MC12026A 1.1 GHz Dual Modulus Prescaler Description The MC12026 is a high frequency, low voltage dual modulus prescaler used in phase−locked loop (PLL) applications. The MC12026A can be used with CMOS synthesizers requiring positive edges to trigger internal counters in a PLL to provide tuning signals up to 1.1 GHz in programmable frequency steps. A Divide Ratio Control (SW) permits selection of an 8/9 or 16/17 divide ratio as desired. The Modulus Control (MC) selects the proper divide number after SW has been biased to select the desired divide ratio. http://onsemi.com MARKING DIAGRAM 8 SOIC−8 D SUFFIX CASE 751 8 1 1 Features • • • • • • • • 1.1 GHz Toggle Frequency Supply Voltage 4.5 to 5.5 V Low Power 4.0 mA Typical Operating Temperature Range of −40 to 85°C The MC12026 is Pin Compatible with the MC12022 Short Setup Time (tset ) 6.0 ns Typical @ 1.1 GHz Modulus Control Input Level is Compatible with Standard CMOS and TTL Pb−Free Packages are Available Table 1. FUNCTIONAL TABLE SW MC H 8 H L 9 L H 16 L L 17 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package PIN CONNECTIONS IN VCC SW OUT Divide Ratio H A L Y W G 026A ALYW G 1 8 2 7 3 6 4 5 IN NC MC GND (Top View) 1. SW: H = VCC, L = Open. A logic L can also be applied by grounding this pin, but this is not recommended due to increased power consumption. 2. MC: H = 2.0 V to VCC, L = GND to 0.8 V. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Table 2. MAXIMUM RATINGS Characteristics Symbol Value Unit VCC −0.5 to 7.0 Vdc Operating Temperature Range TA −40 to 85 °C Storage Temperature Range Tstg −65 to 150 °C Modulus Control Input, Pin 6 MC −0.5 to 6.5 Vdc IO 10.0 mA Power Supply Voltage, Pin 2 Maximum Output Current, Pin 4 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. NOTE: ESD data available upon request. © Semiconductor Components Industries, LLC, 2006 January, 2006 − Rev. 8 1 Publication Order Number: MC12026A/D MC12026A Table 3. ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5; TA = −40 to 85°C, unless otherwise noted.) Symbol Min Typ Max Unit ft 0.1 1.4 1.1 GHz Supply Current Output Unloaded (Pin 2) ICC − 4.0 5.3 mA Modulus Control Input High (MC) VIH1 2.0 − VCC V Modulus Control Input Low (MC) VIL1 GND − 0.8 V Divide Ratio Control Input High (SW) VIH2 VCC − 0.5 V VCC VCC + 0.5 V V Divide Ratio Control Input Low (SW) VIL2 OPEN OPEN OPEN − Output Voltage Swing (RL = 560 W; IO = 5.5 mA) (Note 3) (RL = 1.1 kW; IO = 2.9 mA) (Note 4) Vout 1.0 1.6 − Vpp Modulus Setup Time MC to Out (Note 5) tSET − 6.0 9.0 ns Input Voltage Sensitivity 100−250 MHz 250−1100 MHz Vin 400 100 − − 1000 1000 Characteristic Toggle Frequency (Sin Wave) 3. Divide Ratio of ÷8/9 at 1.1 GHz, CL = 8.0 pF. 4. Divide Ratio of ÷16/17 at 1.1 GHz, CL = 8.0 pF. 5. Assuming RL = 560 W at 1.1 GHz. In In D Q D Q C QB C QB D Q QB C M MC 1 D QB D QB C Q C Q 0 SW Out Figure 1. Logic Diagram (MC12026A) Prop. Delay In Out MC Setup MC Release Modulus setup time MC to out is the MC setup or MC release plus the prop delay. Figure 2. Modulus Setup Time http://onsemi.com 2 MC mVpp MC12026A VCC = 4.5 to 5.5V C3 SINE WAVE GENERATOR C1 VCC SW IN 50 W OUT C2 RL IN MC CL GND EXTERNAL COMPONENTS C1 = C2 = 1000 pF C3 = 0.1mF CL = 8pF (Including Scope and Jig Capacitance) RL = 560W (for ÷8/9 at 1.1GHz) MC INPUT Figure 3. AC Test Circuit +15.0 +1257.40 ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ +5.0 0 +397.64 +223.61 OPERATING WINDOW −5.0 −10.0 −15.0 −20.0 +125.74 +70.71 +39.76 +22.36 −25.0 +12.57 −30.0 +7.07 −35.0 +3.98 −40.0 +2.24 −45.0 +1.26 −50.0 0 200 400 600 800 1000 1200 1400 1600 +0.71 1800 FREQUENCY (MHz) Divide Ratio = 8; VCC = 5.0 V; TA = 25°C Figure 4. Input Signal Amplitude versus Input Frequency 2000 1600 1200 800 400 0 200 400 600 800 1000 1200 1400 FREQUENCY (MHz) Figure 5. Output Amplitude versus Input Frequency http://onsemi.com 3 1600 0 1800 mVpp AMPLITUDE (dBm) +707.11 mVrms +10.0 MC12026A 5.88V 880mV 36.6ns 86.6ns (÷8, 1.1 GHz Input Frequency, VCC = 5.0, TA = 25°C, Output Loaded With 8.0pF) Figure 6. Typical Output Waveform http://onsemi.com 4 MC12026A 200 150 100 R MHz 50 0 −50 OHMS −100 −150 −200 −250 −300 −350 −400 −450 jX −500 −550 −600 −650 100 200 300 400 500 600 700 800 900 1000 1100 1200 Figure 7. Typical Input Impedance versus Input Frequency ORDERING INFORMATION Device MC12026AD Package Shipping † SOIC−8 98 Units / Rail MC12026ADG SOIC−8 (Pb−Free) 98 Units / Rail MC12026ADR2 SOIC−8 2500 / Tape & Reel SOIC−8 (Pb−Free) 2500 / Tape & Reel MC12026ADR2G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 MC12026A PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AG −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 1 0.25 (0.010) M Y M 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 6 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. MC12026A/D