MC14514B, MC14515B 4-Bit Transparent Latch / 4-to-16 Line Decoder The MC14514B and MC14515B are two output options of a 4 to 16 line decoder with latched inputs. The MC14514B (output active high option) presents a logical “1” at the selected output, whereas the MC14515B (output active low option) presents a logical “0” at the selected output. The latches are R−S type flip−flops which hold the last input data presented prior to the strobe transition from “1” to “0”. These high and low options of a 4−bit latch / 4 to 16 line decoder are constructed with N−channel and P−channel enhancement mode devices in a single monolithic structure. The latches are R−S type flip−flops and data is admitted upon a signal incident at the strobe input, decoded, and presented at the output. These complementary circuits find primary use in decoding applications where low power dissipation and/or high noise immunity is desired. http://onsemi.com SOIC−24 DW SUFFIX CASE 751E MARKING DIAGRAM Features • Supply Voltage Range = 3.0 Vdc to 18 Vdc • Capable of Driving Two Low−power TTL Loads or One Low−power 24 145xxB AWLYYWWG Schottky TTL Load the Rated Temperature Range 1 • These Devices are Pb−Free and are RoHS Compliant • NLV Prefix for Automotive and Other Applications Requiring xx A WL YY WW G Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable MAXIMUM RATINGS (Voltages Referenced to VSS) Symbol Value Unit VDD −0.5 to +18.0 V Vin, Vout −0.5 to VDD +0.5 V Input or Output Current (DC or Transient) per Pin Iin, Iout ±10 mA Power Dissipation per Package (Note 1) PD 500 Parameter DC Supply Voltage Range Input or Output Voltage Range (DC or Transient) = 14 or 15 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package PIN ASSIGNMENT ST 1 24 VDD D1 2 23 INH mW D2 3 22 D4 4 21 D3 Ambient Temperature Range TA −55 to +125 °C S7 Storage Temperature Range Tstg −65 to +150 °C S6 5 20 S10 Lead Temperature (8−Second Soldering) TL 260 °C S5 6 19 S11 S4 7 18 S8 S3 8 17 S9 S1 9 16 S14 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Temperature Derating: Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS v (Vin or Vout) v VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. © Semiconductor Components Industries, LLC, 2013 May, 2013 − Rev. 9 1 S2 10 15 S15 S0 11 14 S12 VSS 12 13 S13 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Publication Order Number: MC14514B/D MC14514B, MC14515B BLOCK DIAGRAM VDD = PIN 24 VSS = PIN 12 DATA 1 DATA 2 DATA 3 DATA 4 STROBE INHIBIT 2 A 3 B 21 TRANSPARENT LATCH 22 C D 1 4 TO 16 DECODER DECODE TRUTH TABLE (Strobe = 1)* S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 S10 S11 S12 S13 S14 S15 11 9 10 8 7 6 5 4 18 17 20 19 14 13 16 15 ABCD ABCD ABCD ABCD ABCD ABCD ABCD ABCD ABCD ABCD ABCD ABCD ABCD ABCD ABCD ABCD 23 Selected Output Data Inputs Inhibit D C B A MC14514 = Logic “1” MC14515 = Logic “0” 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 1 0 1 S0 S1 S2 S3 0 0 0 0 0 0 0 0 1 1 1 1 0 0 1 1 0 1 0 1 S4 S5 S6 S7 0 0 0 0 1 1 1 1 0 0 0 0 0 0 1 1 0 1 0 1 S8 S9 S10 S11 0 0 0 0 1 1 1 1 1 1 1 1 0 0 1 1 0 1 0 1 S12 S13 S14 S15 1 X X X X All Outputs = 0, MC14514 All Outputs = 1, MC14515 X = Don’t Care *Strobe = 0, Data is latched ORDERING INFORMATION Device MC14514BDWR2G NLV14514BDWR2G* MC14515BDWR2G NLV14515BDWR2G* Package Shipping† SOIC−24 (Pb−Free) 1000 / Tape & Reel SOIC−24 (Pb−Free) 1000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 2 MC14514B, MC14515B ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) − 55_C 25_C 125_C VDD Vdc Min Max Min Typ (Note 2) Max Min Max Unit VOL 5.0 10 15 − − − 0.05 0.05 0.05 − − − 0 0 0 0.05 0.05 0.05 − − − 