NUF4001MU 4-Channel EMI Filter with Integrated ESD Protection The NUF4001MU is a four−channel (C−R−C) Pi−style EMI filter array with integrated ESD protection. Its typical component values of R = 100 and C = 13 pF deliver a cutoff frequency of 150 MHz and stop band attenuation greater than −25 dB from 800 MHz to 5.0 GHz. This performance makes the part ideal for parallel interfaces with data rates up to 100 Mbps in applications where wireless interference must be minimized. The specified attenuation range is very effective in minimizing interference from 2G/3G, GPS, Bluetooth® and WLAN signals. The NUF4001MU is available in the low−profile 8−lead 1.2x1.8mm UDFN8 surface mount package. http://onsemi.com 1 UDFN8 CASE 517AD • ±14 kV ESD Protection on each channel (IEC61000−4−2 Level 4, Contact Discharge) • • Characteristics of 150 MHz f3dB and −25 dB Stop Band Attenuation from 800 MHz to 5.0 GHz Integrated EMI/ESD System Solution in UDFN Package Offers Exceptional Cost, System Reliability and Space Savings This is a Pb−Free Device Applications • EMI Filtering for LCD and Camera Data Lines • EMI Filtering and Protection for I/O Ports and Keypads 41 M G 1 41 = Specific Device Code M = Month Code G = Pb−Free Package Features/Benefits • ±16 kV ESD Protection on each channel (HBM) • R/C Values of 100 and 13 pF deliver Exceptional S21 Performance MARKING DIAGRAM 8 ORDERING INFORMATION Device Package Shipping† NUF4001MUT2G UDFN8 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 0 −5 −10 R=100 Filter + ESDn Cd = 13 pF Cd = 13 pF Filter + ESDn S21 (dB) −15 −20 −25 −30 −35 −40 See Table 1 for pin description −45 −50 1.0E+6 10.0E+6 100E+6 1.0E+9 10.0E+9 FREQUENCY (Hz) Figure 1. Electrical Schematic © Semiconductor Components Industries, LLC, 2009 August, 2009 − Rev. 7 Figure 2. Typical Insertion Loss Curve 1 Publication Order Number: NUF4001MU/D NUF4001MU 1 4 8 5 (Bottom View) Figure 3. Pin Diagram Table 1. FUNCTIONAL PIN DESCRIPTION Filter Device Pins Description Filter 1 1&8 Filter + ESD Channel 1 Filter 2 2&7 Filter + ESD Channel 2 Filter 3 3&6 Filter + ESD Channel 3 Filter 4 4&5 Filter + ESD Channel 4 Ground Pad GND Ground MAXIMUM RATINGS Parameter ESD Discharge IEC61000−4−2 Symbol Value VPP Contact Discharge Machine Model Human Body Model Unit kV 14 1.6 16 Operating Temperature Range TOP −40 to 85 °C Storage Temperature Range TSTG −55 to 150 °C TL 260 °C Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Maximum Reverse Working Voltage Breakdown Voltage Symbol Test Conditions Min Typ VRWM 5.0 V 8.0 V 100 nA IR = 1.0 mA Leakage Current IR VRWM = 3.3 V Resistance RA IR = 10 mA 85 100 115 Diode Capacitance Cd VR = 2.5 V, f = 1.0 MHz 10 13 16 pF Line Capacitance CL VR = 2.5 V, f = 1.0 MHz 20 26 32 3 dB Cut−Off Frequency (Note 1) f3dB Above this frequency, appreciable attenuation occurs 150 MHz 6 dB Cut−Off Frequency (Note 1) f6dB Above this frequency, appreciable attenuation occurs 260 MHz http://onsemi.com 2 7.0 Unit VBR 1. 50 source and 50 load termination. 6.0 Max pF NUF4001MU TYPICAL PERFORMANCE CURVES (TA= 25°C unless otherwise specified) 0 0 −5 −10 −10 −20 −20 S41 (dB) S21 (dB) −15 −25 −30 −30 −40 −35 −40 −50 −45 −50 1.0E+6 10.0E+6 100E+6 1.0E+9 10.0E+9 −60 10.0E+6 100E+6 FREQUENCY (Hz) 10.0E+9 FREQUENCY (Hz) Figure 4. Insertion Loss Characteristic Figure 5. Insertion Loss Characteristic 110 2.0 108 106 1.5 RESISTANCE () NORMALIZED CAPACITANCE 1.0E+9 1.0 0.5 104 102 100 98 96 94 92 0 0 1.0 2.0 3.0 4.0 90 −40 5.0 −20 0 20 40 60 80 REVERSE VOLTAGE (V) TEMPERATURE (°C) Figure 6. Typical Capacitance vs. Reverse Biased Voltage (Normalized Capacitance Cd at 2.5 V) Figure 7. Typical Resistance over Temperature http://onsemi.com 3 NUF4001MU Theory of Operation approximation of a square wave, shown below in Equations 1 and 2 in the Fourier series approximation. From this it can be seen that a square wave consists of odd order harmonics and to fully construct a square wave n must go to infinity. However, to retain an acceptable portion of the waveform, the first two terms are generally sufficient. These two terms contain about 85% of the signal amplitude and allow a reasonable square wave to be reconstructed. Therefore, to reasonably pass a square wave of frequency x the minimum filter bandwidth necessary is 3x. All ON Semiconductor EMI filters are rated according to this principle. Attempting to violate this principle will result in significant rounding of the waveform and cause problems in transmitting the correct data. For example, take the filter with the response shown in Figure 8 and apply three different data waveforms. To calculate these three different frequencies, the 3 dB, 6 dB, and 9 dB bandwidths will be used. The NUF4001MU combines ESD protection and EMI filtering conveniently into a small package for today’s size constrained