NLSV1T34 D

NLSV1T34
1-Bit Dual-Supply
Non-Inverting Level
Translator
The NLSV1T34 is a 1−bit configurable dual−supply voltage level
translator. The input An and output Bn ports are designed to track two
different power supply rails, VCCA and VCCB respectively. Both
supply rails are configurable from 0.9 V to 4.5 V allowing universal
low−voltage translation from the input An to the output Bn port.
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MARKING
DIAGRAMS
•
•
•
•
•
•
•
•
Typical Applications
1
AM
1
QM
1
ULLGA6
MX1 SUFFIX
CASE 613AF
1
Important Information
• ESD Protection for All Pins:
HBM (Human Body Model) > 3000 V
QMG
G
1
PIN ASSIGNMENT
VCCB
VCCA 1
B
A
5
SC−88A
(SOT−353/SC−70)
DF SUFFIX
CASE 419A
Q, A = Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
• Mobile Phones, PDAs, Other Portable Devices
VCCA
M
G
UDFN6
MU SUFFIX
CASE 517AQ
M
•
Wide VCCA and VCCB Operating Range: 0.9 V to 4.5 V
High−Speed w/ Balanced Propagation Delay
Inputs and Outputs have OVT Protection to 4.5 V
Non−preferential VCCA and VCCB Sequencing
Power−Off Protection
Power−Off High Impedance Inputs and Outputs
Ultra−Small Packaging: 1.45 mm x 1.0 mm ULLGA6
2.0 mm x 2.1 mm SC−88A
1.2 mm x 1.0 mm UDFN6
1.45 mm x 1.0 mm UDFN6
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These are Pb−Free Devices
UDFN6
MU SUFFIX
CASE 517AA
Q
Features
A 2
GND 3
Figure 1. Logic Diagram
6 VCCB VCCA 1
5 NC
4 B
ULLGA6/UDFN6
(Top View)
5 VCCB
A 2
GND 3
4 B
SC−88A
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
© Semiconductor Components Industries, LLC, 2015
May, 2012 − Rev. 9
1
Publication Order Number:
NLSV1T34/D
NLSV1T34
PIN ASSIGNMENT
TRUTH TABLE
PIN
FUNCTION
INPUTS
OUTPUTS
VCCA
Input Port DC Power Supply
A
B
VCCB
Output Port DC Power Supply
L
L
GND
Ground
H
H
A
Input Port
B
Output Port
MAXIMUM RATINGS
Symbol
VCCA, VCCB
Rating
Value
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
IOK
IO
Condition
Unit
−0.5 to +5.5
V
A
−0.5 to +5.5
V
(Power Down)
B
−0.5 to +5.5
(Active Mode)
B
−0.5 to +5.5
VCCA = VCCB = 0
V
−20
VI < GND
mA
DC Output Diode Current
−50
VO < GND
mA
DC Output Source/Sink Current
±50
mA
ICCA, ICCB
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature
−65 to +150
°C
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCCA, VCCB
VI
VIO
TA
Dt / DV
Parameter
Positive DC Supply Voltage
Bus Input Voltage
Bus Output Voltage
Min
Max
Unit
0.9
4.5
V
GND
4.5
V
(Power Down Mode)
B
GND
4.5
V
(Active Mode)
B
GND
VCCB
V
−40
+85
°C
0
10
nS
Operating Temperature Range
Input Transition Rise or Rate
VI, from 30% to 70% of VCC; VCC = 3.3 V ±0.3 V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
NLSV1T34
DC ELECTRICAL CHARACTERISTICS
−405C to +855C
Symbol
VIH
Parameter
Test Conditions
Input HIGH Voltage
