NL17SV16 Ultra-Low Voltage Buffer The NL17SV16XV5T2 is an ultra−high performance single Buffer fabricated in sub−micron silicon gate 0.35 mm technology with excellent performance down to 0.9 V. This device is ideal for extremely high−speed and high−drive applications. Additionally, limitations of board space are no longer a constraint. The very small SOT−553 makes this device fit most tight designs and spaces. The internal circuit is composed of three stages; including a buffered output which provides high noise immunity and stable output. The NL17SV16XV5T2 input structure provides protection when voltages up to 3.6 V are applied. Features • • • • • • • • Extremely High Speed: 1.5 ns (Typ) at VCC = 3.3 V Designed for 0.9 V to 3.6 V Operation Overvoltage Tolerance (OVT)* Input Permits Logic Translation Balanced ±24 mA Output Drive @ 3.3 Volts Near Zero Static Supply Current Ultra−Tiny SOT−553 5 Pin Package Only 1.6 x 1.6 mm Footprint Ultra−Tiny SOT−553 5−Pin Package, only 1.6 x 1.6 x 0.6 mm These Devices are Pb−Free and are RoHS Compliant http://onsemi.com MARKING DIAGRAM UN M G G SOT−553 CASE 463B UN = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) PIN ASSIGNMENT PIN # FUNCTION Typical Applications 1 NC Cellular Digital Camera PDA Digital Video 2 IN A • • • • 3 GND 4 OUT Y 5 VCC FUNCTION TABLE NC 1 IN A 2 GND 3 5 VCC 4 Input A L H Package Shipping† NL17SV16XV5T2G SOT−553 4000 / Tape & Reel (Pb−Free) Figure 1. Pinout (Top View) 1 L H ORDERING INFORMATION OUT Y Device IN A Output Y †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. OUT Y Figure 2. Logic Symbol *Overvoltage Tolerance (OVT) enables input pins to function outside (higher) of their operating voltages, with no damage to the devices or to signal integrity. © Semiconductor Components Industries, LLC, 2014 May, 2014 − Rev. 5 1 Publication Order Number: NL17SV16XV5T2/D NL17SV16 MAXIMUM RATINGS Symbol VCC Rating Value Units DC Supply Voltage −0.5 to +4.6 V VI DC Input Voltage −0.5 to +4.6 V VO DC Output Voltage −0.5 to VCC + 0.5 V IIK DC Input Diode Current VIN < 0 V −50 DC Output Diode Current VOUT < 0 V VOUT > VCC −50 +50 IO DC Output Sink Current ±50 mA IOK mA mA ICC DC Supply Current per Supply Pin ±50 mA IGND DC Ground Current per Ground Pin ±50 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1.0 mm from Case for 10 seconds 260 °C TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance (Note 1) 250 °C/W PD Power Dissipation in Still Air at 85°C 250 mW MSL FR VESD Moisture Sensitivity Level 1 Flammability Rating Oxygen index: 28 to 34 UL 94 V−0 @ 0125 in ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) V 2000 300 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Units 0.9 3.6 V Digital Input Voltage 0 3.6 V Output Voltage 0 VCC V VCC Positive DC Supply Voltage VIN Vout IOH/IOL tA tr, tf Output Current VCC = 3.0 V to 3.6 V VCC = 2.3 V to 2.7 V VCC = 1.65 V to 1.95 V VCC = 1.4 V to 1.6 V VCC = 1.1 V to 1.3 V VCC = 0.9 V ±24 ±18 ±6 ±4 ±2 ±0.1 Operating Temperature Range. All Package Types −40 Input Rise or Fall Time VCC = 3.3V ± 0.3 V +85 mA °C nS/V 0 10 Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. http://onsemi.com 2 NL17SV16 DC CHARACTERISTICS – Digital Section (Voltages Referenced to GND) TA = 25°C Symbol Parameter VCC Min VIH