EMI6316 D

EMI6316FCTBG
EMI Filter with ESD
Protection for MicroSD Card
Applications
Product Description
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The EMI6316 is a 4 x 4, 15−bump EMI filter with ESD protection
device for MicroSD card applications in a 0.4 mm pitch CSP form
factor. It is fully compliant with IEC 61000−4−2. The EMI6316 is also
RoHS II compliant.
MARKING
DIAGRAM
WLCSP15
CASE 567FX
A1 Corner
Indicator
PACKAGE / PINOUT DIAGRAMS
1
2
3
4
A
B
C
4
3
2
1
A
63
YW
D
B
63
Y
W
G
63
YW
G
= Specific Device Code
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 3 of this data sheet.
C
D
Top View
(Bumps Down View)
© Semiconductor Components Industries, LLC, 2012
September, 2012 − Rev. 1
Bottom View
(Bumps Up View)
1
Publication Order Number:
EMI6316/D
EMI6316FCTBG
External
(B2)
(B1)
Internal
(B4)
(C1)
(C4)
(A1)
(A4)
(A2)
(A3)
(D2)
(D3)
(D1)
(D4)
External
(B3, C3)
Figure 1. Electrical Schematic
Table 1. PIN DESCRIPTIONS
Pin
Description
Pin
Description
Pin
Description
Pin
Description
A1
dat0 Internal
B1
clk Internal
C1
cmd Internal
D1
data3 Internal
A2
dat1 Internal
B2
VCC External
D2
data2 Internal
A3
SDdat1 External
B3
GND
C3
GND
D3
SDdata2 External
A4
SDdat0 External
B4
SDclk External
C4
SDcmd External
D4
SDdata3 External
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2
EMI6316FCTBG
ELECTRICAL SPECIFICATIONS AND CONDITIONS
Table 2. PARAMETERS AND OPERATING CONDITIONS
Parameter
Rating
Unit
Storage Temperature Range
−55 to +150
°C
Operating Temperature Range
−40 to +85
°C
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
R1 R2 R3
R4 R5 R6
Resistance
34
40
46
W
R9 R10 R11
R12
Resistance
42.5
50
57.5
kW
R13
Resistance
12.75
15
17.25
kW
10
100
nA
11.5
14
pF
ILEAK
C
VB
VESD
Leakage Current per Channel
VIN = 3.0 V
Line Capacitance
At 1 MHz, VIN = 0 V
9
At 1 MHz, VIN = 1.8 V
(Note 2)
8
pF
At 1 MHz, VIN = 2.5 V
7
pF
Breakdown Voltage (Positive)
IR = 1 mA
ESD Protection Peak Discharge Voltage at A3, A4, B2,
B4, C4, D3 and D4 pins
a) Contact Discharge per IEC 61000−4−2 standard
b) Air Discharge per IEC 61000−4−2 standard
(Note 3)
ESD Protection Peak Discharge Voltage at A1, A2, B1,
C1, D1 and D2 pins
a) Contact Discharge per IEC 61000−4−2 standard
b) Air Discharge per IEC 61000−4−2 standard
(Note 3)
6
7
9
V
kV
±8
±15
±2
±2
1. All parameters specified at TA = 25°C unless otherwise noted.
2. MicroSD version 3.0 SDR104 compliant.
3. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W.
Table 4. CSP TAPE AND REEL SPECIFICATIONS†
Part Number
EMI6316FCTBG
Chip Size (mm)
Package
Shipping†
1.56 x 1.56 x 0.50
WLCSP15
(Pb−Free)
5000 / Tape & Reel
† For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
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3
EMI6316FCTBG
RF CHARACTERISTICS
2.5V
0V
Figure 2. S21 Attenuation Simulation
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4
EMI6316FCTBG
PACKAGE DIMENSIONS
WLCSP15, 1.56x1.56
CASE 567FX
ISSUE O
D
2X
A
ÈÈ
ÈÈ
PIN A1
REFERENCE
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
E
DIM
A
A1
A2
b
D
E
e
0.10 C
2X
0.10 C
TOP VIEW
A2
MILLIMETERS
MIN
MAX
0.47
0.53
0.185
0.205
0.305 REF
0.24
0.29
1.56 BSC
1.56 BSC
0.40 BSC
0.10 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.05 C
NOTE 3
A1
C
SIDE VIEW
SEATING
PLANE
0.40
PITCH
A1
15X
0.05 C A B
0.03 C
e/2
b
e
PACKAGE
OUTLINE
e
D
e/2
15X
0.40
PITCH
C
B
0.23
DIMENSIONS: MILLIMETERS
A
1
2
3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
4
BOTTOM VIEW
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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PUBLICATION ORDERING INFORMATION
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
EMI6316/D