MC10H351 Quad TTL/NMOS to PECL* Translator Description The MC10H351 is a quad translator for interfacing data between a saturated logic section and the PECL section of digital systems when only a +5.0 Vdc power supply is available. The MC10H351 has TTL/NMOS compatible inputs and PECL complementary open−emitter outputs that allow use as an inverting/non−inverting translator or as a differential line driver. When the common strobe input is at a low logic level, it forces all true outputs to the PECL low logic state (≈ +3.2 V) and all inverting outputs to the PECL high logic state (≈ +4.1 V). The MC10H351 can also be used with the MC10H350 to transmit and receive TTL/NMOS information differentially via balanced twisted pair lines. http://onsemi.com MARKING DIAGRAMS* MC10H351P AWLYYWWG PDIP−20 P SUFFIX CASE 738 1 20 Features • • • • • Single +5.0 Power Supply All VCC Pins Isolated On Chip Differentially Drive Balanced Lines tpd = 1.3 nsec Typical Pb−Free Packages are Available* 20 1 PLCC−20 FN SUFFIX CASE 775 A WL YY WW G 10H351G AWLYYWW = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2012 October, 2012 − Rev. 8 1 Publication Order Number: MC10H351/D B OUT 2 19 C OUT 5 4 A OUT A OUT N.C. 3 18 C OUT 16 D OUT 17 AOUT 4 AOUT 5 VCC 6 A OUT 4 17 D OUT D OUT A OUT 5 16 D OUT 19 C OUT VCC 6 15 VCC 2 BIN 18 C OUT B IN 7 14 C IN AIN A IN COMMON STROBE GND 8 13 N.C. 9 12 D IN 10 11 TTL VCC VCC (+5.0 VDC) = PINS 6, 11, 15, 20 GND = PIN 10 (DIP) Figure 1. Logic Diagram Figure 2. Dip Pin Assignment COUT ECL VCC 3 2 1 20 19 18 COUT 17 DOUT 16 DOUT 7 15 VCC2 8 14 CIN MC10H351 9 10 11 12 13 NC 20 BOUT 1 DIN C IN 14 COMMON 9 STROBE B OUT B OUT TTL VCC 12 D IN B OUT 2 BOUT 8 A IN 1 NC 7 COMMON STROBE GND B IN ECL VCC MC10H351 Figure 3. PLCC−20 Pin Assignment Table 1. MAXIMUM RATINGS Symbol Rating Unit Power Supply 0 to +7.0 Vdc VI Input Voltage (VCC = 5.0 V) 0 to VCC Vdc Iout Output Current 50 100 mA TA Operating Temperature Range 0 to +75 °C Tstg Storage Temperature Range − Plastic −55 to +150 °C VCC Characteristic − Continuous − Surge Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 MC10H351 Table 2. ELECTRICAL CHARACTERISTICS (VCC = VCC1 = VCC2 = 5.0 V ± 5.0%)† 0° Symbol ECL TTL Characteristic Power Supply Current 25° 75° Min Max Min Max Min Max Unit − 50 − 45 − 50 mA − 20 − 15 − 20 mA IR Reverse Current Pins 7, 8, 12, 14 Pin 9 − − 25 100 − − 20 80 − − 25 100 IF Forward Current Pins 7, 8, 12, 14 Pin 9 − − −0.8 −3.2 − − −0.6 −2.4 − − −0.8 −3.2 5.5 − 5.5 − 5.5 − Vdc − −1.5 − −1.5 − −1.5 Vdc IINH IINL V(BR)in VI Input Breakdown Voltage Input Clamp Voltage (Iin = −18 mA) mA mA VOH High Output Voltage (Note 1.) 3.98 4.16 4.02 4.19 4.08 4.27 Vdc VOL Low Output Voltage (1) 3.05 3.37 3.05 3.37 3.05 3.37 Vdc VIH High Input Voltage 2.0 − 2.0 − 2.0 − Vdc VIL Low Input Voltage − 0.8 − 0.8 − 0.8 Vdc †Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. Outputs are terminated through a 50 W resistor to VCC −2.0 Vdc. *Positive Emitter Coupled Logic 1. With VCC at 5.0 V. VOH/VOL change 1:1 with VCC. Table 3. AC PARAMETERS 0° Symbol 25° 75° Characteristic Min Max Min Max Min Max Unit Propagation Delay (Note 2) 0.4 2.2 0.4 2.2 0.4 2.1 ns tr Rise Time (20% to 80%) 0.4 1.9 0.4 2.0 0.4 2.1 ns tf Fall Time (80% to 20%) 0.4 1.9 0.4 2.0 0.4 2.1 ns Maximum Operating Frequency 150 − 150 − 150 − MHz tpd fmax NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Propagation delay is measured on this circuit from +1.5 V on the input waveform to the 50% point on the output waveform. ORDERING INFORMATION Package Shipping† MC10H351FNG PLCC−20 (Pb−Free) 46 Units / Rail MC10H351FNR2G PLCC−20 (Pb−Free) 500 / Tape & Reel MC10H351P PDIP−20 18 Unit / Rail MC10H351PG PDIP−20 (Pb−Free) 18 Unit / Rail Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 3 MC10H351 PACKAGE DIMENSIONS 20 LEAD PLCC CASE 775−02 ISSUE F B 0.007 (0.180) Y BRK −N− M T L-M 0.007 (0.180) U M N S T L-M S G1 0.010 (0.250) S N S D −L− −M− Z W 20 D 1 X V S T L-M S N S VIEW D−D A 0.007 (0.180) M T L-M S N S R 0.007 (0.180) M T L-M S N S Z C J F PLANE 0.007 (0.180) VIEW S S N M T L-M S N S K 0.004 (0.100) −T− SEATING VIEW S G1 0.010 (0.250) S T L-M 0.007 (0.180) K1 E G H S NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 4 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.021 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2_ 10 _ 0.310 0.330 0.040 −−− MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.53 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2_ 10 _ 7.88 8.38 1.02 −−− M T L-M S N S MC10H351 PACKAGE DIMENSIONS PDIP−20 P SUFFIX CASE 738−03 ISSUE E −A− 20 11 1 10 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. B L C −T− K SEATING PLANE G M N E F D J 20 PL 20 PL 0.25 (0.010) 0.25 (0.010) M T A M T B M M DIM A B C D E F G J K L M N INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 MECL 10K is a trademark of Motorola, Inc. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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