MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC−74R CASE 318AA−01 ISSUE B 6 1 DATE 27 MAY 2005 SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. D 4 5 3 2 6 E HE 1 b e c A 0.05 (0.002) DIM A A1 b c D E e L HE MIN 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.37 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 10° − MIN 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 0° INCHES NOM 0.039 0.002 0.015 0.007 0.118 0.059 0.037 0.016 0.108 − MAX 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118 10° L A1 GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* 2.4 0.094 XXXM 0.95 0.037 1.9 0.074 XXX M 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 = Specific Device Code = Date Code = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present. mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. STYLE 20: PIN 1. COLLECTOR 1 2. BASE 2 3. EMITTER 2 4. COLLECTOR 2 5. BASE 1 6. EMITTER 1 DOCUMENT NUMBER: STATUS: STYLE 21: PIN 1. COLLECTOR 1 2. EMITTER 2 3. BASE 2 4. COLLECTOR 2 5. EMITTER 1 6. BASE 1 98AON13505D ON SEMICONDUCTOR STANDARD NEW STANDARD: Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 SC−74R http://onsemi.com 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON13505D PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE. 30 SEP 2003 A ADDED STYLE 21. REQ. BY D. BARLOW 03 NOV 2003 B ADDED NOMINAL VALUES AND SOLDERING FOOTPRINT. REQ BY HONG XIAO 27 MAY 2005 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Semiconductor Components Industries, LLC, 2005 May, 2005 − Rev. 01B Case Outline Number: 318AA