MC10H123 D

MC10H123
Triple 4−3−3−Input Bus
Driver
Description
The MC10H123 is a triple 4−3−3−Input Bus Driver.
The MC10H123 consists of three NOR gates designed for bus
driving applications on card or between cards. Output low logic levels
are specified with VOL = −2.1 Vdc so that the bus may be terminated to
−2.0 Vdc. The gate output, when low, appears as a high impedance to
the bus, because the output emitter−followers of the MC10H123 are
“turned−off.” This eliminates discontinuities in the characteristic
impedance of the bus.
The VOH level is specified when driving a 25 W load terminated to
−2.0 Vdc, the equivalent of a 50 W bus terminated at both ends.
Although 25 W is the lowest characteristic impedance that can be
driven by the MC10H123, higher impedance values may be used with
this part. A typical 50 W bus is shown in Figure 3.
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MARKING DIAGRAMS*
16
MC10H123L
AWLYYWW
1
CDIP−16
L SUFFIX
CASE 620A
Features
• Propagation Delay, 1.5 ns Typical
• Improved Noise Margin 150 mV (Over Operating Voltage and
•
•
•
Temperature Range)
Voltage Compensated
MECL 10K™ Compatible
Pb−Free Packages are Available*
16
MC10H123P
AWLYYWWG
16
1
PDIP−16
P SUFFIX
CASE 648
1
1 20
10H123G
AWLYYWW
20 1
PLLC−20
FN SUFFIX
CASE 775
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 7
1
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Publication Order Number:
MC10H123/D
MC10H123
4
5
3
6
7
9
10
VCC1
1
16
VCC2
BOUT
2
15
COUT
AOUT
3
14
CIN
AIN
4
13
CIN
AIN
5
12
CIN
AIN
6
11
BIN
AIN
7
10
BIN
VEE
8
9
BIN
2
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
11
12
13
15
14
Pin assignment is for Dual−in−Line Package.
Figure 1. LOGIC DIAGRAM
Figure 2. Dip Pin Assignment
Table 1. MAXIMUM RATINGS
Symbol
Characteristic
Rating
Unit
VEE
Power Supply (VCC = 0)
−8.0 to 0
Vdc
VI
Input Voltage (VCC = 0)
0 to VEE
Vdc
Iout
Output Current
50
100
mA
TA
Operating Temperature Range
0 to +75
°C
Tstg
Storage Temperature Range
−55 to +150
−55 to +165
°C
°C
Continuous
Surge
Plastic
Ceramic
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1)
0°
Symbol
IE
Characteristic
Min
25°
Max
Min
75°
Max
Min
Max
Unit
Power Supply Current
60
56
60
mA
IinH
Input Current High
495
310
310
mA
IinL
Input Current Low
VOH
High Output Voltage
VOL
VIH
VIL
0.5
0.5
−1.02
−0.84
Low Output Voltage
−2.1
High Input Voltage
−1.17
Low Input Voltage
−1.95
0.3
−0.98
−0.81
−0.92
−2.03
−2.1
−2.03
−0.84
−1.13
−0.81
−1.48
−1.95
−1.48
−1.95
mA
−0.735
Vdc
−2.1
−2.03
Vdc
−1.07
−0.735
Vdc
−1.45
Vdc
1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
Outputs are terminated through a 50 W resistor to −2.1 V.
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2
MC10H123
Table 3. AC CHARACTERISTICS
0°
Symbol
25°
75°
Min
Max
Min
Max
Min
Max
Unit
Propagation Delay
0.7
1.5
0.7
1.6
0.7
1.7
ns
tr
Rise Time
0.7
1.6
0.7
1.7
0.7
1.8
ns
tf
Fall Time
0.7
1.6
0.7
1.7
0.7
1.8
ns
tpd
Characteristic
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1/3 MC10H123
1/3 MC10H123
1/3 MC10H123
ZO = 50 W
50 W
−2.0
VDC
50 W
RECEIVERS (MECL GATES)
−2.0
VDC
Figure 3. 50 W Bus Driver (25 W Load)
ORDERING INFORMATION
Package
Shipping †
MC10H123FN
PLLC−20
46 Units / Rail
MC10H123FNG
PLLC−20
(Pb−Free)
46 Units / Rail
MC10H123FNR2
PLLC−20
500 / Tape & Reel
MC10H123FNR2G
PLLC−20
(Pb−Free)
500 / Tape & Reel
MC10H123L
CDIP−16
25 Unit / Rail
MC10H123P
PDIP−16
25 Unit / Rail
MC10H123PG
PDIP−16
(Pb−Free)
25 Unit / Rail
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MC10H123
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE E
0.007 (0.180) M T L−M
B
Y BRK
−N−
U
N
S
0.007 (0.180) M T L−M
S
S
N
S
D
−L−
−M−
Z
W
20
D
1
V
0.007 (0.180) M T L−M
S
N
S
R
0.007 (0.180) M T L−M
S
N
S
Z
T L−M
S
N
H
J
0.007 (0.180) M T L−M
S
−T−
VIEW S
SEATING
PLANE
F
0.007 (0.180) M T L−M
S
VIEW S
N
S
N
S
K
0.004 (0.100)
G
S
S
K1
E
G1
0.010 (0.250) S T L−M
S
VIEW D−D
A
C
0.010 (0.250)
G1
X
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
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4
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−− 0.020
2_
10 _
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2_
10 _
7.88
8.38
1.02
−−−
N
S
MC10H123
PACKAGE DIMENSIONS
B
CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A−01
ISSUE O
A
A
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
M
9
B
L
1
8
16X
0.25 (0.010)
E
M
DIM
A
B
C
D
E
F
G
H
K
L
M
N
J
T B
F
C
K
T
N
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
−−−
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
SEATING
PLANE
G
16X
0.25 (0.010)
M
16
9
1
8
D
T A
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE R
−A−
B
F
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
L
S
−T−
H
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
−−− 0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
SEATING
PLANE
K
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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5
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For additional information, please contact your
local Sales Representative.
MC10H123/D