TPD1E6B06 www.ti.com SLLSEB2C – FEBRUARY 2012 – REVISED FEBRUARY 2013 Single Channel ESD Protection Device in 0201 Package Check for Samples: TPD1E6B06 FEATURES APPLICATIONS • • • • • 1 • • • • • • • • • Provides System Level ESD Protection for Low-voltage IO Interface IEC 61000-4-2 Level 4 – ±15kV (Air Discharge), – ±15kV (Contact Discharge) IO Capacitance 6pF (Typ) RDYN 0.55Ω (Typ) DC Breakdown Voltage ±6V (Min) Ultra Low Leakage Current 10nA (Typ) Low ESD Clamping Voltage Industrial Temperature Range: –40°C to 125°C IEC 61000-4-5 (Surge): 3.8A (8/20 µs Pulse) Space Saving 0201 Footprint (0.6mm x 0.3mm x 0.3mm) Cell Phones eBook Portable Media Players Digital Camera DEVICE CONFIGURATION 0.6 mm × 0.3 mm x 0.3 mm (0.35-mm pitch) DESCRIPTION The TPD1E6B06 is a single channel ESD protection device in a small 0201 package. The device offers ±15kV IEC air-gap, ±15kV contact ESD protection, and has an ESD clamp circuit with a back-to-back diode for bipolar or bidirectional signal support. The 6pF line capacitance is suitable for a wide range of applications supporting data rates up to 800Mbps .Typical application areas for the TPD1E6B06 are audio lines (microphone, earphone, and speakerphone), SD interfacing, keypad or other buttons, VBUS pin and ID pin of USB ports. The 0201 package is industry standard and convenient for component placement in space saving applications. The TPD1E6B06 is characterized for operation over ambient air temperature of -40°C to 125°C. ORDERING INFORMATION TA –40°C to 125°C (1) (2) PACKAGE 15000 (1) (2) Tape and reel ORDERABLE PART NUMBER TOP-SIDE MARKING TPD1E6B06DPLR H Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012–2013, Texas Instruments Incorporated TPD1E6B06 SLLSEB2C – FEBRUARY 2012 – REVISED FEBRUARY 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS MIN MAX UNIT Operating temperature range -40 125 °C Storage temperature –65 155 °C IEC 61000-4-2 contact ESD ±15 kV IEC 61000-4-2 air-gap ESD ±15 kV IPP Peak pulse current (tp = 8/20 μs) 3.8 A PPP Peak pulse power (tp = 8/20 μs) 50 W ELECTRICAL CHARACTERISTICS PARAMETER TEST CONDITION MIN TYP MAX UNIT VRWM Reverse stand-off voltage ILEAK = 100 nA ILEAK Leakage Current Pin 1 = 5 V, Pin 2 = 0 V VClamp1,2 Clamp voltage with ESD strike on pin 1, pin 2 grounded. IPP = 1 A, tp = 8/20 μs 10 IPP = 5 A, tp = 8/20 μs 14 VClamp2,1 Clamp voltage with ESD strike on pin 2, pin 1 grounded. IPP = 1 A, tp = 8/20 μs 10 IPP = 5 A, tp = 8/20 μs 14 RDYN Dynamic resistance CIO IO capacitance VIO = 2.5 V VBR1,2 Break-down voltage, pin 1 to pin 2 IIO = 1 mA 6 V VBR2,1 Break-down voltage, pin 2 to pin 1 IIO = 1 mA 6 V (1) 2 Pin 1 to Pin 2 (1) 0.55 Pin 2 to Pin 1 (1) 0.55 6 ±5 V 100 nA V V Ω pF Extraction of RDYN using least squares fit of TLP characteristics between IPP = 10A and IPP = 20A. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD1E6B06 TPD1E6B06 www.ti.com SLLSEB2C – FEBRUARY 2012 – REVISED FEBRUARY 2013 TYPICAL CHARACTERISTICS 90 80 70 Amplitude - V 60 50 TPD1E6B06DPL 40 30 20 10 0 -10 -15 0 15 30 45 60 75 90 105 120 135 150 165 180 195 210 225 Time - ns Figure 1. ESD Clamp Voltage +8kV Contact ESD 10 0 -10 Amplitude - V -20 -30 -40 -50 -60 TPD1E6B06DPL TPD1E10B06DPY -70 -80 -90 -15 0 15 30 45 60 75 90 105 120 135 150 165 180 195 210 225 Time - ns Figure 2. ESD Clamp Voltage –8kV Contact ESD Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD1E6B06 3 TPD1E6B06 SLLSEB2C – FEBRUARY 2012 – REVISED FEBRUARY 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) 30 27 24 Current - A 21 18 15 12 9 6 TPD1E6B06DPL, Rd = 0.481 Ω 3 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 40 Voltage - V Figure 3. Clamping