NL27WZ16 Dual Buffer The NL27WZ16 is a high performance dual buffer operating from a 2.3 to 5.5 V supply. At VCC = 3 V, high impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. • • • • • • • • Extremely High Speed: tPD 2.0 ns (typical) at VCC = 5 V Designed for 2.3 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs LVTTL Compatible – Interface Capability With 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Chip Complexity: FET = 72; Equivalent Gate = 18 IN A1 1 6 OUT Y1 GND 2 5 VCC http://onsemi.com MARKING DIAGRAMS SC–88 / SOT–363/SC–70 DF SUFFIX CASE 419B MRd Pin 1 d = Date Code TSOP–6/SOT–23/SC–59 DT SUFFIX CASE 318G MRd Pin 1 d = Date Code 3 IN A2 4 OUT Y2 Figure 1. Pinout (Top View) ORDERING INFORMATION IN A1 1 OUT Y1 IN A2 1 OUT Y2 See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Figure 2. Logic Symbol PIN ASSIGNMENT 1 IN A1 2 GND 3 IN A2 4 OUT Y2 5 VCC 6 OUT Y1 Semiconductor Components Industries, LLC, 2001 April, 2001 – Rev. 1 FUNCTION TABLE A Input L H Y Output L H 1 Publication Order Number: NL27WZ16/D NL27WZ16 MAXIMUM RATINGS (Note 1.) Symbol Characteristics Value Unit 0.5 to 7.0 V 0.5 ≤ VI ≤ 7.0 V 0.5 ≤ VO ≤ 7.0 V VI < GND 50 mA VO < GND 50 mA DC Output Sink Current 50 mA DC Supply Current per Supply Pin 100 mA IGND DC Ground Current per Ground Pin 100 mA TSTG Storage Temperature Range 65 to 150 °C PD Power Dissipation in Still Air SC–88, TSOP–6 200 mW JA Thermal Resistance SC–88, TSOP–6 333 °C/W TL Lead Temperature, 1 mm from case for 10 s TJ Junction Temperature under Bias VESD ESD Withstand Voltage ILatch–Up Latch–Up Performance VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current IO ICC Output in Z or LOW State (Note 2.) 260 °C 150 °C Human Body Model (Note 3.) Machine Model (Note 4.) Charged Device Model (Note 5.) > 2000 > 200 N/A V Above VCC and Below GND at 85°C (Note 6.) 500 mA 1. Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. 2. IO absolute maximum rating must be observed. 3. Tested to EIA/JESD22–A114–A 4. Tested to EIA/JESD22–A115–A 5. Tested to JESD22–C101–A 6. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free–Air Temperature ∆t/∆V Input Transition Rise or Fall Rate Operating Data Retention Only (High or LOW State) VCC = 2.5 V 0.2 V VCC =3.0 V 0.3 V VCC =5.0 V 0.5 V http://onsemi.com 2 Min Max Unit 2.3 1.5 5.5 5.5 V 0 5.5 V 0 5.5 V 40 85 °C 0 0 0 20 10 5 ns/V NL27WZ16 DC ELECTRICAL CHARACTERISTICS VCC Symbol Parameter Condition (V) Min 0.7 VCC VIH High–Level Input Voltage 2.3 to 5.5 VIL Low–Level Input Voltage 2.3 to 5.5 VOH High–Level g Output V lt Voltage VIN = VIH or VIL VOL Low–Level Output V lt Voltage VIN = VIH or VIL 40°C ≤ TA ≤ 85°C TA = 25°C Typ Max Min Max 0.7 VCC 0.3 VCC Unit V 0.3 VCC V IOH = 100 µA 2.3 to 5.5 VCC – 0.1 VCC VCC – 0.1 IOH = –8 mA 2.3 1.9 2.1 1.9 IOH = –12 mA 2.7 2.2 2.4 2.2 IOH = –16 mA 3.0 2.4 2.7 2.4 IOH = –24 mA 3.0 2.3 2.5 2.3 IOH = –32 mA 4.5 3.8 4.0 3.8 IOL = 100 µA 2.3 to 5.5 0.1 0.1 IOL = 8 mA 2.3 0.20 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 VIN = VCC or GND 0 to 5.5 0.1 1.0 µA V V IIN Input Leakage Current IOFF Power Off–Output Leakage Current VOUT = 5.5 V 0 1 10 µA ICC Quiescent Supply Current VIN = VCC or GND 5.5 1 10 µA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω 40°C ≤ TA ≤ 85°C TA = 25°C Symbol tPLH tPHL Parameter Propagation g Delay y (Fi (Figure 3 and d 4) Condition VCC (V) Min Typ Max Min Max Unit RL = 1 M CL = 15 pF 2.5 0.2 1.0 3.0 5.2 1.0 5.8 ns RL = 1 M CL = 15 pF 3.3 0.3 0.8 2.3 3.6 0.8 4.0 1.2 3.0 4.6 1.2 5.1 0.5 1..8 2.9 0.5 3.2 0.8 2.4 3.8 0.8 4.2 RL = 500 CL = 50 pF 5.0 0.5 RL = 1 M CL = 15 pF RL = 500 CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol Parameter CIN Input Capacitance CPD Power Dissipation Capacitance (Note 7.) Condition Typical Unit VCC = 5.5 V, VI = 0 V or VCC 7.0 pF 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 9 11 pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ICC. CPD is used to determine the no–load dynamic power consumption; PD = CPD VCC2 fin ICC VCC. http://onsemi.com 3 NL27WZ16 VCC