BYW29-200 SWITCHMODEt Power Rectifiers This state−of−the−art device is designed for use in switching power supplies, inverters and as free wheeling diodes. Features • • • • • • • http://onsemi.com 175°C Operating Junction Temperature Popular TO−220 Package Epoxy Meets UL 94 V−0 @ 0.125 in Low Forward Voltage Low Leakage Current High Temperature Glass Passivated Junction Pb−Free Package is Available* ULTRAFAST RECTIFIERS 8.0 AMPERES 200 VOLTS 1 Mechanical Characteristics 4 • Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 • Weight: 1.9 Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • • 3 Leads are Readily Solderable Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Device Meets MSL1 Requirements ESD Ratings: Machine Model, C (> 400 V) Human Body Model, 3B (> 8000 V) MARKING DIAGRAM 4 MAXIMUM RATINGS Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Rating VRRM VRWM VR 200 V Average Rectified Forward Current Total Device, (Rated VR), TC = 150°C IF(AV) 8.0 A Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz), TC = 150°C IFM 16 A Nonrepetitive Peak Surge Current (Surge Applied at Rated Load Conditions Half−wave, Single Phase, 60 Hz) IFSM 100 A TJ, Tstg −65 to +175 °C Operating Junction Temperature and Storage Temperature Range 1 3 A Y WW BYW80−200 G KA AY WWG BYW29-200 KA = Assembly Location = Year = Work Week = Device Code = Pb−Free Package = Diode Polarity ORDERING INFORMATION THERMAL CHARACTERISTICS Maximum Thermal Resistance, Junction−to−Case CASE 221B TO−220B PLASTIC RqJC 3.0 °C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Device BYW29−200 BYW29−200G Package Shipping TO−220 50 Units/Rail TO−220 (Pb−Free) 50 Units/Rail *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2008 June, 2008 − Rev. 2 1 Publication Order Number: BYW29/D BYW29−200 ELECTRICAL CHARACTERISTICS Rating Symbol Maximum Instantaneous Forward Voltage (Note 1) (iF = 5.0 A, TC = 100°C) (iF = 20 A, TC = 25°C) vF Maximum Instantaneous Reverse Current (Note 1) (Rated Dc Voltage, TJ = 100°C) (Rated Dc Voltage, TJ = 25°C) iR Maximum Reverse Recovery Time (IF = 1.0 A, di/dt = 50 A/ms) (IF = 0.5 A, iR = 1.0 A, IREC = 0.25 A) trr Value Unit V 0.85 1.3 mA 600 5.0 ns 35 25 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. 1000 100 IR, REVERSE CURRENT ( mA) 70 50 20 10 100°C 1.0 25°C 0.1 10 0.01 7.0 0 20 40 80 100 120 140 60 VR, REVERSE VOLTAGE (V) 5.0 160 180 200 Figure 2. Typical Reverse Current* * The curves shown are typical for the highest voltage device in the grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if VR is sufficiently below rated VR. 3.0 2.0 TJ = 175°C 100°C IF(AV) , AVERAGE FORWARD CURRENT (AMPS) i F , INSTANTANEOUS FORWARD CURRENT (AMPS) 30 TJ = 175°C 100 25°C 1.0 0.7 0.5 0.3 0.2 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 10 9.0 RATED VR APPLIED 8.0 dc 7.0 6.0 SQUARE WAVE 5.0 4.0 3.0 2.0 1.0 0 140 vF, INSTANTANEOUS VOLTAGE (V) 150 160 170 TC, CASE TEMPERATURE (°C) Figure 1. Typical Forward Voltage Figure 3. Current Derating, Case http://onsemi.com 2 180 RqJA = 16°C/W RqJA = 60°C/W (NO HEAT SINK) 12 dc 10 SQUARE WAVE 8.0 6.0 4.0 dc 2.0 SQUARE WAVE 0 0 r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) PF(AV) , AVERAGE POWER DISSIPATION (WATTS) 14 20 40 60 80 100 120 140 160 180 200 10 9.0 TJ = 175°C 8.0 7.0 SQUARE WAVE 6.0 dc 5.0 4.0 3.0 2.0 1.0 0 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 TA, AMBIENT TEMPERATURE (°C) IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 4. Current Derating, Ambient Figure 5. Power Dissipation 9.0 1.0 D = 0.5 0.5 0.2 0.1 0.1 0.05 0.01 ZqJC(t) = r(t) RqJC RqJC = 1.5 °C/W MAX P(pk) 0.05 t2 SINGLE PULSE TJ(pk) - TC = P(pk) ZqJC(t) DUTY CYCLE, D = t1/t2 0.02 0.01 0.01 D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT T1 t1 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 t, TIME (ms) Figure 6. Thermal Response 1000 C, CAPACITANCE (pF) IF(AV) , AVERAGE FORWARD CURRENT (AMPS) BYW29−200 TJ = 25°C 300 100 30 10 1.0 10 VR, REVERSE VOLTAGE (V) Figure 7. Typical Capacitance http://onsemi.com 3 100 100 200 500 1000 10 BYW29−200 PACKAGE DIMENSIONS TO−220 CASE 221B−04 ISSUE E C B Q F T S DIM A B C D F G H J K L Q R S T U 4 A 1 3 U H K L D G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. R J INCHES MIN MAX 0.595 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.161 0.190 0.210 0.110 0.130 0.014 0.025 0.500 0.562 0.045 0.060 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 MILLIMETERS MIN MAX 15.11 15.75 9.65 10.29 4.06 4.82 0.64 0.89 3.61 4.09 4.83 5.33 2.79 3.30 0.36 0.64 12.70 14.27 1.14 1.52 2.54 3.04 2.04 2.79 1.14 1.39 5.97 6.48 0.000 1.27 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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