VCCA (V)
VCCB (V)
Min
Max
Unit
3.6 – 4.5
0.9 – 4.5
2.2
−
V
2.7 – 3.6
2.0
−
2.3 – 2.7
1.6
−
1.4 − 2.3
0.65 * VCCA
−
0.9 – 1.4
VIL
Input LOW Voltage
0.9 * VCCA
−
−
0.8
2.7 – 3.6
−
0.8
2.3 – 2.7
−
0.7
1.4 − 2.3
−
0.35 * VCCA
3.6 – 4.5
0.9 – 4.5
0.9 – 1.4
VOH
Output HIGH Voltage
−
0.1 * VCCA
IOH = −100 mA; VI = VIH
0.9 – 4.5
0.9 – 4.5
VCCB – 0.2
−
IOH = −0.5 mA; VI = VIH
0.9
0.9
0.75 * VCCB
−
IOH = −2 mA; VI = VIH
1.4
1.4
1.05
−
IOH = −6 mA; VI = VIH
1.65
1.65
1.25
−
2.3
2.3
2.0
−
2.3
2.3
1.8
−
2.7
2.7
2.2
−
2.3
2.3
1.7
−
3.0
3.0
2.4
−
IOH = −12 mA; VI = VIH
IOH = −18 mA; VI = VIH
VOL
Output LOW Voltage
IOH = −24 mA; VI = VIH
3.0
3.0
2.2
−
IOL = 100 mA; VI = VIL
0.9 – 4.5
0.9 – 4.5
−
0.2
IOL = 0.5 mA; VI = VIH
1.1
1.1
−
0.3
IOL = 2 mA; VI = VIH
1.4
1.4
−
0.35
IOL = 6 mA; VI = VIL
1.65
1.65
−
0.3
IOL = 12 mA; VI = VIL
2.3
2.3
−
0.4
2.7
2.7
−
0.4
2.3
2.3
−
0.6
3.0
3.0
−
0.4
3.0
3.0
−
0.55
IOL = 18 mA; VI = VIL
IOL = 24 mA; VI = VIL
II
V
V
V
Input Leakage Current
VI = VCCA or GND
0.9 – 4.5
0.9 – 4.5
−1.0
1.0
mA
ICCA
Quiescent Supply Current
VI = VCCA or GND;
IO = 0, VCCA = VCCB
0.9 – 4.5
0.9 − 4.5
−
2.0
mA
ICCB
Quiescent Supply Current
VI = VCCA or GND;
IO = 0, VCCA = VCCB
0.9 – 4.5
0.9 − 4.5
−
2.0
mA
ICCA + ICCB Quiescent Supply Current
VI = VCCA or GND;
IO = 0, VCCA = VCCB
0.9 – 4.5
0.9 – 4.5
−
4.0
mA
0
0
−
5.0
mA
IOFF
Power OFF Leakage Current
VI = 4.5 V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
NLSV1T34
TOTAL STATIC POWER CONSUMPTION (ICCA + ICCB)
−405C to +855C
VCCB (V)
4.5
VCCA (V)
Min
3.3
Max
Min
2.8
Max
Min
1.8
Max
Min
0.9
Max
Min
Max
Unit
4.5
2
2
2
2
< 1.5
μA
3.3
2
2
2
2
< 1.5
μA
2.8
<2
<1
<1
< 0.5
< 0.5
μA
1.8
<1
<1
< 0.5
< 0.5
< 0.5
μA
0.9
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
μA
NOTE:
Connect ground before applying supply voltage VCCA or VCCB. This device is designed with the feature that the power−up
sequence of VCCA and VCCB will not damage the IC.
AC ELECTRICAL CHARACTERISTICS
−405C to +855C
VCCB (V)
4.5
Symbol
tPLH,
tPHL
(Note 1)
Min
3.3
Max
Min
2.8
Max
Min
1.8
Max
Max
Unit
2.1
2.3
nS
2.1
2.3
2.6
2.1
2.3
2.5
2.8
2.1
2.4
2.5
2.7
3.0
2.4
2.7
2.8
3.0
3.3
Parameter
VCCA (V)
Propagation
Delay,
4.5
1.6
1.8
2.0
3.3
1.7
1.9
A to B
2.8
1.9
1.8
1.2
Min
1.2
Max
Min
1. Propagation delays defined per Figure 2.
CAPACITANCE
Symbol
Parameter
Test Conditions
Typ (Note 2)
Unit
CI/O
I/O Pin Input Capacitance
VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B
5.0
pF
CPD
Power Dissipation Capacitance
VCCA = VCCB = 3.3 V, VI = 0 V or VCCA, f = 10 MHz
5.0
pF
2. Typical values are at TA = +25°C.
3. CPD is defined as the value of the IC’s equivalent capacitance from which the operating current can be calculated from:
ICC(operating) ^ CPD x VCC x fIN where ICC = ICCA + ICCB.
