NLX2G14 - Dual Schmitt-Trigger Inverter

NLX2G14
Dual Schmitt-Trigger
Inverter
The NLX2G14 MiniGatet is an advanced high−speed CMOS dual
Schmitt−trigger inverter in ultra−small footprint.
The NLX2G14 input and output structures provide protection when
voltages up to 7.0 V are applied, regardless of the supply voltage.
The NLX2G14 can be used to enhance noise immunity or to square
up slowly changing waveforms.
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MARKING
DIAGRAMS
Features
ULLGA6
1.45 x 1.0
CASE 613AF
OUT Y1
M
M
F
1
M
M
P
6
ULLGA6
1.2 x 1.0
CASE 613AE
3
1
1
M
T
IN A1
ULLGA6
1.0 x 1.0
CASE 613AD
T
Designed for 1.65 V to 5.5 V VCC Operation
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
24 Balanced Output Source and Sink Capability
Balanced Propagation Delays
Overvoltage Tolerant (OVT) Input and Output Pins
Ultra−Small Packages
These are Pb−Free Devices
T
•
•
•
•
•
•
•
M
1
GND
5
2
VCC
UDFN6
1.0 x 1.0
CASE 517BX
UDFN6
1.2 x 1.0
CASE 517AA
1
3
IN A2
4
OUT Y2
1
Figure 1. Pinout (Top View)
UDFN6
1.45 x 1.0
CASE 517AQ
IN A1
1
OUT Y1
IN A2
1
OUT Y2
1
T
= Device Marking*
M
= Date Code
* Rotated 90° clockwise
Figure 2. Logic Symbol
PIN ASSIGNMENT
IN A1
ORDERING INFORMATION
2
GND
See detailed ordering and shipping information on page 5 of
this data sheet.
3
IN A2
4
OUT Y2
1
FUNCTION TABLE
A
Y
L
H
H
L
© Semiconductor Components Industries, LLC, 2014
November, 2014 − Rev. 6
5
VCC
6
OUT Y1
1
Publication Order Number:
NLX2G14/D
NLX2G14
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
−0.5 to +7.0
V
VIN
DC Input Voltage
−0.5 to +7.0
V
DC Output Voltage
−0.5 to +7.0
V
VIN < GND
−50
mA
VOUT < GND
−50
mA
VOUT
Parameter
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
MSL
FR
ILATCHUP
Moisture Sensitivity
Level 1
Flammability Rating Oxygen
Index: 28 to 34
UL 94 V−0 @ 0.125 in
Latchup Performance Above VCC and Below GND at 125 °C (Note 5)
±500
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/UESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
1.65
5.5
V
Digital Input Voltage
0
5.5
V
Output Voltage
0
5.5
V
−55
+125
°C
0
0
No Limit
No Limit
ns/V
VCC
Positive DC Supply Voltage
VIN
VOUT
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
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2
NLX2G14
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Conditions
TA = 25 5C
TA = +855C
TA = −555C to
+1255C
VCC
(V)
Min
Typ
Max
Min
Max
Min
Max
Unit
VT+
Positive
Threshold
Voltage
1.65
2.3
2.7
3.0
4.5
5.5
0.6
1.0
1.2
1.3
1.9
2.2
1.0
1.5
1.7
1.9
2.7
3.3
1.4
1.8
2.0
2.2
3.1
3.6
0.6
1.0
1.2
1.3
1.9
2.2
1.4
1.8
2.0
2.2
3.1
3.6
0.6
1.0
1.2
1.3
1.9
2.2
1.4
1.8
2.0
2.2
3.1
3.6
V
VT−
Negative
Threshold
Voltage
1.65
2.3
2.7
3.0
4.5
5.5
0.2
0.4
0.5
0.6
1.0
1.2
0.5
0.75
0.87
1.0
1.5
1.9
0.8
1.15
1.4
1.5
2.0
2.3
0.2
0.4
0.5
0.6
1.0
1.2
0.8
1.15
1.4
1.5
2.0
2.3
0.2
0.4
0.5
0.6
1.0
1.2
0.8
1.15
1.4
1.5
2.0
2.3
V
VH
Hysteresis
Voltage
1.65
2.3
2.7
3.0
4.5
5.5
0.1
0.25
0.3
0.4
0.6
0.7
0.48
0.75
0.83
0.93
1.2
1.4
0.9
1.1
1.15