Voltage VTLP = F(ITLP), PIN1 to PIN2 30 27 24 Current - A 21 18 15 12 9 TPD1E6B06DPL,Rd Rd == 0.465 0.56 ΩW TPD1E10B06DPY, 6 3 0 0 4 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 40 Voltage - V Figure 4. Clamping Voltage VTLP = F(ITLP), PIN2 to PIN1 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD1E6B06 TPD1E6B06 www.ti.com SLLSEB2C – FEBRUARY 2012 – REVISED FEBRUARY 2013 TYPICAL CHARACTERISTICS (continued) 1 0.8 0.6 Current - mA 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 -12 -10 -8 -6 -4 -2 0 2 4 6 Voltage - V Figure 5. IV Curve 8 10 12 14 16 90 6 5 75 4 60 3 45 2 30 1 15 0 0 5 10 15 20 25 Time (µs) 30 35 40 45 Power (W) Current (A) A W 0 50 G001 Figure 6. Surge Graph, Pin 1 to Pin 2 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD1E6B06 5 TPD1E6B06 SLLSEB2C – FEBRUARY 2012 – REVISED FEBRUARY 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) 90 6 5 75 4 60 3 45 2 30 1 15 0 0 5 10 15 20 25 Time (µs) 30 35 40 Power (W) Current (A) A W 0 50 45 G001 Figure 7. Surge Graph, Pin 2 to Pin 1 3 0 −3 −6 Loss (dB) −9 −12 −15 −18 −21 −24 −27 −30 −33 100k 1M 10M Frequency (Hz) 100M 1G 2G G001 Figure 8. Insertion Loss, Pin 1 to Pin 2 6 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD1E6B06 TPD1E6B06 www.ti.com SLLSEB2C – FEBRUARY 2012 – REVISED FEBRUARY 2013 TYPICAL CHARACTERISTICS (continued) 3 0 −3 −6 Loss (dB) −9 −12 −15 −18 −21 −24 −27 −30 −33 100k 1M 10M Frequency (Hz) 100M 1G 2G G002 Figure 9. Insertion Loss, Pin 2 to Pin 1 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD1E6B06 7 TPD1E6B06 SLLSEB2C – FEBRUARY 2012 – REVISED FEBRUARY 2013 www.ti.com REVISION HISTORY Changes from Original (February 2012) to Revision A Page • Changed 0402 Package to 0201 Package in title. ............................................................................................................... 1 • Added RDYN to FEATURES. .................................................................................................................................................. 1 • Changed supporting data rates from 150Mbps to 800Mbps in the DESCRIPTION section.. .............................................. 1 • Added ILEAK parameter to the ELECTRICAL CHARACTERISTICS table. ............................................................................ 2 Changes from Revision A (April 2012) to Revision B Page • Updated RDYN value in FEATURES. ..................................................................................................................................... 1 • Updated IEC 61000-4-5 (Surge) value in FEATURES. ........................................................................................................ 1 • Updated ABSOLUTE MAXIMUM RATINGS. ........................................................................................................................ 2 • Updated TYPICAL CHARACTERISTICS section. ................................................................................................................ 3 Changes from Revision B (August 2012) to Revision C • 8 Page Updated TOP-SIDE MARKING in the ORDERING INFORMATION table. .......................................................................... 1 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD1E6B06 PACKAGE OPTION ADDENDUM www.ti.com 18-Feb-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) TPD1E6B06DPLR ACTIVE X2SON DPL 2 15000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 H TPD1E6B06DPLT ACTIVE X2SON DPL 2 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 H (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. 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