NLX2GU04 Dual Unbuffered Inverter The NLX2GU04 MiniGatet is an advanced high−speed CMOS dual unbuffered inverter in ultra−small footprint. This device is well suited for use in oscillator, pulse−shaping and high input impedance amplifier applications. For digital applications, the NLX2G04 is recommended. The NLX2GU04 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. http://onsemi.com MARKING DIAGRAMS Features 1 6 OUT Y2 GND 2 5 VCC 1 ULLGA6 1.2 x 1.0 CASE 613AE 1 1 M M ULLGA6 1.45 x 1.0 CASE 613AF L IN A1 ULLGA6 1.0 x 1.0 CASE 613AD L Designed for 1.65 V to 5.5 V VCC Operation Unbuffered for Crystal Oscillator and Analog Applications 16 mA Balanced Output Source and Sink Capability Balanced Propagation Delays Overvoltage Tolerant (OVT) Input and Output Pins Ultra−Small Packages These are Pb−Free Devices L • • • • • • • UDFN6 1.0 x 1.0 CASE 517BX XM UDFN6 1.2 x 1.0 CASE 517AA XM UDFN6 1.45 x 1.0 CASE 517AQ XM M 1 3 IN A2 4 OUT Y1 1 Figure 1. Pinout (Top View) IN A1 1 OUT Y2 IN A2 1 OUT Y2 1 L M = Device Marking = Date Code Figure 2. Logic Symbol ORDERING INFORMATION PIN ASSIGNMENT FUNCTION TABLE 1 IN A1 2 GND 3 IN A2 A Y 4 OUT Y2 L H H L 5 VCC 6 OUT Y1 © Semiconductor Components Industries, LLC, 2012 January, 2012 − Rev. 1 See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. 1 Publication Order Number: NLX2GU04/D NLX2GU04 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage −0.5 to +7.0 V VIN DC Input Voltage −0.5 to +7.0 V DC Output Voltage −0.5 to +7.0 V VIN < GND −50 mA VOUT < GND −50 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL FR ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Latchup Performance Above VCC and Below GND at 125 °C (Note 5) mA ±500 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/UESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 1.65 5.5 V VCC Positive DC Supply Voltage VIN Digital Input Voltage 0 5.5 V Output Voltage 0 5.5 V −55 +125 °C 0 0 100 20 ns/V VOUT TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V http://onsemi.com 2 NLX2GU04 DC ELECTRICAL CHARACTERISTICS TA = +855C TA = 25 5C Symbol Parameter VIH Low−Level Input Voltage VIL VOH VOL IIN Conditions Low−Level Output Voltage Min 1.65 0.85 x VCC 0.80 x VCC 2.3 to 5.5 Low−Level Input Voltage High− Level Output Voltage VCC (V) Typ Max Min Max 0.85 x VCC 0.80 x VCC 1.65 0.15 x VCC 0.20 x VCC 2.3 to 5.5 TA = −555C to +1255C Min 0.85 x VCC 0.80 x VCC 0.15 x VCC 0.20 x VCC 1.65 to 5.5 VCC − 0.1 VCC VCC − 0.1 VCC − 0.1 VIN = VIH or VIL IOH = −3 mA IOH = −4 mA IOH = −6 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA 1.65 2.3 2.7 3.0 3.0 4.5 1.29 1.9 2.2 2.4 2.3 3.8 1.52 2.1 2.3 2.6 2.5 4.0 1.29 1.9 2.2 2.4 2.3 3.8 1.29 1.9 2.2 2.4 2.3 3.8 VIN = VIH or VIL IOL = 50 mA 1.65 to 5.5 VIN = VIH or VIL IOH = 3 mA IOH = 4 mA IOH = 6 mA IOH = 8 mA IOH = 12 mA IOH = 16 mA 1.65 2.3 2.7 3.0 3.0 4.5 0 v VIN v 5.5 V IOFF Power−Off Output Leakage Current VOUT = 5.5 V ICC Quiescent Supply Current 0 v VIN v VCC Unit V 0.15 x VCC 0.20 x VCC VIN = VIH or VIL IOH = −100 mA Input Leakage Current Max V V V 0.1 0.1 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 0 to 5.5 ±0.1 ±1.0 ±1.0 mA 0 1.0 10 10 mA 5.5 1.0 10 10 mA 0.08 0.12 0.2 0.24 0.36 0.31 http://onsemi.com 3 NLX2GU04 AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Symbol tPLH, tPHL Parameter Propagation Delay, Input A to Output Y VCC (V) Test Condition 1.65 to 1.95 Min Typ Max Min Max Unit RL = 1 MW, CL = 15 pF 1.5 1.8 5.5 1.5 11 ns 2.3 to 2.7 RL = 1 MW, CL = 15 pF 1.2 3.3 5.7 1.2 6.3 3.0 to 3.6 RL = 1 MW, CL = 15 pF 0.8 2.7 4.1 0.8 4.5 RL = 500 W, CL = 50 pF 1.2 4.0 6.4 1.2 7.0 RL = 1 MW, CL = 15 pF 0.5 2.2 3.3 0.5 3.6 RL = 500 