0.05 0.05 0.05 Vdc VOH 5.0 10 15 4.95 9.95 14.95 − − − 4.95 9.95 14.95 5.0 10 15 − − − 4.95 9.95 14.95 − − − Vdc 5.0 10 15 − − − 1.5 3.0 4.0 − − − 2.25 4.50 6.75 1.5 3.0 4.0 − − − 1.5 3.0 4.0 5.0 10 15 3.5 7.0 11 − − − 3.5 7.0 11 2.75 5.50 8.25 − − − 3.5 7.0 11 − − − 5.0 5.0 10 15 – 1.2 – 0.25 – 0.62 – 1.8 − − − − – 1.0 – 0.2 – 0.5 – 1.5 – 1.7 – 0.36 – 0.9 – 3.5 − − − − – 0.7 – 0.14 – 0.35 – 1.1 − − − − IOL 5.0 10 15 0.64 1.6 4.2 − − − 0.51 1.3 3.4 0.88 2.25 8.8 − − − 0.36 0.9 2.4 − − − mAdc Input Current Iin 15 − ±0.1 − ±0.00001 ±0.1 − ±1.0 mAdc Input Capacitance (Vin = 0) Cin − − − − 5.0 7.5 − − pF Quiescent Current (Per Package) IDD 5.0 10 15 − − − 5.0 10 20 − − − 0.005 0.010 0.015 5.0 10 20 − − − 150 300 600 mAdc Total Supply Current (Note 3, 4) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) ITL 5.0 10 15 Symbol Characteristic Output Voltage Vin = VDD or 0 Vin = 0 or VDD “0” Level “1” Level Input Voltage “0” Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) “1” Level (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Source Sink VIL VIH IOH IT = (1.35 mA/kHz) f + IDD IT = (2.70 mA/kHz) f + IDD IT = (4.05 mA/kHz) f + IDD Vdc Vdc mAdc mAdc 2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. 3. The formulas given are for the typical characteristics only at 25_C. 4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL – 50) Vfk where: IT is in mA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002. http://onsemi.com 3 MC14514B, MC14515B ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C) All Types Symbol Characteristic Output Rise Time tTLH = (3.0 ns/pF) CL + 30 ns tTLH = (1.5 ns/pF) CL + 15 ns tTLH = (1.1 ns/pF) CL + 10 ns tTLH Output Fall Time tTHL = (1.5 ns/pF) CL + 25 ns tTHL = (0.75 ns/pF) CL + 12.5 ns tTHL = (0.55 ns/pF) CL + 9.5 ns tTHL Propagation Delay Time; Data, Strobe to S tPLH, tPHL = (1.7 ns/pF) CL + 465 ns tPLH, tPHL = (0.86 ns/pF) CL + 192 ns tPLH, tPHL = (0.5 ns/pF) CL + 125 ns tPLH, tPHL Inhibit Propagation Delay Times tPLH, tPHL = (1.7 ns/pF) CL + 315 ns tPLH, tPHL = (0.66 ns/pF) CL + 117 ns tPLH, tPHL = (0.5 ns/pF) CL + 75 ns tPLH, tPHL Setup Time Data to Strobe tsu Hold Time Strobe to Data th Strobe Pulse Width tWH VDD Min Typ (Note 6) Max 5.0 10 15 − − − 180 90 65 360 180 130 5.0 10 15 − − − 100 50 40 200 100 80 5.0 10 15 − − − 550 225 150 1100 450 300 5.0 10 15 − − − 400 150 100 800 300 200 5.0 10 15 250 100 75 125 50 38 − − − 5.0 10 15 – 20 0 10 – 100 – 40 – 30 − − − 5.0 10 15 350 100 75 175 50 38 − − − Unit 5. The formulas given are for the typical characteristics only at 25_C. 6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. VDD VDS STROBE INHIBIT For MC14514B 1. For P−channel: Inhibit = VSS 1. and D1−D4 constitute 1. binary code for “output 1. under test.” 2. For N−channel: Inhibit = VDD D1 D2 D3 D4 S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 S10 S11 S12 S13 S14 S15 For MC14515B 1. For P−channel: Inhibit = VDD 2. For N−channel: Inhibit = VSS 2. and D1−D4 constitute binary 2. code for “output under test.” ID EXTERNAL POWER SUPPLY VSS Figure 1. Drain Characteristics Test Circuit http://onsemi.com 4 ns ns ns ns ns ns ns MC14514B, MC14515B VDD 0.01 mF CERAMIC ID 24 VDD 500 mF 20 ns 20 ns PULSE GENERATOR D1 S0 D2 D3 D4 STROBE INHIBIT S15 12 CL VDD 90% Vin 10% VSS CL VSS Figure 2. Dynamic Power Dissipation Test Circuit and Waveform VDD STROBE OUTPUT S0 OUTPUT S1 S0 S1 INHIBIT PROGRAMMABLE PULSE GENERATOR tTLH tTHL 20 ns CL CL INPUT D1 10% VSS tPHL VDD tPLH D2 90% 50% 10% OUTPUT D3 D4 VDD 90% 50% OUTPUT S15 S15 VSS CL Figure 3. Switching Time Test Circuit and Waveforms http://onsemi.com 5 tTLH VSS tTHL