EMIF06-mSD02C3 Mini and micro-SD card IPAD™ EMI filtering and ESD protection Features ■ EMI low-pass filter ■ ESD protection ±15 kV (IEC 61000-4-2) ■ Integrated pull up resistors to prevent bus floating when no card is connected ■ 50 MHz clock frequency compatibility with Cline < 20 pF ■ Low power consumption ■ Easy layout thanks to smart pin-out configuration ■ Very low PCB space consuming ■ High reliability offered by monolithic integration ■ Reduction of parasitic elements thanks to CSP integration B Lead-free package C ■ Flip Chip (16 bumps) Figure 1. 4 3 2 1 A Complies with the following standards: ■ Pin configuration (bump side) IEC 61000-4-2 level 4 – 15 kV (air discharge) – 8 kV (contact discharge) D Description ■ MIL STD 883G - Method 3015-7 Class 3A ■ SD Specification Part 1, Physical Layer Specification, Version 2.0 Application The EMIF06-mSD02C3 is a highly integrated device based on IPAD technology offering two functions: ESD protection to comply with IEC standard, and EMI filtering to reject mobile phone frequencies. Mini and micro (T-Flash) secure digital memory card in: ■ Mobile phones ■ Communication systems TM: IPAD is a trademark of STMicroelectronics August 2010 Doc ID 16910 Rev 1 1/11 www.st.com 11 Characteristics 1 EMIF06-mSD02C3 Characteristics Table 1. Absolute ratings (limiting values) Symbol Parameter Value Unit VPP ESD discharge IEC 61000-4-2, air discharge ESD discharge IEC 61000-4-2, contact discharge 15 15 kV Vin Maximum input voltage 5.5 V Tj Maximum junction temperature 125 °C Top Operating temperature range - 40 to + 85 °C Tstg Storage temperature range - 55 to + 150 °C Figure 2. EMIF06-mSD02C3 configuration Clk CMD HOST Data0 Data1 Data2 Data3/CD R13 R11 R12 R10 R9 Vcc SDClk SDCMD SDData0 CARD SDData1 SDData2 SDData3/CD R1 R2 R3 R3 R5 R5 GND bumps must be connected together Table 2. 2/11 Pin configuration Pin Signal Pin Signal A1 DATA0 C1 CMD A2 DATA1 C2 Vss A3 SDDATA1 C3 Vss A4 SDDATA0 C4 SDCMD B1 CLK D1 DATA3/CD B2 Vcc D2 DATA2 B3 Vss D3 SDDATA2 B4 SDCLK D4 SDDATA3/CD Doc ID 16910 Rev 1 EMIF06-mSD02C3 Table 3. Characteristics Electrical characteristic Symbol Test conditions VBR IR = 1 mA IRM VRM = 3 V Min. Typ. 14 16 Max. Unit V 0.1 µA R1, R2, R3, R4, R5, R6 Tolerance ± 20 % 40 Ω R10, R11, R12, R13 Tolerance ± 30 % 56 kΩ R9 Tolerance ± 30 % 4.7 kΩ V = 0 V, F = 1 MHz, VOSC = 30 mV 15 Cline Figure 3. S21 attenuation measurements Figure 4. dB 0.00 0.00 20 pF Analog crosstalk measurements dB -10.00 -10.00 -20.00 -20.00 -30.00 -30.00 -40.00 -40.00 -50.00 -60.00 -50.00 F (Hz) VBIAS=0 V -70.00 VBIAS=0 V F (Hz) -60.00 100.0k Figure 5. 1.0M DATA0 DATA2 CMD 10.0M 100.0M DATA1 DATA3/CD Clk 1.0G -80.00 100.0k 1.0M DATA0-SDDATA1 ESD response to IEC 61000-4-2 (+15 kV air discharge) on CLK and data lines Figure 6. 10.0M 100.0M DATA0-SDDATA3 1.0G ESD response to IEC 61000-4-2 (-15 kV air discharge) on CLK and data lines Input 20 V/div Input 20 V/div 5 V/div Output Output 10 V/div 100 ns/div Doc ID 16910 Rev 1 100 ns/div 3/11 Characteristics Figure 7. EMIF06-mSD02C3 ESD response to IEC 61000-4-2 (+15 kV air discharge) on VCC line Figure 8. ESD response to IEC 61000-4-2 (-15 kV air discharge) on VCC line 10 V/div 10 V/div VCL VCL 100 ns/div 100 ns/div Figure 9. Digital crosstalk test setup LeCroy Wavesurfer 64Xs 600 MHz – 2.5Gs/s Oscilloscope Direct input on 50Ω Agilent pulse pattern generator 81110A Voltage Probe LeCroy HFP1000 100 k Ω / 0.7 pF VOUT=3 V tR=tF=2 ns (open) F=8.3 MHz Input Line “A” Output line “B” Input Line “B”: 50 Ω & Open • Figure 10. 