1.2
1.5
1.7
0.1
0.25
0.3
0.4
0.6
0.7
0.9
1.1
1.15
1.2
1.5
1.7
0.1
0.25
0.3
0.4
0.6
0.7
0.9
1.1
1.15
1.2
1.5
1.7
V
VOH
Minimum
High−Level
Output
Voltage
VIN v VT−MIN
IOH = −100 mA
1.65−
5.5
VCC −
0.1
VCC
VCC −
0.1
VCC −
0.1
VIN v VT−MIN
IOH = −4 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65
2.3
2.7
3.0
3.0
4.5
1.29
1.9
2.2
2.4
2.3
3.8
1.52
2.1
2.4
2.7
2.5
4.0
1.29
1.9
2.2
2.4
2.3
3.8
1.29
1.8
2.1
2.3
2.2
3.7
VIN w VT+MAX
IOL = 100 mA
1.65−
5.5
0
0.1
0.1
0.1
VIN w VT+MAX
IOH = −4 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65
2.3
2.7
3.0
3.0
4.5
0.08
0.2
0.22
0.28
0.38
0.42
0.24
0.3
0.4
0.4
0.55
0.55
0.24
0.3
0.4
0.4
0.55
0.55
0.24
0.4
0.5
0.5
0.55
0.65
0 to
5.5
±0.1
±1.0
±1.0
mA
0
1.0
10
10
mA
5.5
1.0
10
10
mA
VOL
Maximum
Low−Level
Output
Voltage
Input
Leakage
Current
0 v VIN v 5.5 V
IOFF
Power−Off
Output
Leakage
Current
VOUT = 5.5 V
ICC
Quiescent
Supply
Current
0 v VIN v VCC
IIN
V
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
NLX2G14
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Symbol
tPLH,
tPHL
Parameter
Propagation Delay,
Input A to Output Y
VCC
(V)
Test
Condition
2.3−2.7
3.0−3.6
4.5−5.5
TA = 25 5C
TA = +855C
TA = −555C
to +1255C
Min
Typ
Max
Min
Max
Min
Max
Unit
RL = 1 MW,
CL = 15 pF
1.8
4.3
7.4
1.8
8.1
1.8
9.1
ns
RL = 1 MW,
CL = 15 pF
1.5
3.3
5.0
1.5
5.5
1.5
6.5
RL = 500 W,
CL = 50 pF
1.8
4.0
6.0
1.8
6.6
1.8
7.6
RL = 1 MW,
CL = 15 pF
1.0
2.7
4.1
1.0
4.5
1.0
5.5
RL = 500 W,
CL = 50 pF
1.2
3.2
4.9
1.2
5.4
1.2
6.4
CIN
Input Capacitance
5.5
VIN = 0 V or
VCC
2.5
pF
CPD
Power Dissipation
Capacitance (Note 6)
3.3
5.5
10 MHz
VIN = 0 V or
VCC
11
12.5
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
VCC
A or B
50%
GND
tPLH
Y
tPHL
50% VCC
Figure 3. Switching Waveforms
VCC
PULSE
GENERATOR
DUT
RT
CL
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
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4
RL
NLX2G14
VT, TYPICAL INPUT THRESHOLD VOLTAGE (V)
4
3
2
VHtyp
1
2
2.5
3
3.5
3.6
VCC, POWER SUPPLY VOLTAGE (V)
VHtyp = (VT + typ) − (VT − typ)
Figure 5. Typical Input Threshold, VT+, VT−
versus Power Supply Voltage
VH
VCC
VT+
VT−
VIN
VCC
VH
VT+
VT−
VIN
GND
GND
VOH
VOH
VOUT
Vout
VOL
VOL
(a) A Schmitt−Trigger Squares Up Inputs With Slow Rise and Fall Times
(b) A Schmitt−Trigger Offers Maximum Noise Immunity
Figure 6. Typical Schmitt−Trigger Applications
ORDERING INFORMATION
Package
Shipping†
NLX2G14AMX1TCG
ULLGA6, 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLX2G14BMX1TCG
ULLGA6, 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLX2G14CMX1TCG
ULLGA6, 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
NLX2G14MUTCG
In Development
UDFN6, 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLX2G14AMUTCG
UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLX2G14CMUTCG
UDFN6, 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
NLX2G14
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
EDGE OF PACKAGE
PIN ONE
REFERENCE
2X
0.10 C
ÉÉ
ÉÉ
ÉÉ
L1
E
DETAIL A
Bottom View
(Optional)
TOP VIEW
