NL27WZ16 D

NL27WZ16
Dual Buffer
The NL27WZ16 is a high performance dual buffer operating from a
1.65 to 5.5 V supply. At VCC = 3 V, high impedance TTL compatible
inputs significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance.
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Features
•
•
•
•
•
•
Extremely High Speed: tPD 2.0 ns (typical) at VCC = 5 V
Designed for 1.65 V to 5.5 V VCC Operation
Over Voltage Tolerant Inputs
LVTTL Compatible − Interface Capability With 5 V TTL Logic
with VCC = 3 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Chip Complexity: FET = 72; Equivalent Gate = 18
These Devices are Pb−Free and are RoHS Compliant
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
MARKING
DIAGRAMS
SC−88/SC−70−6/SOT−363
DF SUFFIX
CASE 419B
1
1
M
•
•
•
•
MR M G
G
1
TSOP−6
DT SUFFIX
CASE 318G
MR M G
G
1
MR = Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
IN A1
1
6
OUT Y1
GND
2
5
VCC
IN A2
3
4
*Date Code orientation and/or position may vary
depending upon manufacturing location.
PIN ASSIGNMENT
OUT Y2
Figure 1. Pinout (Top View)
IN A1
1
OUT Y1
IN A2
1
OUT Y2
Pin
Function
1
IN A1
2
GND
3
IN A2
4
OUT Y2
5
VCC
6
OUT Y1
FUNCTION TABLE
A Input
Figure 2. Logic Symbol
Y Output
L
L
H
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2012
May, 2012 − Rev. 9
1
Publication Order Number:
NL27WZ16/D
NL27WZ16
MAXIMUM RATINGS
Symbol
VCC
Characteristics
DC Supply Voltage
Value
Units
−0.5 to +7.0
V
VI
DC Input Voltage
−0.5 ≤ VI ≤ +7.0
V
VO
DC Output Voltage
Output in Z or LOW State (Note 1)
−0.5 ≤ VO ≤ +7.0
V
IIK
DC Input Diode Current
VI < GND
−50
mA
IOK
DC Output Diode Current
VO < GND
−50
mA
IO
DC Output Sink Current
±50
mA
ICC
DC Supply Current per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
PD
Power Dissipation in Still Air
SC−88, TSOP−6
200
qJA
Thermal Resistance
SC−88, TSOP−6
333
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
+150
°C
VESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
ILatchup
Latchup Performance
Above VCC and Below GND at 85°C (Note 5)
mW
°C/W
V
mA
±500
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. IO absolute maximum rating must be observed.
2. Tested to EIA/JESD22−A114−A
3. Tested to EIA/JESD22−A115−A
4. Tested to JESD22−C101−A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
Operating
Data Retention Only
Min
Max
1.65
1.5
5.5
5.5
0
5.5
Units
V
VI
Input Voltage
VO
Output Voltage (High or LOW State)
0
5.5
V
TA
Operating Free−Air Temperature
−55
+125
°C
Dt/DV
Input Transition Rise or Fall Rate
VCC = 1.8 V ±0.15 V
VCC = 2.5 V ±0.2 V
VCC = 3.0 V ±0.3 V
VCC = 5.0 V ±0.5 V
0
0
0
0
20
20
10
5
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2
V
ns/V
NL27WZ16
DC ELECTRICAL CHARACTERISTICS
Symbol
VIH
VIL
VOH
VOL
Min
High−Level Input
Voltage
1.65 to 1.95
2.3 to 5.5
0.75 VCC
0.7 VCC
Low−Level Input
Voltage
1.65 to 1.95
2.3 to 5.5
Parameter
Condition
High−Level Output
Voltage
VIN = VIH
Low−Level Output
Voltage
VIN = VIL
Input Leakage Current
Typ
−555C 3 TA 3 1255C
Max
Min
Max
0.75 VCC
0.7 VCC
0.25 VCC
0.3 VCC
0.25 VCC
0.3 VCC
1.55
1.7
2.2
2.9
4.4
1.65
1.8
2.3
3.0
4.5
1.55
1.7
2.2
2.9
4.4
IOH = −4 mA
