Jig Capacitance) RL = 820 W for ÷10 at 1.1 GHz MC12080 +15.0 +1257.40 +10.0 +707.11 ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ 0 +223.61 OPERATING WINDOW -5.0 AMPLITUDE (dBm) +397.64 -10.0 -15.0 -20.0 +125.74 +70.71 +39.76 +22.36 -25.0 +12.57 -30.0 +7.07 -35.0 +3.98 -40.0 +2.24 -45.0 +1.26 -50.0 0 200 400 600 800 1000 1200 1400 mVrms +5.0 +0.71 1800 1600 FREQUENCY (MHz) Divide Ratio = 10; VCC = 5.0 V; TA = 25°C Figure 3. Input Signal Amplitude versus Input Frequency 2000 1200 800 mVpp 1600 400 0 200 400 600 800 1000 1200 1400 1600 0 1800 FREQUENCY (MHz) Figure 4. Output Amplitude versus Input Frequency ORDERING INFORMATION Device MC12080DG MC12080DR2G Package Shipping† SOIC−8 (Pb−Free) 98 Units / Rail 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 3 MC12080 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AK −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H M D 0.25 (0.010) M Z Y S X J S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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