2X
EXPOSED Cu
0.10 C
(A3)
0.10 C
A1
A
10X
0.08 C
MOLD CMPD
ÉÉÉ
ÉÉÉ
5X
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.30
0.40
0.00
0.15
0.40
0.50
MOUNTING FOOTPRINT*
6X
C
A1
A3
DETAIL B
Side View
(Optional)
SEATING
PLANE
SIDE VIEW
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
6X
0.42
0.22
L
3
L2
6X
b
0.10 C A B
0.05 C
6
0.40
PITCH
4
e
NOTE 3
1.07
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
NLX2G14
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
L1
PIN ONE
REFERENCE
0.10 C
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
DETAIL B
MOLD CMPD
DETAIL B
0.05 C
6X
DIM
A
A1
A2
b
D
E
e
L
L1
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
OPTIONAL
CONSTRUCTIONS
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
MOUNTING FOOTPRINT
0.05 C
A1
A2
SIDE VIEW
e
6X
C
6X
SEATING
PLANE
L
1.24
3
1
DETAIL A
6X
0.53
6
0.30
PACKAGE
OUTLINE
4
BOTTOM VIEW
6X
0.50
PITCH
DIMENSIONS: MILLIMETERS
b
0.10 C A B
0.05 C
1
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
7
NLX2G14
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
PIN ONE
REFERENCE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
0.10 C
2X
2X
0.10 C
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
0.05 C
SIDE VIEW
A1
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
5X
e
5X
0.48
L
6X
0.22
3
1
L1
1.18
6
4
BOTTOM VIEW
6X
b
0.10
M
C A B
0.05
M
C
0.53
1
PKG
OUTLINE
NOTE 3
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
8
NLX2G14
PACKAGE DIMENSIONS
ULLGA6 1.0x1.0, 0.35P
CASE 613AD
ISSUE A
PIN ONE
REFERENCE
0.10 C
ÉÉ
ÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.05 C
A
6X
0.05 C
SEATING
PLANE
SIDE VIEW
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
5X
0.48
6X
0.22
e
5X
L
NOTE 4
3
1
1.18
L1
0.53
6
4
6X
b
0.05 C
0.35
PITCH
DIMENSIONS: MILLIMETERS
0.10 C A B
BOTTOM VIEW
1
PKG
OUTLINE
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
9
NLX2G14
PACKAGE DIMENSIONS
ULLGA6 1.2x1.0, 0.4P
CASE 613AE
ISSUE A
PIN ONE
REFERENCE
0.10 C
ÉÉ
ÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.05 C
A
6X
0.05 C
SEATING
PLANE
SIDE VIEW
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.25
0.35
0.35
0.45
5X
0.49
e
5X
L
6X
0.26
NOTE 4
3
1
1.24
L1
0.53
6
4
6X
b
0.05 C
NOTE 3
0.40
PITCH
DIMENSIONS: MILLIMETERS
0.10 C A B
BOTTOM VIEW
1
PKG
OUTLINE
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
10
NLX2G14
PACKAGE DIMENSIONS
ULLGA6 1.45x1.0, 0.5P
CASE 613AF
ISSUE A
PIN ONE
REFERENCE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÉÉÉ
ÉÉÉ
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.10 C
0.05 C
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.15
0.25
1.45 BSC
1.00 BSC
0.50 BSC
0.25
0.35
0.30
0.40
A
6X
0.05 C
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
SEATING
PLANE
SIDE VIEW
5X
C
A1
e
5X
L
0.49
NOTE 4
3
1
6X
0.30
1.24
L1
0.53
6
4
BOTTOM VIEW
6X
b
0.10 C A B
0.05 C
NOTE 3
1
PKG
OUTLINE
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
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