MOTOROLA MC12026AP

SEMICONDUCTOR TECHNICAL DATA
The MC12026 is a high frequency, low voltage dual modulus prescaler
used in phase–locked loop (PLL) applications.
The MC12026A can be used with CMOS synthesizers requiring
positive edges to trigger internal counters such as Motorola’s MC145xxx
series in a PLL to provide tuning signals up to 1.1GHz in programmable
frequency steps.
The MC12026B can be used with CMOS synthesizers requiring
negative edges to trigger internal counters.
A Divide Ratio Control (SW) permits selection of an 8/9 or 16/17 divide
ratio as desired.
The Modulus Control (MC) selects the proper divide number after SW
has been biased to select the desired divide ratio.
MECL PLL COMPONENTS
÷8/9, ÷16/17
DUAL MODULUS PRESCALER
NOTE: The “B” Version Is Not Recommended for New Designs
•
•
•
•
•
•
•
1.1GHz Toggle Frequency
Supply Voltage 4.5V to 5.5V
Low Power 4.0mA Typical
P SUFFIX
8–LEAD PLASTIC PACKAGE
CASE 626–05
Operating Temperature Range of –40°C to +85°C
The MC12026 is Pin Compatible With the MC12022
Short Setup Time (tset ) 6ns Typical @ 1.1GHz
Modulus Control Input Level is Compatible With Standard CMOS
and TTL
D SUFFIX
8–LEAD PLASTIC SOIC PACKAGE
CASE 751–05
Pinout: 8–Lead Plastic (Top View)
IN
NC
MC
GND
8
7
6
5
1
2
3
4
IN
VCC
SW
OUT
FUNCTION TABLE
SW
MC
Divide Ratio
H
H
8
H
L
9
L
H
16
L
L
17
Note: SW: H = VCC, L = OPEN
MC: H = 2.0V to VCC; L = GND to 0.8V
MAXIMUM RATINGS
Symbol
Characteristic
Range
Unit
VCC
Power Supply Voltage, Pin 2
–0.5 to +7.0
Vdc
TA
Operating Temperature Range
–40 to +85
°C
Tstg
Storage Temperature Range
–65 to +150
°C
MC
Modulus Control Input, Pin 6
–0.5 to +6.5
Vdc
IO
Maximum Output Current, Pin 4
10.0
mA
1/97
 Motorola, Inc. 1997
1
REV 3
MC12026A MC12026B
ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5; TA = –40 to +85°C)
Symbol
Characteristic
Min
Typ
Max
Unit
ft
Toggle Frequency (Sin Wave)
0.1
1.4
1.1
GHz
ICC
Supply Current Output Unloaded (Pin 2)
—
4.0
5.3
mA
VIH1
Modulus Control Input High (MC)
2.0
—
VCC
V
VIL1
Modulus Control Input Low (MC)
GND
—
0.8
V
VIH2
Divide Ratio Control Input High (SW)
VCC – 0.5V
VCC
VCC + 0.5V
V
VIL2
Divide Ratio Control Input Low (SW)
OPEN
OPEN
OPEN
—
Vout
Output Voltage Swing
(RL = 560Ω; IO = 5.5mA)1
(RL = 1.1kΩ; IO = 2.9mA)2
1.0
1.6
—
Vp–p
tSET
Modulus Setup Time MC to Out3
—
6
9
ns
Vin
Input Voltage Sensitivity
100–250MHz
250–1100MHz
400
100
—
—
1000
1000
mVpp
1. Divide Ratio of ÷8/9 at 1.1GHz, CL = 8pF
2. Divide Ratio of ÷16/17 at 1.1GHz, CL = 8pF
3. Assuming RL = 560Ω at 1.1GHz
In
In
D
Q
D
Q
C
QB
C
QB
D
Q
QB
C M
MC
1
D
QB
D
QB
C
Q
C
Q
0
SW
Out
Figure 1. Logic Diagram (MC12026A)
Prop. Delay
In
Out
MC Setup
MC
MC Release
Modulus setup time MC to out is the MC
setup or MC release plus the prop delay.
Figure 2. Modulus Setup Time
MOTOROLA
2
HIPERCOMM
BR1334 — Rev 4
MC12026A MC12026B
VCC = 4.5 to 5.5V
C3
SINE WAVE GENERATOR
C1
VCC
SW
IN
50 Ω
OUT
C2
RL
IN
MC
CL
GND
EXTERNAL COMPONENTS
C1 = C2 = 1000 pF
C3 = 0.1µF
CL = 8pF (Including Scope and Jig Capacitance)
RL = 560Ω (for ÷8/9 at 1.1GHz)
MC INPUT
Figure 3. AC Test Circuit
+15.0
+1257.40
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
+5.0
0
+397.64
+223.61
OPERATING
WINDOW
–5.0
AMPLITUDE (dBm)
+707.11
–10.0
–15.0
–20.0
+125.74
+70.71
+39.76
+22.36
–25.0
+12.57
–30.0
+7.07
–35.0
+3.98
–40.0
+2.24
–45.0
+1.26
–50.0
0
200
400
600
800
1000
1200
1400
1600
MILLIVOLTS
+10.0
+0.71
1800
FREQUENCY (MHz)
Figure 4. Input Signal Amplitude versus Input Frequency
Divide Ratio = 8; VCC = 5.0V; TA = 25°C
AMPLITUDE (dBm)
2000
1200
800
MILLIVOLTS
1600
400
0
200
400
600
800
1000
1200
1400
1600
0
1800
FREQUENCY (MHz)
Figure 5. Output Amplitude versus Input Frequency
HIPERCOMM
BR1334 — Rev 4
3
MOTOROLA
MC12026A MC12026B
5.88V
880mV
36.6ns
86.6ns
Figure 6. Typical Output Waveform
(÷8, 1.1GHz Input Frequency, VCC = 5.0, TA = 25°C, Output Loaded With 8pF)
MOTOROLA
4
HIPERCOMM
BR1334 — Rev 4
MC12026A MC12026B
200
150
R
100
MHz
50
0
–50
OHMS
–100
–150
–200
–250
–300
–350
–400
–450
jX
–500
–550
–600
–650
100
200
300
400
500
600
700
800
900
1000
1100
1200
Figure 7. Typical Input Impedance versus Input Frequency
HIPERCOMM
BR1334 — Rev 4
5
MOTOROLA
MC12026A MC12026B
OUTLINE DIMENSIONS
8
P SUFFIX
PLASTIC PACKAGE
CASE 626–05
ISSUE K
5
–B–
1
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4
F
–A–
NOTE 2
L
DIM
A
B
C
D
F
G
H
J
K
L
M
N
C
J
–T–
N
SEATING
PLANE
D
M
K
G
H
0.13 (0.005)
M
T A
M
8
C
5
0.25
H
E
M
B
M
1
4
B
e
h
A
C
X 45 _
q
SEATING
PLANE
0.10
A1
B
0.25
M
L
C B
S
A
INCHES
MIN
MAX
0.370
0.400
0.240
0.260
0.155
0.175
0.015
0.020
0.040
0.070
0.100 BSC
0.030
0.050
0.008
0.012
0.115
0.135
0.300 BSC
–––
10_
0.030
0.040
M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751–05
ISSUE R
D
A
B
MILLIMETERS
MIN
MAX
9.40
10.16
6.10
6.60
3.94
4.45
0.38
0.51
1.02
1.78
2.54 BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 BSC
–––
10_
0.76
1.01
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.18
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
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◊
MOTOROLA
6
MC12026A/D
HIPERCOMM
BR1334 — Rev 4