applications. The capacitance inherent to a typical protection diode is utilized to provide the capacitance value necessary to create the desired frequency response based upon the series resistance in the filter. By combining this functionality into one device, a large number of discrete components are integrated into one small package saving valuable board space and reducing BOM count and cost in the application. Application Example The accepted practice for specifying bandwidth in a filter is to use the 3 dB cutoff frequency. Utilizing points such as the 6 dB or 9 dB cutoff frequencies results in signal degradation in an application. This can be illustrated in an application example. A typical application would include EMI filtering of data lines in a camera or display interface. In such an example it is important to first understand the signal and its spectral content. By understanding these things, an appropriate filter can be selected for the desired application. A typical data signal is pattern of 1’s and 0’s transmitted over a line in a form similar to a square wave. The maximum frequency of such a signal would be the pattern 1-0-1-0 such that for a signal with a data rate of 100 Mbps, the maximum frequency component would be 50 MHz. The next item to consider is the spectral content of the signal, which can be understood with the Fourier series Equation 1: a 1 sin((2n * 1) t) x(t) + 1 ) 2 0 2 n + 1 2n * 1 ƪ ƫ (eq. 1) Equation 2 (simplified form of Equation 1): ƪ ƫ sin( 0t) sin(3 0t) sin(5 0t) ) ) ) AAA (eq. 2) x(t) + 1 ) 2 1 3 5 2 −3 dB −6 dB Magnitude (dB) −9 dB f1 f2 100k 1M f3 100M 10M 1G 10G Frequency (Hz) Figure 8. Filter Bandwidth From the above paragraphs it is shown that the maximum supported frequency of a waveform that can be passed through the filter can be found by dividing the bandwidth by a factor of three (to obtain the corresponding data rate multiply the result by two). The following table gives the bandwidth values and the corresponding maximum supported frequencies and the third harmonic frequencies. Table 2. Frequency Chart Bandwidth Maximum Supported Frequency Third Harmonic Frequency 3 dB–100 MHz 33.33 MHz (f1) 100 MHz 6 dB–200 MHz 66.67 MHz (f2) 200 MHz 9 dB–300 MHz 100 MHz (f3) 300 MHz http://onsemi.com 4 NUF4001MU further and results in even more rounding of the signal edges as is shown in Figure 9c. The result is the degradation of the data being transmitted making the digital data (1’s and 0’s) more difficult to discern. This does not include effects of other components such as interconnect and other path losses which could further serve to degrade the signal integrity. While some filter products may specify the 6 dB or 9 dB bandwidths, actually using these to calculate supported frequencies (and corresponding data rates) results in significant signal degradation. To ensure the best signal integrity possible, it is best to use the 3 dB bandwidth to calculate the achievable data rate. Considering that 85% of the amplitude of the square is in the first two terms of the Fourier series approximation most of the signal content is at the fundamental (maximum supported) frequency and the third harmonic frequency. If a signal with a frequency of 33.33 MHz is input to this filter, the first two terms are sufficiently passed such that the signal is only mildly affected, as is shown in Figure 9a. If a signal with a frequency of 66.67 MHz is input to this same filter, the third harmonic term is significantly attenuated. This serves to round the signal edges and skew the waveform, as is shown in Figure 9b. In the case that a 100 MHz signal is input to this filter, the third harmonic term is attenuated even Input Waveform Output Waveform a) Frequency = f1 Input Waveform Output Waveform b) Frequency = f2 Input Waveform c) Frequency = f3 Output Waveform Figure 9. Input and Output Waveforms of Filter http://onsemi.com 5 NUF4001MU PACKAGE DIMENSIONS UDFN8, 1.8x1.2, 0.4P CASE 517AD−01 ISSUE C A B D 2X ÇÇ ÇÇ ÉÉ 0.10 C ÉÉÉ PIN ONE REFERENCE 2X MOLD CMPD EXPOSED Cu A3 A1 E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DETAIL B ALTERNATE CONSTRUCTIONS 0.10 C DIM A A1 A3 b D E e D2 E2 J K L L1 TOP VIEW A DETAIL B 0.05 C 8X 0.05 MIN (A3) (0.10) 0.05 C NOTE 4 SIDE VIEW L C L L1 D2 1 DETAIL A SEATING PLANE J DETAIL A 8X A1 E2 SOLDERING FOOTPRINT* DETAIL A 1.10 OPTIONAL CONSTRUCTION 7X 8X K 8 e e/2 8X b 0.25 8X 0.45 PACKAGE OUTLINE 0.10 C A B 0.05 C MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.80 BSC 1.20 BSC 0.40 BSC 0.90 1.10 0.20 0.30 0.19 REF 0.20 −−− 0.20 0.30 −−− 0.10 NOTE 3 1.50 BOTTOM VIEW 0.35 1 0.35 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Bluetooth is a registered trademark of Bluetooth SIG. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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