TPD1E10B09 www.ti.com SLLSEB0A – FEBRUARY 2012 – REVISED MARCH 2012 Single Channel ESD Protection Device in 0402 Package Check for Samples: TPD1E10B09 FEATURES APPLICATIONS • • • • • • • • 1 • • • • • • • • • Provides System Level ESD Protection for Low-voltage IO Interface IEC 61000-4-2 Level 4 – ±20kV (Air-Gap Discharge), – ±20kV (Contact Discharge) IEC 61000-4-5 (Surge): 4.5A (8/20µs) IO Capacitance 10pF (Typ) RDYN 0.5Ω (Typ) DC Breakdown Voltage ±9.5V (Min) Ultra Low Leakage Current 100nA (Typ) 13V Clamping Voltage (Max at IPP = 1A) Industrial Temperature Range: –40°C to 125°C Space Saving 0402 Footprint (1mm x 0.6mm x 0.5mm) Cell Phones eBook Portable Media Players Digital Camera Set-top-box Printers Handheld Electronics DEVICE CONFIGURATION DESCRIPTION The TPD1E10B09 is a single channel ESD protection device in a small 0402 package. The device offers ±20KV IEC air-gap, ±20KV contact ESD protection, and has an ESD clamp circuit with a back-to-back diode for bipolar or bidirectional signal support. The 10pF line capacitance is suitable for a wide range of applications supporting data rates up to 500Mbps. Typical application areas for the TPD1E10B09 are audio lines (microphone, earphone and speakerphone), SD interface, keypad or other buttons, and VBUS pins of USB ports (ID). The 0402 package is industry standard and convenient for component placement in space saving applications. The TPD1E10B09 is characterized for operation over ambient air temperature of -40°C to 125°C. ORDERING INFORMATION TA –40°C to 125°C (1) (2) PACKAGE 10000 (1) (2) Tape and reel ORDERABLE PART NUMBER TOP-SIDE MARKING TPD1E10B09DPYR A_ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated TPD1E10B09 SLLSEB0A – FEBRUARY 2012 – REVISED MARCH 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS MIN MAX UNIT Operating temperature range -40 125 °C Storage temperature –65 155 °C IEC 61000-4-2 contact ESD ±20 kV IEC 61000-4-2 air-gap ESD ±20 kV IPP Peak pulse current (tp = 8/20 μs) 4.5 A PPP Peak pulse power (tp = 8/20 μs) 90 W ELECTRICAL CHARACTERISTICS TA = –40ºC to 85ºC unless otherwise specified PARAMETER TEST CONDITION MIN TYP MAX UNIT VRWM Reverse stand-off voltage Pin 1 to 2 or Pin 2 to 1 ILEAK Leakage current Pin 1 = 5 V, Pin 2 = 0 V VClamp1,2 Clamp voltage with ESD strike on pin 1, pin 2 grounded. IPP = 1 A, tp = 8/20 μSec (1) 13 IPP = 5 A, tp = 8/20 μSec (1) 17 VClamp2,1 Clamp voltage with ESD strike on pin 2, pin 1 grounded. IPP = 1 A, tp = 8/20 μSec (1) 13 IPP = 5 A, tp = 8/20 μSec (1) 20 RDYN Dynamic resistance CIO IO capacitance VIO = 2.5 V VBR1,2 Break-down voltage, pin 1 to pin 2 IIO = 1 mA 9.5 V VBR2,1 Break-down voltage, pin 2 to pin 1 IIO = 1 mA 9.5 V (1) (2) 2 Pin 1 to Pin 2 (2) 0.5 (2) 0.5 Pin 2 to Pin 1 10 9 V 100 nA V V Ω pF Non-repetitive current pulse 8/20 us exponentially decaying waveform according to IEC61000-4-5 Extraction of RDYN using least squares fit of TLP characteristics between IPP = 10A and IPP = 20A. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPD1E10B09 TPD1E10B09 www.ti.com SLLSEB0A – FEBRUARY 2012 – REVISED MARCH 2012 TYPICAL CHARACTERISTICS 90 80 70 Amplitude - V 60 50 TPD1E10B09DPY 40 30 20 10 0 -10 -15 0 15 30 45 60 75 90 105 120 135 150 165 180 195 210 225 Time - ns Figure 1. ESD Clamp Voltage +8KV Contact ESD 10 0 -10 Amplitude - V -20 -30 -40 -50 -60 TPD1E10B09DPY -70 -80 -90 -15 0 15 30 45 60 75 90 105 120 135 150 165 180 195 210 225 Time - ns Figure 2. ESD Clamp Voltage –8KV Contact ESD Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPD1E10B09 3 TPD1E10B09 SLLSEB0A – FEBRUARY 2012 – REVISED MARCH 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) 30 27 24 Current - A 21 18 15 12 9 6 RDYN = 0.509 W 3 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 Voltage - V Figure 3. Transmission Line Pulse (TLP) Waveform