IOH = −8 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65
2.3
3.0
3.0
4.5
1.29
1.9
2.4
2.3
3.8
1.52
2.15
2.80
2.68
4.20
1.29
1.9
2.4
2.3
3.8
IOL = 100 mA
1.65
1.8
2.3
3.0
4.5
0.0
0.0
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
1.65
2.3
3.0
3.0
4.5
0.08
0.10
0.15
0.22
0.22
0.24
0.30
0.40
0.55
0.55
0.24
0.30
0.40
0.55
0.55
±0.1
±1.0
VIN = 5.5 V or GND
0 to 5.5
Units
V
1.65
1.8
2.3
3.0
4.5
IOH = −100 mA
IOL = 4 mA
IOL = 8 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
IIN
TA = 255C
VCC
(V)
V
V
V
V
V
mA
IOFF
ICC
Power Off Leakage
Current
VIN = 5.5 V or
VOUT = 5.5 V
Quiescent Supply
Current
VIN = 5.5 V or GND
0
1
10
mA
5.5
1
10
mA
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AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W
TA = 25°C
Symbol
tPLH
tPHL
Condition
VCC (V)
Min
Typ
Max
Min
Max
Units
RL = 1 MW, CL = 15 pF
1.8 ± 0.15
1.8
8.0
9.6
1.8
10.2
ns
RL = 1 MW, CL = 15 pF
2.5 ± 0.2
1.0
3.0
5.2
1.0
5.8
0.8
2.3
3.6
0.8
4.0
1.2
3.0
4.6
1.2
5.1
0.5
1.8
2.9
0.5
3.2
0.8
2.4
3.8
0.8
4.2
Parameter
Propagation Delay
(Figure 3 and 4)
−55°C 3 TA 3 125°C
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
3.3 ± 0.3
5.0 ± 0.5
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
CIN
Input Capacitance
CPD
Power Dissipation Capacitance (Note 6)
Condition
Typical
Units
VCC = 5.5 V, VI = 0 V or VCC
7.0
pF
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
9
11
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ) ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin ) ICC VCC.
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3
NL27WZ16
A
VCC
50%
GND
tPLH
Y
tPHL
50% VCC
PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Figure 3. Switching Waveforms
VCC
PULSE
GENERATOR
DUT
RT
CL
RL
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
ORDERING INFORMATION
Package
Shipping†
NL27WZ16DFT2G
SC−88/SC−70/SOT−363
(Pb−Free)
3000 /Tape & Reel
NLV27WZ16DFT2G*
SC−88/SC−70/SOT−363
(Pb−Free)
3000 /Tape & Reel
TSOP−6
(Pb−Free)
3000 /Tape & Reel
Device
NL27WZ16DTT1G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
NL27WZ16
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
D
e
6
5
4
1
2
3
HE
DIM
A
A1
A3
b
C
D
E
e
L
HE
−E−
b 6 PL
0.2 (0.008)
M
E
M
MILLIMETERS
MIN
NOM MAX
0.80
0.95
1.10
0.00
0.05
0.10
0.20 REF
0.10
0.21
0.30
0.10
0.14
0.25
1.80
2.00
2.20
1.15
1.25
1.35
0.65 BSC
0.10
0.20
0.30
2.00
2.10
2.20
A3
C
A
A1
L
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
INCHES
NOM MAX
0.037 0.043
0.002 0.004
0.008 REF
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
MIN
0.031
0.000
NL27WZ16
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE U
D
H
ÉÉÉ
ÉÉÉ
6
E1
1
NOTE 5
5
2
L2
4
GAUGE
PLANE
E
3
L
b
C
DETAIL Z
e
0.05
M
A
SEATING
PLANE
c
A1
DETAIL Z
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
DIM
A
A1
b
c
D
E
E1
e
L
L2
M
MIN
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
0°
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.38
0.50
0.18
0.26
3.00
3.10
2.75
3.00
1.50
1.70
0.95
1.05
0.40
0.60
0.25 BSC
10°
−
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
6X
3.20
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NL27WZ16/D