MMSD914, SMMSD914 Switching Diode Features • • • • • SOD−123 Surface Mount Package High Breakdown Voltage Fast Speed Switching Time S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant* http://onsemi.com SOD−123 CASE 425 PLASTIC MAXIMUM RATINGS Rating Symbol Value Unit Continuous Reverse Voltage VR 100 Vdc Peak Forward Current IF 200 mAdc IFM(surge) 500 mAdc 1.0 2.0 A A Peak Forward Surge Current Non−repetitive Peak Forward Surge Current Pulse Width =1 second Pulse Width =1 micro second THERMAL CHARACTERISTICS Total Device Dissipation FR−5 Board (Note 1) TA = 25°C Derate above 25°C Thermal Resistance, Junction−to−Ambient Junction and Storage Temperature Range 2 ANODE MARKING DIAGRAM IFSM Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Characteristic 1 CATHODE Symbol Max Unit PD 425 mW 1 5D M G 5D M G G 2 = Specific Device Code = Date Code = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION 3.4 RqJA TJ, Tstg mW/°C Device Package Shipping† °C/W MMSD914T1G SOD−123 (Pb−Free) 3,000 / Tape & Reel SMMSD914T1G SOD−123 (Pb−Free) 3,000 / Tape & Reel MMSD914T3G SOD−123 10,000 / Tape & Reel (Pb−Free) SMMSD914T3G SOD−123 10,000 / Tape & Reel (Pb−Free) 290 −55 to +150 °C 1. FR−5 = 1.0oz Cu, 1.0inz pad †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2012 November, 2012 − Rev. 11 1 Publication Order Number: MMSD914T1/D MMSD914, SMMSD914 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit V(BR) 100 − Vdc − − 25 5.0 nAdc mAdc OFF CHARACTERISTICS Reverse Breakdown Voltage (IBR = 100 mAdc) Reverse Voltage Leakage Current (VR = 20 Vdc) (VR = 75 Vdc) IR Forward Voltage (IF = 10 mAdc) VF − 1000 mVdc Diode Capacitance (VR = 0 Vdc, f = 1.0 MHz) CD − 4.0 pF Reverse Recovery Time (IF = IR = 10 mAdc) (Figure 1) trr − 4.0 ns 820 W +10 V 2k 100 mH 0.1 mF tr IF 0.1 mF tp t IF trr 10% t DUT 50 W OUTPUT PULSE GENERATOR 50 W INPUT SAMPLING OSCILLOSCOPE 90% IR VR INPUT SIGNAL Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 10 mA. Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. Notes: 3. tp » trr Figure 1. Recovery Time Equivalent Test Circuit http://onsemi.com 2 iR(REC) = 1 mA OUTPUT PULSE (IF = IR = 10 mA; measured at iR(REC) = 1 mA) MMSD914, SMMSD914 100 10 I R, REVERSE CURRENT (A) μ 10 TA = 85°C TA = -40°C 1.0 TA = 25°C TA = 125°C 1.0 TA = 85°C 0.1 TA = 55°C 0.01 TA = 25°C 0.1 0.2 0.4 0.6 0.8 1.0 0.001 1.2 0 10 20 30 VF, FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 2. Forward Voltage Figure 3. Leakage Current 0.68 CD , DIODE CAPACITANCE (pF) IF, FORWARD CURRENT (mA) TA = 150°C 0.64 0.60 0.56 0.52 0 2 4 6 VR, REVERSE VOLTAGE (VOLTS) Figure 4. Capacitance http://onsemi.com 3 8 40 50 MMSD914, SMMSD914 PACKAGE DIMENSIONS SOD−123 CASE 425−04 ISSUE G D ÂÂÂÂ ÂÂÂÂ ÂÂÂÂ A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A1 1 HE DIM A A1 b c D E HE L q E 2 q MILLIMETERS NOM MAX 1.17 1.35 0.05 0.10 0.61 0.71 --0.15 1.60 1.80 2.69 2.84 3.68 3.86 ------10 ° MIN 0.037 0.000 0.020 --0.055 0.100 0.140 0.010 0° INCHES NOM 0.046 0.002 0.024 --0.063 0.106 0.145 ----- MAX 0.053 0.004 0.028 0.006 0.071 0.112 0.152 --10 ° STYLE 1: PIN 1. CATHODE 2. ANODE L b MIN 0.94 0.00 0.51 --1.40 2.54 3.56 0.25 0° C SOLDERING FOOTPRINT* ÉÉ ÉÉ ÉÉ ÉÉ 0.91 0.036 2.36 0.093 4.19 0.165 ÉÉ ÉÉ ÉÉ ÉÉ SCALE 10:1 1.22 0.048 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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