High Level Input Voltage 0.90 1.10 ≤ VCC ≤ 1.30 1.40 ≤ VCC ≤ 1.60 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 2.70 ≤ VCC ≤ 3.60 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.65 x VCC 1.6 2.0 VIL Low Level Input Voltage 0.90 1.10 ≤ VCC ≤ 1.30 1.40 ≤ VCC ≤ 1.60 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 2.70 ≤ VCC ≤ 3.60 VOH High Level Output Voltage VOL Low Level Output Voltage IIN Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current Condition TA = −40 to 85°C Max Min Max 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.65 x VCC 1.6 2.0 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.8 Units V 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.8 V IOH = −100 mA 0.90 1.10 ≤ VCC ≤ 1.30 1.40 ≤ VCC ≤ 1.60 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 2.70 ≤ VCC ≤ 3.60 VCC − 0.1 VCC − 0.1 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.1 VCC − 0.1 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.2 IOH = −2.0 mA 1.10 ≤ VCC ≤ 1.30 0.75 x VCC 0.75 x VCC IOH = −4.0 mA 1.40 ≤ VCC ≤ 1.60 0.75 x VCC 0.75 x VCC IOH = −6.0 mA 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 1.25 2.0 1.25 2.0 IOH = −12 mA 2.30 ≤ VCC ≤ 2.70 2.70 < VCC ≤ 3.60 1.8 2.2 1.8 2.2 IOH = −18 mA 2.30 ≤ VCC ≤ 2.70 2.70 < VCC ≤ 3.60 1.7 2.4 1.7 2.4 IOH = −24 mA 2.70 ≤ VCC ≤ 3.60 2.2 2.2 IOL = 100 mA 0.90 1.10 ≤ VCC ≤ 1.30 1.40 ≤ VCC ≤ 1.60 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 2.70 ≤ VCC ≤ 3.60 0.1 0.1 0.2 0.2 0.2 0.2 0.1 0.1 0.2 0.2 0.2 0.2 IOL = 2.0 mA 1.10 ≤ VCC ≤ 1.30 0.25 x VCC 0.25 x VCC IOL = 4.0 mA 1.40 ≤ VCC ≤ 1.60 0.25 x VCC 0.25 x VCC IOL = 6.0 mA 1.65 ≤ VCC ≤ 1.95 0.3 0.3 IOL = 12 mA 2.30 ≤ VCC ≤ 2.70 2.70 < VCC ≤ 3.60 0.4 0.4 0.4 0.4 IOL = 18 mA 2.30 ≤ VCC ≤ 2.70 2.70 < VCC ≤ 3.60 0.6 0.4 0.6 0.4 IOL = 24 mA 2.70 ≤ VCC ≤ 3.60 0.55 0.55 0 = VI = 3.6 V 0.90 to 3.60 ±0.1 ±0.9 mA 0 1 5 mA 0.90 to 3.60 0.9 5 mA VI = VCC or GND http://onsemi.com 3 V V NL17SV16 AC CHARACTERISTICS (Input tr = tf = 3.0 nS) −40°C 25°C Min Typ 85°C Symbol Parameter Condition VCC Max Min Max TPHL, TPLH Propagation Delay CL = 15 pF, RL = 1.0 MW 0.90 CL = 15 pF, RL = 2.0 kW 1.10 ≤ VCC ≤ 1.30 1.40 ≤ VCC ≤ 1.60 2.0 1.0 6.0 3.2 13 6.1 1.0 1.0 16.9 7.0 nS CL = 30 pF, RL = 500 W 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 2.70 ≤ VCC ≤ 3.60 1.0 0.8 0.7 2.0 1.2 1.0 5.2 3.7 3.3 1.0 0.7 0.6 6.2 4.4 3.8 nS 20 Units nS CIN Input Capacitance 0 2.0 pF COUT Output Capacitance 0 4.5 pF CPD Power Dissipation Capacitance 0.90 to 3.60 20 pF VI = 0 V or VCC F = 10 MHz DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature °C Time, Hours Time, Years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 http://onsemi.com 4 NL17SV16 PACKAGE DIMENSIONS SOT−553, 5 LEAD CASE 463B ISSUE C D −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 4 1 2 E −Y− 3 b e HE DIM A b c D E e L HE c 5 PL 0.08 (0.003) M X Y MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.65 1.20 1.25 0.50 BSC 0.10 0.20 0.30 1.55 1.60 1.65 MIN 0.50 0.17 0.08 1.55 1.15 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.008 0.004 0.061 0.063 MIN 0.020 0.007 0.003 0.061 0.045 MAX 0.024 0.011 0.007 0.065 0.049 0.012 0.065 RECOMMENDED SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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