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4
NLSV1T34
VCC
Pulse
Generator
DUT
CL
RL
Figure 2. AC (Propagation Delay) Test Circuit
Test
Switch
CL = 15 pF or equivalent (includes probe and jig capacitance)
RL = 2 kW or equivalent
ZOUT of pulse generator = 50 W
Input (An)
VIH
Vm
Vm
tPLH
Output (Bn)
tPHL
Vm
0V
VOH
Vm
VOL
Waveform 1 − Propagation Delays
tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Figure 3. AC (Propagation Delay) Test Circuit Waveforms
VCC
Symbol
0.9 V – 4.5 V
VmA
VCCA/2
VmB
VCCB/2
ORDERING INFORMATION
Package
Shipping†
NLSV1T34MUTBG
UDFN6, 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLSV1T34AMUTCG
UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLSV1T34AMX1TCG
ULLGA6
(Pb−Free)
3000 / Tape & Reel
NLSV1T34DFT2G
SC−88A
(Pb−Free)
3000 / Tape & Reel
Device
NLVSV1T34DFT2G*
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable
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5
NLSV1T34
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
M
B
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
J
C
K
H
SOLDER FOOTPRINT
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
NLSV1T34
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
EDGE OF PACKAGE
PIN ONE
REFERENCE
2X
0.10 C
L1
ÉÉ
ÉÉ
ÉÉ
E
DETAIL A
Bottom View
(Optional)
TOP VIEW
2X
EXPOSED Cu
0.10 C
(A3)
0.10 C
A1
A
10X
0.08 C
MOLD CMPD
ÉÉÉ
ÉÉÉ
5X
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.30
0.40
0.00
0.15
0.40
0.50
MOUNTING FOOTPRINT*
C
A1
A3
DETAIL B
Side View
(Optional)
SEATING
PLANE
SIDE VIEW
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
6X
6X
0.42
0.22
L
3
L2
6X
b
0.10 C A B
0.05 C
6
4
0.40
PITCH
e
NOTE 3
BOTTOM VIEW
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
NLSV1T34
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
L1
PIN ONE
REFERENCE
0.10 C
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
DETAIL B
OPTIONAL
CONSTRUCTIONS
A
0.05 C
A1
SIDE VIEW
MOLD CMPD
DETAIL B
0.05 C
6X
DIM
A
A1
A2
b
D
E
e
L
L1
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
MOUNTING FOOTPRINT
A2
C
SEATING
PLANE
6X
0.30
PACKAGE
OUTLINE
e
6X
L
1.24
3
1
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
DETAIL A
6X
0.53
6
4
BOTTOM VIEW
6X
b
0.10 C A B
0.05 C
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
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8
NLSV1T34
PACKAGE DIMENSIONS
ULLGA6 1.45x1.0, 0.5P
CASE 613AF
ISSUE A
PIN ONE
REFERENCE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
E
DIM
A
A1
b
D
E
e
L
L1
0.10 C
TOP VIEW
0.10 C
0.05 C
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.15
0.25
1.45 BSC
1.00 BSC
0.50 BSC
0.25
0.35
0.30
0.40
A
6X
0.05 C
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
SEATING
PLANE
SIDE VIEW
C
A1
e
5X
L
5X
0.49
NOTE 4
3
1
1.24
L1
0.53
6
4
6X
0.30
6X
BOTTOM VIEW
b
0.10 C A B
0.05 C
1
PKG
OUTLINE
0.50
PITCH
DIMENSIONS: MILLIMETERS
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
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expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
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PUBLICATION ORDERING INFORMATION
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www.onsemi.com
9
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NLSV1T34/D