MURA205T3G, SURA8205T3G, MURA210T3G, SURA8210T3G Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. http://onsemi.com ULTRAFAST RECTIFIERS 2 AMPERES, 50−100 VOLTS Features • • • • • • Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (0.74 V Max @ 2.0 A, TJ = 150°C) SURA8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These are Pb−Free Devices* SMA CASE 403D MARKING DIAGRAM U5x AYWW G Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 70 mg (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: • • 260°C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Protection: ♦ Human Body Model > 4000 V (Class 3) ♦ Machine Model > 400 V (Class C) U5x = Device Code x = A for MURA205T3G = B for MURA210T3G A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package ORDERING INFORMATION Package Shipping† MURA205T3G SMA (Pb−Free) 5,000 / Tape & Reel SURA8205T3G SMA (Pb−Free) 5,000 / Tape & Reel MURA210T3G SMA (Pb−Free) 5,000 / Tape & Reel SURA8210T3G SMA (Pb−Free) 5,000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2013 December, 2013 − Rev. 5 1 Publication Order Number: MURA205T3/D MURA205T3G, SURA8205T3G, MURA210T3G, SURA8210T3G MAXIMUM RATINGS Rating Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MURA205T3G/SURA8205T3G MURA210T3G/SURA8210T3G VRRM VRWM VR Average Rectified Forward Current @ TL = 155°C @ TL = 135°C IF(AV) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Operating Junction Temperature Range TJ Value Unit V 50 100 1.0 2.0 50 −65 to +175 A A °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Lead (TL = 25°C) (Note 1) Thermal Resistance, Junction−to−Ambient (Note 1) Symbol Max Unit PsiJL (Note 2) RqJA 24 °C/W 216 1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4. 2. In compliance with JEDEC 51, these values (historically represented by RqJL) are now referenced as PsiJL. ELECTRICAL CHARACTERISTICS Characteristic Symbol Maximum Instantaneous Forward Voltage (Note 3) (iF = 2.0 A, TJ = 25°C) (iF = 2.0 A, TJ = 150°C) vF Maximum Instantaneous Reverse Current (Note 3) (Rated DC Voltage, TJ = 25°C) (Rated DC Voltage, TJ = 150°C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) trr Max 0.94 0.74 2.0 50 30 Unit V mA ns Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. http://onsemi.com 2 MURA205T3G, SURA8205T3G, MURA210T3G, SURA8210T3G TYPICAL CHARACTERISTICS 100 IR, REVERSE CURRENT (mA) 1 TJ = 100°C 0.1 0.01 0.001 IF, INSTANTANEOUS FORWARD CURRENT (A) TJ = 175°C 10 TJ = 25°C 0 20 40 60 80 TJ = 25°C 20 0 40 60 80 100 Figure 1. Typical Reverse Current Figure 2. Maximum Reverse Current 100°C 25°C 1 0.1 0.4 1 VR, REVERSE VOLTAGE (VOLTS) TC = 175°C 0.3 TJ = 100°C VR, REVERSE VOLTAGE (VOLTS) 10 0.01 TJ = 175°C 10 0.1 100 0.5 0.6 0.7 0.8 0.9 1 1.1 IF, INSTANTANEOUS FORWARD CURRENT (A) IR, REVERSE CURRENT (mA) 100 10 100°C TC = 175°C 25°C 1 0.1 0.01 0.3 VF, INSTANTANEOUS VOLTAGE (VOLTS) 0.4 0.5 0.6 0.7 0.8 0.9 1 VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 4. Maximum Forward Voltage Figure 3. Typical Forward Voltage http://onsemi.com 3 1.1 MURA205T3G, SURA8205T3G, MURA210T3G, SURA8210T3G TYPICAL CHARACTERISTICS 60 50 NOTE: MAXIMUM CAPACITANCE AT 0 V = 48 pF 50 NOTE: TYPICAL CAPACITANCE AT 0 V = 45 pF 40 35 C, CAPACITANCE (pF) C, CAPACITANCE (pF) 45 30 25 20 15 10 8 12 16 20 28 24 36 32 0 40 4 8 12 16 20 24 28 32 Figure 5. Typical Capacitance Figure 6. Maximum Capacitance IF, AVERAGE FORWARD CURRENT (A) RqJL = 24°C/W TJ = 175°C dc 2.5 SQUARE WAVE 2 1.5 1 0.5 100 110 0 VR, REVERSE VOLTAGE (VOLTS) 3 0 20 VR, REVERSE VOLTAGE (VOLTS) 120 130 140 150 160 170 180 RqJA = 216°C/W TJ = 175°C dc 1 SQUARE WAVE 0.5 0 0 20 40 60 TJ = 175°C 2 dc SQUARE WAVE 1 0.5 0 0.5 100 120 140 160 Figure 8. Current Derating, Ambient (FR−4 Board with Minimum Pad) 2.5 0 80 TA, AMBIENT TEMPERATURE (°C) Figure 7. Current Derating, Lead 1.5 36 1.5 TL, LEAD TEMPERATURE (°C) PF, AVERAGE POWER DISSIPATION (W) IF(AV), AVERAGE FORWARD CURRENT (A) 4 0 4 3.5 30 10 5 0 40 1 1.5 2 2.5 3 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Power Dissipation http://onsemi.com 4 3.5 40 MURA205T3G, SURA8205T3G, MURA210T3G, SURA8210T3G PACKAGE DIMENSIONS SMA CASE 403D−02 ISSUE G HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L. E b DIM A A1 b c D E HE L D POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) MIN 1.97 0.05 1.27 0.15 2.29 4.06 4.83 0.76 MILLIMETERS NOM MAX 2.10 2.20 0.10 0.20 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 MIN 0.078 0.002 0.050 0.006 0.090 0.160 0.190 0.030 INCHES NOM 0.083 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MAX 0.087 0.008 0.064 0.016 0.115 0.180 0.220 0.060 STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE A L A1 c SOLDERING FOOTPRINT* 4.000 0.157 2.000 0.079 2.000 0.079 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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