http://onsemi.com 6 INHIBIT 23 STROBE 1 DATA 4 22 DATA 3 21 DATA 2 3 DATA 1 2 Q Q R Q R S Q Q R S Q Q R S Q S D C B A LOGIC DIAGRAM IN MC14515B ONLY AB CD AB CD AB CD AB CD AB CD AB CD AB CD AB CD AB CD AB CD AB CD AB CD AB CD AB CD AB CD AB CD 15 S15 16 S14 13 S13 14 S12 19 S11 20 S10 17 S9 18 S8 4 S7 5 S6 6 S5 7 S4 8 S3 10 S2 9 S1 11 S0 MC14514B, MC14515B MC14514B, MC14515B COMPLEX DATA ROUTING times faster then the shift frequency of the input registers, the most significant bit (MSB) from each register could be selected for transfer to the data bus. Therefore, all of the most significant bits from all of the registers can be transferred to the data bus before the next most significant bit is presented for transfer by the input registers. Information from the 3−state bus is redistributed by the MC14514B four−bit latch/decoder. Using the four−bit address, D1 thru D4, the information on the inhibit line can be transferred to the addressed output line to the desired output registers, A thru P. This distribution of data bits to the output registers can be made in many complex patterns. For example, all of the most significant bits from the input registers can be routed into output register A, all of the next most significant bits into register B, etc. In this way horizontal, vertical, or other methods of data slicing can be implemented. Two MC14512 eight−channel data selectors are used here with the MC14514B four−bit latch/decoder to effect a complex data routing system. A total of 16 inputs from data registers are selected and transferred via a 3−state data bus to a data distributor for rearrangement and entry into 16 output registers. In this way sequential data can be re−routed or intermixed according to patterns determined by data select and distribution inputs. Data is placed into the routing scheme via the eight inputs on both MC14512 data selectors. One register is assigned to each input. The signals on A0, A1, and A2 choose one of eight inputs for transfer out to the 3−state data bus. A fourth signal, labelled Dis, disables one of the MC14512 selectors, assuring transfer of data from only one register. In addition to a choice of input registers, 1 thru 16, the rate of transfer of the sequential information can also be varied. That is, if the MC14512 were addressed at a rate that is eight DATA ROUTING SYSTEM REGISTER 1 D0 D1 D2 D3 D4 D5 D6 DIS 3-STATE DATA BUS DATA DISTRIBUTION OUTPUT REGISTERS Q D1 D2 D3 D4 S0 STROBE S1 S2 S3 S4 S5 S6 S7 S8 S9 S10 S11 S12 S13 INHIBIT S14 S15 D7 A0 A1 A2 REGISTER A MC14514B REGISTER 8 DATA TRANSFER MC14512 INPUT REGISTERS DATA SELECT A0 A1 A2 D0 Q D1 D2 D3 D4 D5 D6 D7 DIS MC14512 REGISTER 9 REGISTER 16 http://onsemi.com 7 REGISTER P MC14514B, MC14515B PACKAGE DIMENSIONS SOIC−24 WB CASE 751E−04 ISSUE F D 24 E H A B 0.25 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD AND ARE MEASURED BETWEEN 0.10 AND 0.25 FROM THE LEAD TIP. 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 mm PER SIDE. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 PER SIDE. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H. 5. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 13 E1 1 L 12 C DETAIL A 24X b PIN 1 INDICATOR 0.25 TOP VIEW M C A S B S h x 45 _ A A1 NOTE 5 e DIM A A1 b c D E E1 e h L M NOTE 3 C c SEATING PLANE NOTE 3 M DETAIL A END VIEW SIDE VIEW MILLIMETERS MIN MAX 2.35 2.65 0.13 0.29 0.35 0.49 0.23 0.32 15.25 15.54 10.30 BSC 7.40 7.60 1.27 BSC 0.25 0.75 0.41 0.90 0_ 8_ RECOMMENDED SOLDERING FOOTPRINT* 24X 24X 1.62 0.52 11.00 1 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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