50Ω 50 TAMB=25 °C Digital crosstalk SDData0 100 mV/div Clk 1 V/div 100 ns/div 4/11 Doc ID 16910 Rev 1 EMIF06-mSD02C3 Figure 11. Characteristics Step response test setup LeCroy WavePro 7300A 3 GHz – 20 Gs/s Oscilloscope Agilent pulse pattern generator 81110A VOUT=3 V tR=tF=2 ns (values set in open) F=8.3 MHz Voltage probe LeCroy HFP1000 (100 kΩ - 0.7 pF) CLOAD =15 pF Input Line “A” Output Line “A” Notes: - Voltage amplitude set to 3V - Total capacitance load 15 pF (5 pF for PCB parasitic capacitance and voltage probe capacitance, 10 pF for Sdcard) • Figure 12. TAMB=25 °C Step response without the filter 1 V/div SDDatax/CMD/Clk rise@lv = 885 ps, fall@lv = 886 ps 20% - 70% (SD standard) Figure 13. CLOAD = 15 pF F = 52 MHz V = 3V 5 ns/div Step response with the filter 1 V/div SDDatax/CMD/Clk rise@lv = 1.705 ns, fall@lv = 2.426 ns 20% - 70% (SD standard) CLOAD = 15 pF F = 52 MHz V = 3V Doc ID 16910 Rev 1 5 ns/div 5/11 Characteristics EMIF06-mSD02C3 Figure 14. Junction capacitance versus reverse applied voltage (typical values) 20.0 C(pF) F = 10 Mhz Vosc = 30 m VRMS Tj = 25 °C 18.0 16.0 14.0 12.0 10.0 8.0 C1_CMD A1_Data0 A2_Data1 D2_Data2 D1_Data3 B1_Clk 6.0 4.0 2.0 VR(V) 0.0 0 6/11 1 2 Doc ID 16910 Rev 1 3 4 5 EMIF06-mSD02C3 Technical information Figure 15. T-Flash recommended connection R DAT R CMD CMD D A T0~3 CLK HOST Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 C1 C2 C3 EMIF06-MSD02C3 2 Technical information Pull-up resistances RDAT and RCMD are included to prevent bus floating when no card is inserted or when all card drivers are in high impedance mode. The pull-up resistors and capacitors described in the above recommendation are integrated in the EMIF06-mSD02C3. This makes the EMIF06-mSD02C3 an easy "plug and play" solution to implement secured T-Flash, mini-SD and micro-SD card terminations. Figure 16. Recommendation layout DAT1 VCC DAT0 VSS DAT1 CLK DAT0 CLK CMD DAT3/CD DAT2 VCC Input Output GND CMD DAT3/CD Top level Second le vel DAT2 Top view: GND bumps must be connected together Doc ID 16910 Rev 1 7/11 Ordering information scheme 3 EMIF06-mSD02C3 Ordering information scheme Figure 17. Ordering information scheme EMIF EMI filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package C = Coated Flip Chip x = 3: Lead-free, pitch = 400 µm, bump = 255 µm 8/11 Doc ID 16910 Rev 1 yy - xxx zz Cx EMIF06-mSD02C3 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 170 µm ± 10 Figure 18. Package dimensions 400 µm ± 40 650 µm ± 60 255 µm ± 40 1.54 mm ± 40 µm 400 µm ± 40 4 Package information 170 µm ± 10 1.54 mm ± 40 µm Figure 19. Footprint Copper pad Diameter: 220 µm recommended 260 µm maximum Solder mask opening: 300 µm minimum Solder stencil opening: 220 µm recommended Figure 20. Marking Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode y = year, ww = week Doc ID 16910 Rev 1 x x z y w w 9/11 Ordering information EMIF06-mSD02C3 Dot identifying Pin A1 location Ø 1.55 ± 0.05 4.0 ± 0.1 2.0 ± 0.05 3.5 ±- 0.05 1.68 ± 0.05 xxz yww STE xxz yww STE xxz yww STE 8.0 ± 0.3 0.20 ± 0.02 1.75 ± 0.1 Figure 21. Tape and reel specification 4.0 ± 0.1 1.68 ± 0.05 0.73 ± 0.05 User direction of unreeling All dimensions in mm 5 Ordering information Table 4. Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF06-MSD02C3 JP Flip Chip 3.2 mg 5000 Tape and reel 7” Note: More information is available in the application notes: AN2348: “Flip Chip: Package description and recommendations for use” AN1751: "EMI Filters: Recommendations and measurements" 6 Revision history Table 5. 10/11 Document revision history Date Revision 12-Aug-2010 1 Changes First issue. Doc ID 16910 Rev 1 EMIF06-mSD02C3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 16910 Rev 1 11/11