W, CL = 50 pF 0.8 3.4 5.6 0.8 6.2 4.5 to 5.5 CIN TA = −555C to +1255C TA = 25 5C Input Capacitance 5.5 VIN = 0 V or VCC 7 pF COUT Output Capacitance 5.5 VIN = 0 V or VCC 8 pF CPD Power Dissipation Capacitance (Note 6) 5.5 10 MHz VIN = 0 V or VCC 25 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. A or B VCC 50% GND tPLH Y tPHL 50% VCC Figure 3. Switching Waveforms VCC PULSE GENERATOR DUT RT CL RT = ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit http://onsemi.com 4 RL NLX2GU04 ORDERING INFORMATION Package Shipping† NLX2GU04AMX1TCG ULLGA6, 1.45 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel NLX2GU04BMX1TCG ULLGA6, 1.2 x 1.0, 0.4P (Pb−Free) 3000 / Tape & Reel NLX2GU04CMX1TCG ULLGA6, 1.0 x 1.0, 0.35P (Pb−Free) 3000 / Tape & Reel NLX2GU04MUTCG UDFN6, 1.2 x 1.0, 0.4P (Pb−Free) 3000 / Tape & Reel NLX2GU04AMUTCG UDFN6, 1.45 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel NLX2GU04AMUTCG UDFN6, 1.0 x 1.0, 0.35P (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 NLX2GU04 PACKAGE DIMENSIONS UDFN6 1.2x1.0, 0.4P CASE 517AA ISSUE O EDGE OF PACKAGE PIN ONE REFERENCE 2X 0.10 C ÉÉ ÉÉ ÉÉ L1 E DETAIL A Bottom View (Optional) TOP VIEW 2X EXPOSED Cu 0.10 C (A3) 0.10 C A1 A 10X 0.08 C ÉÉÉ ÉÉÉ 5X A3 DETAIL B Side View (Optional) MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.30 0.40 0.00 0.15 0.40 0.50 MOUNTING FOOTPRINT* 6X C A1 DIM A A1 A3 b D E e L L1 L2 MOLD CMPD SEATING PLANE SIDE VIEW 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D 6X 0.42 0.22 L 3 L2 6X b 0.10 C A B 0.05 C 6 0.40 PITCH 4 e NOTE 3 1.07 DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 NLX2GU04 PACKAGE DIMENSIONS UDFN6 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D PIN ONE REFERENCE 0.10 C L1 ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS DETAIL B A1 SIDE VIEW MOLD CMPD OPTIONAL CONSTRUCTIONS A 0.05 C DIM A A1 A2 b D E e L L1 DETAIL B 0.05 C 6X A2 6X C 6X SEATING PLANE 0.30 PACKAGE OUTLINE L 1.24 3 1 DETAIL A 6X 0.53 4 BOTTOM VIEW MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 MOUNTING FOOTPRINT e 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. ÉÉ ÉÉ EXPOSED Cu TOP VIEW 0.10 C L L 6X 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NLX2GU04 PACKAGE DIMENSIONS UDFN6 1.0x1.0, 0.35P CASE 517BX ISSUE O PIN ONE REFERENCE 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉÉ ÉÉÉ ÉÉÉ E 0.10 C 2X 0.10 C DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.05 C SIDE VIEW A1 C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 5X e 5X 0.48 L 6X 0.22 3 1 L1 1.18 6 4 BOTTOM VIEW 6X b 0.10 M C A B 0.05 M C 0.53 1 PKG OUTLINE NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 NLX2GU04 PACKAGE DIMENSIONS ULLGA6 1.0x1.0, 0.35P CASE 613AD ISSUE A PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 5X 0.48 e 5X L NOTE 4 3 1 1.18 L1 0.53 6 4 6X 1 PKG OUTLINE b 0.05 C 0.35 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 6X 0.22 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 9 NLX2GU04 PACKAGE DIMENSIONS ULLGA6 1.2x1.0, 0.4P CASE 613AE ISSUE A PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.35 0.45 5X 0.49 e 5X L NOTE 4 3 1 1.24 L1 0.53 6 4 6X b 0.05 C NOTE 3 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 6X 0.26 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 NLX2GU04 PACKAGE DIMENSIONS ULLGA6 1.45x1.0, 0.5P CASE 613AF ISSUE A PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉ ÉÉÉ ÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW 5X C A1 e 5X L 0.49 NOTE 4 3 1 1.24 L1 0.53 6 4 BOTTOM VIEW 6X 0.30 6X b 0.10 C A B 0.05 C NOTE 3 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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