NUF4401MN D

NUF4401MN
4-Channel EMI Filter with
Integrated ESD Protection
The NUF4401MN is a four−channel (C−R−C) Pi−style EMI filter
array with integrated ESD protection. Its typical component values of
R = 200 and C = 15 pF deliver a cutoff frequency of 125 MHz and
stop band attenuation greater than −35 dB from 900 MHz to 2.4 GHz.
This performance makes the part ideal for parallel interfaces with
data rates up to 83 Mbps in applications where wireless interference
must be minimized. The specified attenuation range is very effective
in minimizing interference from 2G/3G, GPS, Bluetooth® and
WLAN signals.
The NUF4401MN is available in the low−profile 8−lead 2.0 mm x
2.0 mm DFN8 surface mount package.
Features/Benefits
• ±15 kV ESD Protection on each channel (IEC61000−4−2 Level 4,
Contact Discharge)
• R/C Values of 200 and 15 pF deliver Exceptional S21 Performance
•
•
Characteristics of 125 MHz f3dB and −35 dB Stop Band Attenuation
from 900 MHz to 2.4 GHz
Integrated EMI/ESD System Solution in DFN Package Offers
Exceptional Cost, System Reliability and Space Savings
This is a Pb−Free Device
Applications
• EMI Filtering for LCD and Camera Data Lines
• EMI Filtering and Protection for I/O Ports and Keypads
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MARKING
DIAGRAM
DFN8
CASE 506AQ
PLASTIC
1
1
RS MG
G
RS = Specific Device Code
M = Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NUF4401MNT1G
DFN8
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
0
−5
−10
R = 200 Filter + ESDn
Cd = 15 pF Cd = 15 pF
Filter + ESDn
(S21) dB
−15
−20
Channels 1, 4
−25
−30
−35
See Table 1 for pin description
−40
−45
−50
1.0E+06
Channels 2, 3
1.0E+07
1.0E+09
1.0E+08
1.0E+10
FREQUENCY (Hz)
Figure 1. Electrical Schematic
© Semiconductor Components Industries, LLC, 2013
February, 2013 − Rev. 2
Figure 2. Insertion Loss Characteristics
1
Publication Order Number:
NUF4401MN/D
NUF4401MN
1
2
3
4
GND
8
7
6
5
(Bottom View)
Figure 3. Pin Diagram
Table 1. FUNCTIONAL PIN DESCRIPTION
Filter
Device Pins
Description
Filter 1
1&8
Filter + ESD Channel 1
Filter 2
2&7
Filter + ESD Channel 2
Filter 3
3&6
Filter + ESD Channel 3
Filter 4
4&5
Filter + ESD Channel 4
Ground Pad
GND
Ground
MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
VPP
15
kV
Steady−State Power per Resistor
PR
100
mW
Steady−State Power per Package
PT
400
mW
Operating Temperature Range
TOP
−40 to 85
°C
Storage Temperature Range
TSTG
−55 to 150
°C
TL
260
°C
ESD Discharge IEC61000−4−2
Contact Discharge
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Maximum Reverse Working Voltage
Breakdown Voltage
Symbol
Test Conditions
Min
Typ
VRWM
5.0
V
8.0
V
100
nA
IR = 1.0 mA
Leakage Current
IR
VRWM = 3.3 V
Resistance
RA
IR = 20 mA
170
200
230
Diode Capacitance
Cd
VR = 2.5 V, f = 1.0 MHz
12
15
18
pF
Line Capacitance
CL
VR = 2.5 V, f = 1.0 MHz
24
30
36
pF
3 dB Cut−Off Frequency (Note 1)
f3dB
Above this frequency,
appreciable attenuation occurs
125
MHz
6 dB Cut−Off Frequency (Note 1)
f6dB
Above this frequency,
appreciable attenuation occurs
200
MHz
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2
7.0
Unit
VBR
1. 50 source and 50 load termination.
6.0
Max
NUF4401MN
TYPICAL PERFORMANCE CURVES (TA= 25°C unless otherwise specified)
2.0
0
NORMALIZED CAPACITANCE
−5
−10
−20
Channels 1, 4
−25
−30
−35
−40
−45
−50
1.0E+06
Channels 2, 3
1.0E+07
1.0E+09
1.0E+08
1.0E+10
1.5
1.0
0.5
0
0
1.0
2.0
3.0
4.0
5.0
REVERSE BIASED VOLTAGE (V)
FREQUENCY (Hz)
Figure 5. Typical Line Capacitance vs. Reverse
Bias Voltage (Normalized to Capacitance @ 2.5 V)
Figure 4. Insertion Loss Characteristics
208
206
204
RESISTANCE ()
(S21) dB
−15
202
200
198
196
194
192
−40 −30 −20 −10 0
10 20 30 40 50 60 70 80 90
TEMPERATURE (°C)
Figure 6. Typical Resistance vs. Temperature
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3
NUF4401MN
Theory of Operation
approximation of a square wave, shown below in Equations
1 and 2 in the Fourier series approximation.
From this it can be seen that a square wave consists of odd
order harmonics and to fully construct a square wave n must
go to infinity. However, to retain an acceptable portion of the
waveform, the first two terms are generally sufficient. These
two terms contain about 85% of the signal amplitude and
allow a reasonable square wave to be reconstructed.