Pin1 to Pin2 30 27 24 Current - A 21 18 15 12 9 6 RDYN = 0.504W 3 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 Voltage - V Figure 4. Transmission Line Pulse (TLP) Waveform Pin2 to Pin1 4 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPD1E10B09 TPD1E10B09 www.ti.com SLLSEB0A – FEBRUARY 2012 – REVISED MARCH 2012 TYPICAL CHARACTERISTICS (continued) 1.0E–03 8.0E–04 6.0E–04 Current - A 4.0E–04 2.0E–04 0.0E+00 –2.0E–04 –4.0E–04 –6.0E–04 –8.0E–04 –1.0E–03 -14 -12 -10 -8 -6 0 -2 2 Voltage - V -4 4 6 10 8 12 14 7 140 6 120 6 120 5 100 5 100 4 80 4 80 3 60 A W 3 A W 2 40 2 40 1 20 1 20 0 0 5 10 15 20 25 30 Time - µS 35 40 0 50 45 0 0 5 Figure 6. Positive Surge Waveform 8/20µs 15 20 25 30 Time - µS 35 40 45 0 50 3 14 0 13 -3 12 -6 11 -9 Loss - dB 10 9 8 7 -12 -15 -18 6 -21 5 -24 4 -27 3 -30 2 -33 1.0E+05 1 0 10 Figure 7. Negative Surge Waveform 8/20µs 15 Capacitance - pF 60 Power - W 140 Power - W 7 Current - A Current - A Figure 5. IV Curve 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 1.0E+06 1.0E+07 1.0E+08 Frequency - Hz 1.0E+09 1.0E+10 5 VBIAS - V Figure 8. Pin Capacitance Across VBIAS Figure 9. Insertion Loss Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPD1E10B09 5 TPD1E10B09 SLLSEB0A – FEBRUARY 2012 – REVISED MARCH 2012 www.ti.com APPLICATION INFORMATION The TPD1E10B09 is a single channel back-to-back diode that protects a single bi-directional signal line from Electro static discharge and surge pulses. Since its bi-directional, it protects signals that have positive or negative polarity. During normal operation, the diode behaves as a 10 pF capacitance to ground. Board layout is critical for optimal performance of any diode. Placement: The diode should be placed very close to the external connector for optimal performance. Ideally, the diode should be placed on the line that it is protecting. Connector (Source of ESD) TPD1ExxByy Layout: The diode pin 1 should be right over the signal line that it protects. There should a thick and short trace from pin 2 to ground. An example is shown below. ESD Sensitive device Figure 10. Application Schematic To connector To protected IC Place pin 1 on the signal line Minimum distance from connector (source of ESD) Thick and short return path to GND Figure 11. Layout Example 6 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPD1E10B09 TPD1E10B09 www.ti.com SLLSEB0A – FEBRUARY 2012 – REVISED MARCH 2012 REVISION HISTORY Changes from Original (February 2012) to Revision A Page • Updated FEATURES. ........................................................................................................................................................... 1 • Added graphs to TYPICAL CHARACTERISTICS section. ................................................................................................... 5 • Added APPLICATION INFORMATION section. ................................................................................................................... 6 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPD1E10B09 7 PACKAGE OPTION ADDENDUM www.ti.com 2-Apr-2012 PACKAGING INFORMATION Orderable Device TPD1E10B09DPYR Status (1) ACTIVE Package Type Package Drawing X2SON DPY Pins Package Qty 2 10000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 31-Mar-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPD1E10B09DPYR Package Package Pins Type Drawing X2SON DPY 2 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 10000 180.0 9.5 Pack Materials-Page 1 0.66 B0 (mm) K0 (mm) P1 (mm) 1.15 0.66 4.0 W Pin1 (mm) Quadrant 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 31-Mar-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD1E10B09DPYR X2SON DPY 2 10000 180.0 180.0 30.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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