ONSEMI MC10H352

SEMICONDUCTOR TECHNICAL DATA
L SUFFIX
CERAMIC PACKAGE
CASE 732–03
The MC10H352 is a quad translator for interfacing data between a
CMOS logic section and the PECL section of digital systems when only a
+5.0 Vdc power supply is available. The MC10H352 has CMOS
compatible inputs and PECL complementary open–emitter outputs that
allow use as an inverting/non–inverting translator or as a differential line
driver. When the common strobe input is at a low logic level, it forces all
true outputs to the PECL low logic state (≈ +3.2 V) and all inverting
outputs to the PECL high logic state (≈ +4.1 V).
The MC10H352 can also be used with the MC10H350 to transmit and
receive CMOS information differentially via balanced twisted pair lines.
•
•
•
•
P SUFFIX
PLASTIC PACKAGE
CASE 738–03
FN SUFFIX
PLCC
CASE 775–02
Single +5.0 V Power Supply
All VCC Pins Isolated On Chip
Differentially Drive Balanced Lines
tpd = 1.3 nsec Typical
LOGIC DIAGRAM
B IN
A IN
MAXIMUM RATINGS
D IN
Characteristic
Symbol
Rating
Unit
VCC
VI
0 to +7.0
Vdc
0 to VCC
Vdc
Power Supply
Input Voltage (VCC = 5.0 V)
Output Current — Continuous
— Surge
Iout
50
100
mA
Operating Temperature Range
TA
Tstg
0 to +75
°C
–55 to +150
–55 to +165
°C
Storage Temperature Range — Plastic
— Ceramic
Characteristic
Power Supply
pp y
C
Current
t
25°
5
A OUT
4
A OUT
16
D OUT
17
D OUT
19
C OUT
18
C OUT
VCC (+5.0 VDC) = PINS 6, 11, 15, 20
GND = PIN 10
DIP
PIN ASSIGNMENT
75°
Max
Min
Max
Min
Max
Unit
—
50
—
45
—
50
mA
B OUT
1
20
ECL VCC
TTL
—
20
—
15
—
20
mA
B OUT
2
19
C OUT
N.C.
3
18
C OUT
A OUT
4
17
D OUT
A OUT
5
16
D OUT
VCC
6
15
VCC 2
B IN
7
14
C IN
A IN
COMMON
STROBE
8
13
N.C.
9
12
D IN
10
11
CMOS VCC
IF
µA
—
—
25
100
—
—
20
80
—
—
25
100
mA
—
—
–0.8
–3.2
—
—
–0.6
–2.4
—
—
–0.8
–3.2
V(BR)in
5.5
—
5.5
—
5.5
—
VI
—
–1.5
—
–1.5
—
–1.5
Vdc
High Output
Voltage (1)
VOH
3.98
4.16
4.02
4.19
4.08
4.27
Vdc
Low Output
Voltage (1)
VOL
3.05
3.37
3.05
3.37
3.05
3.37
Vdc
High Input Voltage
VIH
VIL
3.15
—
3.15
—
3.15
—
Vdc
—
1.5
—
1.5
—
1.5
Vdc
Vdc
GND
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–36 of the Motorola MECL Data
Book (DL122/D).
(1) With VCC at 5.0 V. VOH/VOL change 1:1 with VCC.
*Positive Emitter Coupled Logic
3/93
 Motorola, Inc. 1996
B OUT
Min
Forward Current
Pins 7, 8, 12, 14
Pin 9
Low Input Voltage
B OUT
2
ECL
IR
Input Clamp Voltage
(Iin = –18 mA)
12
1
Symbol
Reverse Current
Pins 7, 8, 12, 14
Pin 9
Input Voltage
Breakdown
8
C IN 14
COMMON 9
STROBE
ELECTRICAL CHARACTERISTICS (VCC = VCC1 = VCC2 = 5.0 V ± 5.0%)
0°
7
2–96
REV 5
MC10H352
AC PARAMETERS
0°
Characteristic
25°
75°
Symbol
Min
Max
Min
Max
Min
Max
Unit
tpd
0.4
1.9
0.4
2.0
0.4
2.1
ns
Rise Time (20% to 80%)
tr
0.4
1.9
0.4
2.0
0.4
2.1
ns
Fall Time (80% to 20%)
tf
0.4
1.9
0.4
2.0
0.4
2.1
ns
fmax
150
—
150
—
150
—
MHz
Propagation Delay (1)
Maximum Operating Frequency
(1) Propagation delay is measured on this circuit from VCC/2 on the input waveform to the 50% point on the output waveform.
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. Outputs are terminated through
a 50–ohm resistor to VCC – 2.0 Vdc.
MECL Data
DL122 — Rev 6
2–97
MOTOROLA
MC10H352
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180) M T L–M
B
Y BRK
–N–
U
N
S
0.007 (0.180) M T L–M
S
S
N
S
D
–L–
–M–
Z
W
20
D
1
V
0.010 (0.250)
G1
X
S
T L–M
N
S
S
VIEW D–D
A
0.007 (0.180) M T L–M
S
N
S
R
0.007 (0.180) M T L–M
S
N
S
Z
C
H
–T–
SEATING
PLANE
F
VIEW S
G1
0.010 (0.250) S T L–M
S
0.007 (0.180)
M
T L–M
S
N
S
VIEW S
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
MOTOROLA
N
K
0.004 (0.100)
J
S
K1
E
G
0.007 (0.180) M T L–M
2–98
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
7.88
8.38
1.02
–––
MECL Data
DL122 — Rev 6
MC10H352
OUTLINE DIMENSIONS
20
11
1
10
L SUFFIX
CERAMIC DIP PACKAGE
CASE 732–03
ISSUE E
NOTES:
1. LEADS WITHIN 0.010 DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
B
A
L
C
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
N
H
G
D
J
K
M
INCHES
MIN
MAX
0.940
0.990
0.260
0.295
0.150
0.200
0.015
0.022
0.055
0.065
0.100 BSC
0.020
0.050
0.008
0.012
0.125
0.160
0.300 BSC
0_
15_
0.010
0.040
SEATING
PLANE
P SUFFIX
PLASTIC DIP PACKAGE
CASE 738–03
ISSUE E
–A–
20
11
1
10
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
B
L
C
–T–
K
SEATING
PLANE
M
N
E
G
F
J
D
0.25 (0.010)
20 PL
0.25 (0.010)
20 PL
M
T A
M
M
T B
M
DIM
A
B
C
D
E
F
G
J
K
L
M
N
INCHES
MIN
MAX
1.010
1.070
0.240
0.260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
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and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
How to reach us:
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454
JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,
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◊
MECL Data
DL122 — Rev 6
2–99
*MC10H352/D*
MC10H352/D
MOTOROLA