IMH20TR1G Dual Bias Resistor Transistor NPN Surface Mount • Low VCC (sat) 80 mV max at IC/IB = 50 mA/2.5 mA • High Current: IC = 600 mA max • This is a Pb−Free Device http://onsemi.com MAXIMUM RATINGS (TA = 25°C) Rating Symbol Value Unit V(BR)CBO 30 Vdc Collector−Emitter Voltage V(BR)CEO 15 Vdc Emitter−Base Voltage V(BR)EBO 5.0 Vdc IC 600 mAdc Collector−Base Voltage (6) (4) Collector Current − Continuous (5) Q1 R1 (2) (1) (3) THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Power Dissipation* PD 300 mW Junction Temperature TJ 150 °C Storage Temperature Tstg −55 to +150 °C R1 Q2 SC−74 MARKING DIAGRAM *Total for both Transistors. 6 Q1 + Q2: NPN 1 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit Collector−Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0) V(BR)CEO 15 − Vdc Collector−Base Breakdown Voltage (IC = 50 Adc, IE = 0) V(BR)CBO 30 − Vdc Emitter−Base Breakdown Voltage (IE = 50 Adc, IC = 0) V(BR)EBO 5.0 − Vdc Collector−Base Cutoff Current (VCB = 20 Vdc, IE = 0) ICBO − 0.5 Adc Emitter−Base Cutoff Current (VEB = 4.0 V, IC = 0) IEBO − 0.5 Adc DC Current Gain (Note 1) (VCE = 5.0 Vdc, IC = 50 mAdc) hFE 100 600 − VCE(sat) − 80 mV R1 1.54 2.86 k Collector−Emitter Saturation Voltage (IC = 50 mAdc, IB = 2.5 mAdc) Input Resistance H20 M SC−74R 318AA Style 21 H20 = Specific Device Code M = Date Code ORDERING INFORMATION Device Package Shipping† IMH20TR1G SC−74R 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1. Pulse Test: Pulse Width ≤ 300 s, D.C. ≤ 2%. Semiconductor Components Industries, LLC, 2004 January, 2004 − Rev. 0 Publication Order Number: IMH20TR1G/D IMH20TR1G PACKAGE DIMENSIONS SC−74R CASE 318AA−01 ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 4 5 6 B S 3 2 1 D G M J C 0.05 (0.002) K H INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0649 0 10 0.0985 0.1181 DIM A B C D G H J K L M S MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.65 0 10 2.50 3.00 STYLE 21: PIN 1. COLLECTOR 1 2. EMITTER 2 3. BASE 2 4. COLLECTOR 2 5. EMITTER 1 6. BASE 1 SOLDERING FOOTPRINT* 2.4 0.094 0.95 0.037 1.9 0.074 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 SC−74R mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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