VCC A 50% GND tPLH Y PULSE GENERATOR tPHL DUT RT 50% VCC PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns CL RL RT = ZOUT of pulse generator (typically 50 Ω) Figure 3. Switching Waveforms Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Logic Circuit Indicator No. of Gates per Package Temp Range Identifier NL27WZ16DFT2 NL 2 NL27WZ16DTT1 NL 2 Device Order Number Technology Device Function Package Suffix Tape & Reel Suffix Package Type (Name/SOT#/ Common Name) Tape and Reel Size 7 WZ 16 DF T2 SC–88 / SOT–363 / SC–70 178 mm (7”) 3000 Unit 7 WZ 16 DT T1 TSOP–6 / SOT–23 / SC–59 178 mm (7”) 3000 Unit http://onsemi.com 4 NL27WZ16 P0 K t 10 PITCHES CUMULATIVE TOLERANCE ON TAPE 0.2 mm (0.008”) P2 D TOP COVER TAPE E A0 SEE NOTE 9. + K0 B1 + B0 SEE NOTE 9. F W + D1 FOR COMPONENTS 2.0 mm × 1.2 mm AND LARGER P EMBOSSMENT FOR MACHINE REFERENCE ONLY INCLUDING DRAFT AND RADII CONCENTRIC AROUND B0 CENTER LINES OF CAVITY USER DIRECTION OF FEED *TOP COVER TAPE THICKNESS (t1) 0.10 mm (0.004”) MAX. R MIN. BENDING RADIUS TAPE AND COMPONENTS SHALL PASS AROUND RADIUS “R” WITHOUT DAMAGE EMBOSSED CARRIER 100 mm (3.937”) MAXIMUM COMPONENT ROTATION 10° EMBOSSMENT 1 mm MAX TYPICAL COMPONENT CAVITY CENTER LINE TAPE 1 mm (0.039”) MAX TYPICAL COMPONENT CENTER LINE 250 mm (9.843”) CAMBER (TOP VIEW) ALLOWABLE CAMBER TO BE 1 mm/100 mm NONACCUMULATIVE OVER 250 mm Figure 5. Carrier Tape Specifications EMBOSSED CARRIER DIMENSIONS (See Notes 8. and 9.) Tape Size B1 Max 8 mm 4.35 mm (0.171”) D D1 E 1.5 1.0 mm Min (0.039”) 0.1 0.1/ –0.0 mm (0.059 0.004/ –0.0”) 1.75 mm (0.069 0.004” ) F K P 3.5 2.4 mm (0.094”) 0.10 mm 0.5 mm 4.0 (1.38 (0.157 0.002”) 0.004”) P0 4.0 0.1 mm (0.156 0.004”) P2 R T 2.0 25 mm (0.98”) 0.05 mm 0.3 (0.01 mm (0.315 0.012”) 0.1 mm (0.079 0.002”) 0.3 0.0038/ –0.0002”) W 8.0 8. Metric Dimensions Govern–English are in parentheses for reference only. 9. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to 0.50 mm max. The component cannot rotate more than 10° within the determined cavity http://onsemi.com 5 NL27WZ16 t MAX 1.5 mm MIN (0.06”) A 13.0 mm 0.2 mm (0.512” 0.008”) 20.2 mm MIN (0.795”) 50 mm MIN (1.969”) FULL RADIUS G Figure 6. Reel Dimensions REEL DIMENSIONS Tape Size T&R Suffix A Max G t Max 8 mm T1, T2 178 mm (7”) 8.4 mm, 1.5 mm, –0.0 (0.33” 0.059”, –0.00) 14.4 mm (0.56”) DIRECTION OF FEED BARCODE LABEL POCKET Figure 7. Reel Winding Direction http://onsemi.com 6 HOLE NL27WZ16 CAVITY TAPE TOP TAPE TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN COMPONENTS DIRECTION OF FEED Figure 8. Tape Ends for Finished Goods “T2” PIN ONE AWAY FROM SPROCKET HOLE User Direction of Feed Figure 9. DFT2 (SC–88) Reel Configuration/Orientation “T1” PIN ONE AWAY FROM SPROCKET HOLE User Direction of Feed Figure 10. DTT1 (TSOP–6) Reel Configuration/Orientation http://onsemi.com 7 TAPE LEADER NO COMPONENTS 400 mm MIN NL27WZ16 PACKAGE DIMENSIONS SC–88/SOT–363/SC–70 DF SUFFIX CASE 419B–01 ISSUE G A G V 6 5 4 1 2 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. –B– S D 6 PL 0.2 (0.008) M B DIM A B C D G H J K N S V M N J C K H ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 1.9 mm http://onsemi.com 8 0.65 mm 0.65 mm 0.4 mm (min) 0.5 mm (min) INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 0.012 0.016 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 0.30 0.40 NL27WZ16 PACKAGE DIMENSIONS TSOP–6/SOT–23/SC–59 DT SUFFIX CASE 318G–02 ISSUE G A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. L 6 S 1 5 4 2 3 B DIM A B C D G H J K L M S D G M J C 0.05 (0.002) K H ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 0.037 0.95 0.074 1.9 0.037 0.95 0.094 2.4 ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 0.039 1.0 http://onsemi.com 9 0.028 0.7 inches mm MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0 10 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0 10 0.0985 0.1181 NL27WZ16 Notes http://onsemi.com 10 NL27WZ16 Notes http://onsemi.com 11 NL27WZ16 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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