ONSEMI NL27WZ16DTT1G

NL27WZ16
Dual Buffer
The NL27WZ16 is a high performance dual buffer operating from a
1.65 to 5.5 V supply. At VCC = 3 V, high impedance TTL compatible
inputs significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance.
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Features
•
•
•
•
•
•
MARKING
DIAGRAMS
SC−88/SC−70−6/SOT−363
DF SUFFIX
CASE 419B
1
6
1
MR M G
G
1
TSOP−6
DT SUFFIX
CASE 318G
1
IN A1
M
•
•
•
Extremely High Speed: tPD 2.0 ns (typical) at VCC = 5 V
Designed for 1.65 V to 5.5 V VCC Operation
Over Voltage Tolerant Inputs
LVTTL Compatible − Interface Capability With 5 V TTL Logic
with VCC = 3 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Chip Complexity: FET = 72; Equivalent Gate = 18
Pb−Free Packages are Available
MR M G
G
1
MR = Device Code
M
= Date Code*
G
= Pb−Free Package
OUT Y1
(Note: Microdot may be in either location)
GND
2
5
VCC
IN A2
3
4
OUT Y2
*Date Code orientation and/or position and underbar
may vary depending upon manufacturing location.
PIN ASSIGNMENT
Figure 1. Pinout (Top View)
IN A1
1
OUT Y1
IN A2
1
OUT Y2
1
IN A1
2
GND
3
IN A2
4
OUT Y2
5
VCC
6
OUT Y1
FUNCTION TABLE
Figure 2. Logic Symbol
A Input
Y Output
L
H
L
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2007
February, 2007 − Rev. 5
1
Publication Order Number:
NL27WZ16/D
NL27WZ16
MAXIMUM RATINGS
Characteristics
Symbol
Value
Unit
VCC
*0.5 to )7.0
V
VI
*0.5 ≤ VI ≤ )7.0
V
Output in Z or LOW State (Note 1)
VO
*0.5 ≤ VO ≤ 7.0
V
VI < GND
IIK
*50
mA
VO < GND
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
IOK
*50
mA
DC Output Sink Current
IO
$50
mA
DC Supply Current per Supply Pin
ICC
$100
mA
DC Ground Current per Ground Pin
IGND
$100
mA
Storage Temperature Range
TSTG
*65 to )150
°C
DC Output Diode Current
Power Dissipation in Still Air
SC−88, TSOP−6
PD
200
mW
Thermal Resistance
SC−88, TSOP−6
qJA
333
°C/W
Lead Temperature, 1 mm from Case for 10 Seconds
TL
260
°C
Junction Temperature Under Bias
TJ
)150
°C
VESD
> 2000
> 200
N/A
V
ILatchup
$500
mA
ESD Withstand Voltage
Latchup Performance
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Above VCC and Below GND at 85°C (Note 5)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. IO absolute maximum rating must be observed.
2. Tested to EIA/JESD22−A114−A
3. Tested to EIA/JESD22−A115−A
4. Tested to JESD22−C101−A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Operating
Data Retention Only
Input Voltage
Output Voltage
(High or LOW State)
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
VCC = 1.8 V $0.15 V
VCC = 2.5 V $0.2 V
VCC =3.0 V $0.3 V
VCC =5.0 V $0.5 V
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2
Symbol
Min
Max
Unit
VCC
1.65
1.5
5.5
5.5
V
VI
0
5.5
V
VO
0
5.5
V
TA
*40
)85
°C
Dt/DV
0
0
0
0
20
20
10
5
ns/V
NL27WZ16
DC ELECTRICAL CHARACTERISTICS
Parameter
Condition
Symbol
High−Level Input
Voltage
VIH
Low−Level Input
Voltage
VIL
High−Level Output
Voltage
VIN = VIH
IOH = −100 mA
IOH = −4 mA
IOH = −8 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
IOL = 100 mA
Low−Level Output
Voltage
VIN = VIL
VOL
IOL = 4 mA
IOL = 8 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
Input Leakage Current
0 V v VIN v 5.5 V
Min
1.65 to 1.95
2.3 to 5.5
