ACS138MS Radiation Hardened 3-to-8 Line Decoder/Demultiplexer December 1997 Features Description • QML Qualified Per MIL-PRF-38535 Requirements The Radiation Hardened ACS138MS is an Inverting 3-to-8 Line Decoder/Demultiplexer with three binary select inputs (A0, A1 and A2). If the device is enabled, these inputs determine which one of the eight normally high outputs will go low. • 1.25Micron Radiation Hardened SOS CMOS • Radiation Environment - Latch-up Free Under any Conditions - Total Dose . . . . . . . . . . . . . . . . . . . . . . 3 x 105 RAD(Si) - SEU Immunity . . . . . . . . . . . <1 x 10-10 Errors/Bit/Day - SEU LET Threshold . . . . . . . . . . . >100MeV/(mg/cm2) Two active low and one active high enable inputs (E1, E2 and E3) are provided to make cascaded decoder designs easier to implement. • Input Logic Levels . . . VIL = (0.3V)(VCC), VIH = (0.7V)(VCC) The ACS138MS is fabricated on a CMOS Silicon on Sapphire (SOS) process, which provides an immunity to Single Event Latch-up and the capability of highly reliable performance in any radiation environment. These devices offer significant power reduction and faster performance when compared to ALSTTL types. • Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±12mA • Quiescent Supply Current. . . . . . . . . . . . . . . . . . . .20µA • Propagation Delay . . . . . . . . . . . . . . . . . . . . . . . . . . 15ns Applications Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering. • Memory Decoding • Data Routing Detailed Electrical Specifications for the ACS138 are contained in SMD 5962-98534. A “hot-link” is provided on our homepage with instructions for downloading. http://www.intersil.com/data/sm/index.htm • Code Conversion Ordering Information SMD PART NUMBER TEMP. RANGE (oC) INTERSIL PART NUMBER 5962F9853401VEC ACS138DMSR-02 N/A ACS138D/Sample-02 PACKAGE CASE OUTLINE -55 to 125 16 Ld SBDIP CDIP2-T16 25 16 Ld SBDIP CDIP2-T16 5962F9853401VXC ACS138KMSR-02 -55 to 125 16 Ld Flatpack CDFP4-F16 N/A ACS138K/Sample-02 25 16 Ld Flatpack CDFP4-F16 N/A ACS138HMSR-02 25 Die N/A Pinouts ACS138 (SBDIP) TOP VIEW ACS138 (FLATPACK) TOP VIEW A0 1 16 VCC A0 1 16 VCC A1 2 15 Y0 A1 2 15 Y0 A2 3 14 Y1 A2 3 14 Y1 E1 4 13 Y2 E1 4 13 Y2 12 Y3 E2 5 12 Y3 11 Y4 E3 6 11 Y4 Y7 7 10 Y5 GND 8 9 Y6 E2 5 E3 6 Y7 7 10 Y5 GND 8 9 Y6 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 1 File Number 4461 ACS138MS Die Characteristics PASSIVATION DIE DIMENSIONS: Type: Phosphorous Silicon Glass (PSG) Thickness: 1.30µm ±0.15µm Size: 2390µm x 2390µm (94 mils x 94 mils) Thickness: 525µm ±25µm (20.6 mils ±1 mil) Bond Pad: 110µm x 110µm (4.3 x 4.3 mils) SPECIAL INSTRUCTIONS: METALLIZATION: Al Metal 1 Thickness: 0.7µm ±0.1µm Metal 2 Thickness: 1.0µm ±0.1µm Bond VCC First ADDITIONAL INFORMATION: Worst Case Density: <2.0 x 105 A/cm2 Transistor Count: 220 SUBSTRATE POTENTIAL: Unbiased Insulator Metallization Mask Layout ACS138MS A1 A0 VCC Y0 A2 Y1 E1 Y2 E2 Y3 E3 Y4 Y7 GND Y6 Y5 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com 2