Therefore, to reasonably pass a square wave of frequency x
the minimum filter bandwidth necessary is 3x. All ON
Semiconductor EMI filters are rated according to this
principle. Attempting to violate this principle will result in
significant rounding of the waveform and cause problems in
transmitting the correct data. For example, take the filter
with the response shown in Figure 7 and apply three
different data waveforms. To calculate these three different
frequencies, the 3 dB, 6 dB, and 9 dB bandwidths will be
used.
The NUF4401MN combines ESD protection and EMI
filtering conveniently into a small package for today’s size
constrained applications. The capacitance inherent to a
typical protection diode is utilized to provide the
capacitance value necessary to create the desired frequency
response based upon the series resistance in the filter. By
combining this functionality into one device, a large number
of discrete components are integrated into one small
package saving valuable board space and reducing BOM
count and cost in the application.
Application Example
The accepted practice for specifying bandwidth in a filter
is to use the 3 dB cutoff frequency. Utilizing points such as
the 6 dB or 9 dB cutoff frequencies results in signal
degradation in an application. This can be illustrated in an
application example. A typical application would include
EMI filtering of data lines in a camera or display interface.
In such an example it is important to first understand the
signal and its spectral content. By understanding these
things, an appropriate filter can be selected for the desired
application. A typical data signal is pattern of 1’s and 0’s
transmitted over a line in a form similar to a square wave.
The maximum frequency of such a signal would be the
pattern 1-0-1-0 such that for a signal with a data rate of
100 Mbps, the maximum frequency component would be
50 MHz. The next item to consider is the spectral content of
the signal, which can be understood with the Fourier series
Equation 1:
a
1 sin((2n * 1) t)
x(t) + 1 ) 2
0
2 n + 1 2n * 1
ƪ
ƫ
(eq. 1)
Equation 2 (simplified form of Equation 1):
ƪ
ƫ
sin( 0t) sin(3 0t) sin(5 0t)
)
)
) AAA (eq. 2)
x(t) + 1 ) 2
1
3
5
2 −3 dB
−6 dB
Magnitude (dB)
−9 dB
f1
f2
100k
1M
f3
100M
10M
1G
10G
Frequency (Hz)
Figure 7. Filter Bandwidth
From the above paragraphs it is shown that the maximum
supported frequency of a waveform that can be passed
through the filter can be found by dividing the bandwidth by
a factor of three (to obtain the corresponding data rate
multiply the result by two). The following table gives the
bandwidth values and the corresponding maximum
supported frequencies and the third harmonic frequencies.
Table 2. Frequency Chart
Bandwidth
Maximum Supported
Frequency
Third Harmonic
Frequency
3 dB–100 MHz
33.33 MHz (f1)
100 MHz
6 dB–200 MHz
66.67 MHz (f2)
200 MHz
9 dB–300 MHz
100 MHz (f3)
300 MHz
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4
NUF4401MN
further and results in even more rounding of the signal edges
as is shown in Figure 8c. The result is the degradation of the
data being transmitted making the digital data (1’s and 0’s)
more difficult to discern. This does not include effects of
other components such as interconnect and other path losses
which could further serve to degrade the signal integrity.
While some filter products may specify the 6 dB or 9 dB
bandwidths, actually using these to calculate supported
frequencies (and corresponding data rates) results in
significant signal degradation. To ensure the best signal
integrity possible, it is best to use the 3 dB bandwidth to
calculate the achievable data rate.
Considering that 85% of the amplitude of the square is in
the first two terms of the Fourier series approximation most
of the signal content is at the fundamental (maximum
supported) frequency and the third harmonic frequency. If a
signal with a frequency of 33.33 MHz is input to this filter,
the first two terms are sufficiently passed such that the signal
is only mildly affected, as is shown in Figure 8a. If a signal
with a frequency of 66.67 MHz is input to this same filter,
the third harmonic term is significantly attenuated. This
serves to round the signal edges and skew the waveform, as
is shown in Figure 8b. In the case that a 100 MHz signal is
input to this filter, the third harmonic term is attenuated even
Input Waveform
Output Waveform
a) Frequency = f1
Input Waveform
Output Waveform
b) Frequency = f2
Input Waveform
c) Frequency = f3
Output Waveform
Figure 8. Input and Output Waveforms of Filter
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5
NUF4401MN
PACKAGE DIMENSIONS
DFN8 2x2, 0.5P
CASE 506AQ
ISSUE B
A B
D
PIN ONE
REFERENCE
0.10 C
2X
2X
ÇÇ
ÇÇ
ÇÇ
0.10 C
L
L1
E
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
EXPOSED Cu
(A3)
0.10 C
ALTERNATE
CONSTRUCTION
0.08 C
DETAIL A
1
8X
D2
C
MOLD CMPD
DETAIL B
A1
SIDE VIEW
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
ÉÉÉ
ÉÉÉ
TOP VIEW
A
NOTE 4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
4
E2
L
1.40
PACKAGE
OUTLINE
K
8
5
e
e/2
BOTTOM VIEW
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.10
1.30
2.00 BSC
0.50
0.70
0.50 BSC
0.20
−−−
0.25
0.45
−−−
0.15
8X
b
0.05 C
2.30
0.75
0.10 C A B
8X
0.57
NOTE 3
1
8X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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PUBLICATION ORDERING INFORMATION
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6
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NUF4401MN/D