0.75 VCC
0.7 VCC
Typ
IIN
Max
Min
Max
0.75 VCC
0.7 VCC
1.65 to 1.95
2.3 to 5.5
VOH
*405C v TA v 855C
TA = 255C
VCC
(V)
0.25 VCC
0.3 VCC
V
0.25 VCC
0.3 VCC
1.65
1.8
2.3
3.0
4.5
1.55
1.7
2.2
2.9
4.4
1.65
1.8
2.3
3.0
4.5
1.55
1.7
2.2
2.9
4.4
1.65
2.3
3.0
3.0
4.5
1.29
1.9
2.4
2.3
3.8
1.52
2.15
2.80
2.68
4.20
1.29
1.9
2.4
2.3
3.8
V
V
V
1.65
1.8
2.3
3.0
4.5
0.0
0.0
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
1.65
2.3
3.0
3.0
4.5
0.08
0.10
0.15
0.22
0.22
0.24
0.30
0.40
0.55
0.55
0.24
0.30
0.40
0.55
0.55
$1.0
$1.0
0 to 5.5
Unit
V
V
mA
Power Off Leakage
Current
VIN or VOUT = 5.5 V
Quiescent Supply
Current
VIN = 5.5 V, GND
IOFF
0.0
1.0
10
mA
ICC
1.65 to 5.5
1.0
10
mA
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W
*40°C ≤ TA ≤ 85°C
TA = 25°C
Condition
Symbol
VCC (V)
Min
Typ
Max
Min
Max
Unit
RL = 1 MW, CL = 15 pF
tPLH
tPHL
1.8 $ 0.15
1.8
8.0
9.6
1.8
10.2
ns
2.5 $ 0.2
1.0
3.0
5.2
1.0
5.8
0.8
2.3
3.6
0.8
4.0
1.2
3.0
4.6
1.2
5.1
0.5
1.8
2.9
0.5
3.2
0.8
2.4
3.8
0.8
4.2
Parameter
Propagation Delay
(Figure 3 and 4)
RL = 1 MW, CL = 15 pF
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
3.3 $ 0.3
5.0 $ 0.5
CAPACITIVE CHARACTERISTICS
Parameter
Input Capacitance
Power Dissipation Capacitance (Note 6)
Condition
Symbol
Typical
Unit
VCC = 5.5 V, VI = 0 V or VCC
CIN
7.0
pF
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
CPD
9
11
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ) ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin ) ICC VCC.
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3
NL27WZ16
VCC
A
50%
GND
tPLH
Y
tPHL
50% VCC
PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Figure 3. Switching Waveforms
VCC
PULSE
GENERATOR
DUT
RT
CL
RL
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
ORDERING INFORMATION
Device
Package
NL27WZ16DFT2
SC−88/SC−70/SOT−363
NL27WZ16DFT2G
SC−88/SC−70/SOT−363
(Pb−Free)
Shipping†
3000 /Tape & Reel
NL27WZ16DTT1
NL27WZ16DTT1G
TSOP−6
TSOP−6
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NL27WZ16
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
D
e
6
5
4
1
2
3
HE
DIM
A
A1
A3
b
C
D
E
e
L
HE
−E−
b 6 PL
0.2 (0.008)
M
E
M
MILLIMETERS
MIN
NOM MAX
0.80
0.95
1.10
0.00
0.05
0.10
0.20 REF
0.10
0.21
0.30
0.10
0.14
0.25
1.80
2.00
2.20
1.15
1.25
1.35
0.65 BSC
0.10
0.20
0.30
2.00
2.10
2.20
A3
C
A
A1
L
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
INCHES
NOM MAX
0.037 0.043
0.002 0.004
0.008 REF
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
MIN
0.031
0.000
NL27WZ16
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
D
6
HE
1
5
4
2
3
E
b
DIM
A
A1
b
c
D
E
e
L
HE
q
e
q
c
A
0.05 (0.002)
L
A1
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0°
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.38
0.50
0.18
0.26
3.00
3.10
1.50
1.70
0.95
1.05
0.40
0.60
2.75
3.00
10°
−
MIN
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
0°
INCHES
NOM
0.039
0.002
0.014
0.007
0.118
0.059
0.037
0.016
0.108
−
MAX
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
10°
SOLDERING FOOTPRINT*
2.4
0.094
1.9
0.075
0.95
0.037
0.95
0.037
0.7
0.028
1.0
0.039
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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Sales Representative
NL27WZ16/D