NP0080TA Series Low Capacitance Protector The NP series of low voltage/low capacitance overvoltage protection devices protect high speed xDSL line drivers and chipsets from both Lightning Surge and ESD events. The devices are designed with a low nominal capacitance as well as extremely low differential capacitance across frequency and voltage. The inherent low off−state leakage current provides superior performance in low voltage high speed applications. These characteristics allow protection of the system without distortion of the high speed data signal. With it’s advanced silicon structure the NP product is able to clamp very fast ESD events, and crowbar high energy surge events to help protect sensitive IC’s all in a small footprint. The convenient flow thru design minimizes trace routing while maximizing circuit performance. The NP series of low voltage/low capacitance devices helps designers to comply with the various regulatory standards and recommendations including: GR−1089−CORE, IEC 61000−4−5, ITU K.20/K.21/K.45, IEC 60950, TIA−968−A, FCC Part 68, EN 60950, UL 1950. http://onsemi.com 5 1 TSOP−5 TA SUFFIX CASE 483 MARKING DIAGRAM 5 xxx MG G Features • • • • • • • • • • Low Nominal Capacitance Extremely Low Differential Capacitance Low Leakage (Transparent) High Surge Capability Precise Clamping Voltage Small Package Size Bi−directional Operation Flow Thru Layout IEC 61000−4−2 Level 4 ESD protection These are Pb−Free Devices 1 xxx M G = Specific Device Code (NPxxx0TAT1G) = Date Code = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTIONS 1 Typical Applications • VDSL, ADSL, Access, Central Office, and Customer Premise modems and gateway IC side line driver chipset protection 5 2 3 • 10/100/1000 Ethernet Protection • RS−232, RS−485 Transceiver Protection 4 (Top View) ELECTRICAL CHARACTERISTICS VRWM VBR IR@ VR=VRWM C@ VR = 2 V D5C 0 V−VRWM Device (V) (V) (mA) (pF) (pF) NP0080TAT1G 8 9.5 0.5 13 4 NP0120TAT1G 12 12.5 0.5 13 3 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. SURGE/ESD RATINGS Waveform 8x20mA ESD Air ESD Contact 50 A 15 kV 6 kV Value © Semiconductor Components Industries, LLC, 2011 February, 2011 − Rev. 3 1 Publication Order Number: NP0080TA/D NP0080TA Series ELECTRICAL CHARACTERISTICS TABLE (TA = 25°C unless otherwise noted) Symbol VRWM VBR1 V(BO) Max Unit Repetitive peak off−state voltage: Rated maximum (peak) continuous voltage that may be applied in the off−state condition Rating NP0080TAT1G Min Typ ±8 V NP0120TAT1G ±12 Breakdown Voltage: The minimum voltage across the device in or at the breakdown region. Measured at IBR = 1 mA NP0080TAT1G 9.5 NP0120TAT1G 12.5 Breakover Voltage: The maximum voltage across the device in or at the breakover region. Measured at I(BO) = 800 mA NP0080TAT1G 20 NP0120TAT1G 30 V IR Off−state Current: The dc value of current that results from the application of the off−state voltage IH Holding Current: The minimum current required to maintain the device in the on−state. Co Off−State Capacitance: f = 1.0 MHz, Vd = 1.0 Vrms, VD = −2 Vdc NP0080TAT1G 13 NP0120TAT1G 13 D Capacitance: f = 1.0 MHz, Vd = 1.0 Vrms, VD = | 0 V – Vrwm| NP0080TAT1G 4 NP0120TAT1G 3 DC1 IPPS Peak Pulse Current: Rated maximum value of peak impulse pulse current that may be applied. 8x20 ms, IEC*61000*4*5 ESD Electrostatic Discharge (CONTACT): Rated maximum value of ESD per IEC−61000−4−2 0.5 50 TJ mA mA pF pF 50 A NP0080TAT1G 8 NP0120TAT1G 6 kV 15 Electrostatic Discharge (AIR): Rated maximum value of ESD per IEC−61000−4−2 TSTG V Storage Temperature Range −55 +150 °C Operating Junction Temperature Range −40 +125 °C http://onsemi.com 2 NP0080TA Series +I Parameter VRWM Repetitive peak off−state voltage VBR Breakdown voltage Breakover voltage IR Off−state current IH Holding current IR −V VBR +V VRWM Protection Region V(BO) IH −I Off−State Region (Transparent) V(BO) Protection Region Symbol Figure 1. Application Information The NPXXXXTAT can be used after the isolation transformer as protection for the xDSL line driver. The devices can be configured to protect against both differential and common mode surges and ESD. + + LINE DRIVER NP0080TAT − NP0080TAT RING RING Figure 2. Figure 3. + NP0080TAT − NP0080TAT NP0080TAT TIP LINE DRIVER − TIP NP0080TAT LINE DRIVER TIP RING Figure 4. 1 5 PCB Trace 4 PCB Trace 2 3 1. Connect pin 1 to pin 5 on PCB 2. Connect pin 3 to pin 4 on PCB 3. Pin 2 is no connection Figure 5. PCB Layout http://onsemi.com 3 NP0080TA Series DEVICE ORDERING INFORMATION Package Shipping† NP0080TAT1G TSOP−5 (Pb−Free) 3000 / Tape & Reel NP0120TAT1G TSOP−5 (Pb−Free) 3000 / Tape & Reel Device †For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 4 NP0080TA Series PACKAGE DIMENSIONS TSOP−5 CASE 483−02 ISSUE H 2X 0.10 T 2X 0.20 T NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X NOTE 5 0.20 C A B M 5 1 4 2 L 3 B S K DETAIL Z G A DIM A B C D G H J K L M S DETAIL Z J C 0.05 SEATING PLANE H T SOLDERING FOOTPRINT* 0.95 0.037 MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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