MC10H351 D

MC10H351
Quad TTL/NMOS to PECL*
Translator
Description
The MC10H351 is a quad translator for interfacing data between a
saturated logic section and the PECL section of digital systems when
only a +5.0 Vdc power supply is available. The MC10H351 has
TTL/NMOS compatible inputs and PECL complementary
open−emitter outputs that allow use as an inverting/non−inverting
translator or as a differential line driver. When the common strobe
input is at a low logic level, it forces all true outputs to the PECL low
logic state (≈ +3.2 V) and all inverting outputs to the PECL high logic
state (≈ +4.1 V).
The MC10H351 can also be used with the MC10H350 to transmit
and receive TTL/NMOS information differentially via balanced
twisted pair lines.
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MARKING DIAGRAMS*
MC10H351P
AWLYYWWG
PDIP−20
P SUFFIX
CASE 738
1 20
Features
•
•
•
•
•
Single +5.0 Power Supply
All VCC Pins Isolated On Chip
Differentially Drive Balanced Lines
tpd = 1.3 nsec Typical
Pb−Free Packages are Available*
20 1
PLCC−20
FN SUFFIX
CASE 775
A
WL
YY
WW
G
10H351G
AWLYYWW
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2012
October, 2012 − Rev. 8
1
Publication Order Number:
MC10H351/D
B OUT
2
19
C OUT
5
4
A OUT
A OUT
N.C.
3
18
C OUT
16
D OUT
17
AOUT
4
AOUT
5
VCC
6
A OUT
4
17
D OUT
D OUT
A OUT
5
16
D OUT
19
C OUT
VCC
6
15
VCC 2
BIN
18
C OUT
B IN
7
14
C IN
AIN
A IN
COMMON
STROBE
GND
8
13
N.C.
9
12
D IN
10
11
TTL VCC
VCC (+5.0 VDC) = PINS 6, 11, 15, 20
GND = PIN 10 (DIP)
Figure 1. Logic Diagram
Figure 2. Dip Pin Assignment
COUT
ECL VCC
3
2
1 20 19
18
COUT
17
DOUT
16
DOUT
7
15
VCC2
8
14
CIN
MC10H351
9 10 11 12 13
NC
20
BOUT
1
DIN
C IN 14
COMMON 9
STROBE
B OUT
B OUT
TTL VCC
12
D IN
B OUT
2
BOUT
8
A IN
1
NC
7
COMMON
STROBE
GND
B IN
ECL VCC
MC10H351
Figure 3. PLCC−20 Pin Assignment
Table 1. MAXIMUM RATINGS
Symbol
Rating
Unit
Power Supply
0 to +7.0
Vdc
VI
Input Voltage (VCC = 5.0 V)
0 to VCC
Vdc
Iout
Output Current
50
100
mA
TA
Operating Temperature Range
0 to +75
°C
Tstg
Storage Temperature Range − Plastic
−55 to +150
°C
VCC
Characteristic
− Continuous
− Surge
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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2
MC10H351
Table 2. ELECTRICAL CHARACTERISTICS (VCC = VCC1 = VCC2 = 5.0 V ± 5.0%)†
0°
Symbol
ECL
TTL
Characteristic
Power Supply
Current
25°
75°
Min
Max
Min
Max
Min
Max
Unit
−
50
−
45
−
50
mA
−
20
−
15
−
20
mA
IR
Reverse Current
Pins 7, 8, 12, 14
Pin 9
−
−
25
100
−
−
20
80
−
−
25
100
IF
Forward Current
Pins 7, 8, 12, 14
Pin 9
−
−
−0.8
−3.2
−
−
−0.6
−2.4
−
−
−0.8
−3.2
5.5
−
5.5
−
5.5
−
Vdc
−
−1.5
−
−1.5
−
−1.5
Vdc
IINH
IINL
V(BR)in
VI
Input Breakdown
Voltage
Input Clamp Voltage
(Iin = −18 mA)
mA
mA
VOH
High Output
Voltage (Note 1.)
3.98
4.16
4.02
4.19
4.08
4.27
Vdc
VOL
Low Output
Voltage (1)
3.05
3.37
3.05
3.37
3.05
3.37
Vdc
VIH
High Input Voltage
2.0
−
2.0
−
2.0
−
Vdc
VIL
Low Input Voltage
−
0.8
−
0.8
−
0.8
Vdc
†Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
Outputs are terminated through a 50 W resistor to VCC −2.0 Vdc.
*Positive Emitter Coupled Logic
1. With VCC at 5.0 V. VOH/VOL change 1:1 with VCC.
Table 3. AC PARAMETERS
0°
Symbol
25°
75°
Characteristic
Min
Max
Min
Max
Min
Max
Unit
Propagation Delay (Note 2)
0.4
2.2
0.4
2.2
0.4
2.1
ns
tr
Rise Time (20% to 80%)
0.4
1.9
0.4
2.0
0.4
2.1
ns
tf
Fall Time (80% to 20%)
0.4
1.9
0.4
2.0
0.4
2.1
ns
Maximum Operating Frequency
150
−
150
−
150
−
MHz
tpd
fmax
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Propagation delay is measured on this circuit from +1.5 V on the input waveform to the 50% point on the output waveform.
ORDERING INFORMATION
Package
Shipping†
MC10H351FNG
PLCC−20
(Pb−Free)
46 Units / Rail
MC10H351FNR2G
PLCC−20
(Pb−Free)
500 / Tape & Reel
MC10H351P
PDIP−20
18 Unit / Rail
MC10H351PG
PDIP−20
(Pb−Free)
18 Unit / Rail
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MC10H351
PACKAGE DIMENSIONS
20 LEAD PLCC
CASE 775−02
ISSUE F
B
0.007 (0.180)
Y BRK
−N−
M
T L-M
0.007 (0.180)
U
M
N
S
T L-M
S
G1
0.010 (0.250)
S
N
S
D
−L−
−M−
Z
W
20
D
1
X
V
S
T L-M
S
N
S
VIEW D−D
A
0.007 (0.180)
M
T L-M
S
N
S
R
0.007 (0.180)
M
T L-M
S
N
S
Z
C
J
F
PLANE
0.007 (0.180)
VIEW S
S
N
M
T L-M
S
N
S
K
0.004 (0.100)
−T− SEATING
VIEW S
G1
0.010 (0.250) S T L-M
0.007 (0.180)
K1
E
G
H
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
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4
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.021
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−− 0.020
2_
10 _
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.53
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2_
10 _
7.88
8.38
1.02
−−−
M
T L-M
S
N
S
MC10H351
PACKAGE DIMENSIONS
PDIP−20
P SUFFIX
CASE 738−03
ISSUE E
−A−
20
11
1
10
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
B
L
C
−T−
K
SEATING
PLANE
G
M
N
E
F
D
J
20 PL
20 PL
0.25 (0.010)
0.25 (0.010)
M
T A
M
T B
M
M
DIM
A
B
C
D
E
F
G
J
K
L
M
N
INCHES
MIN
MAX
1.010
1.070
0.240
0.260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
MECL 10K is a trademark of Motorola, Inc.
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MC10H351/D