Colligo System on Module 10/01/2016 -Confidential- 1 Customer Challenges Time to Market Rapid technology changes force us to introduce new products on a constant basis Embedding new technologies is always challenging and time consuming Costs Embedding new solutions bear high expenses at the design and development stages Lack of resources Limited engineering resources Knowhow Complexity Valens Colligo SoM The Colligo System on Module (SoM) is a small form-factor, surface mount module that consists of the entire* HDBaseT system RX SoM TX SoM * For maximum flexibility, the transformer and connectors are excluded SoM Bottom SoM w/Cover 3 Customer Benefits Faster Time to Market Pre-validated Fully Featured Shortens development time Saves cost and reduces risk Reduces development risks and costs Lowers the system costs Enables you to test the market with minimal investments Efficiency Frees up your most valuable resource to work on other tasks Enables you to introduce the exact feature set you need Straightforward Key Features Small Form Factor: 50mm x 50mm x 7mm Pre-validated, Pre-CTS certified Same pinout for both TX & RX Modules Single module with over 250 components Single Supply Voltage (5V - 12V) Optimized carrier board design Carrier can be implemented using 4 layer PCB Same carrier for both TX & RX Modules Increased flexibility Modular design - enables faster spins for the carrier (application) boards Exposes all interfaces that are available at the chip level Connectors and magnetics are excluded Module Interfaces USB HDMI HDBaseT MISC MISC HDBaseT HDMI USB JTAG RMII RMII JTAG I2C SPI I2C SPI GPIO/MSIO GPIO/MSIO SGMII MII MII HDIO HDIO HDII HDII HDIO MII HDII SGMII BOTTOM HDIO HDII MII Colligo Module Assembly Shield frame Module PCB Colligo Colligo Module Assembly Module assembled on Carrier Board Shield frame Module PCB Carrier board Colligo Colligo Module Assembly Module assembled on Carrier Board Thermal Pad added Thermal pad Shield frame Module PCB Carrier board Colligo Colligo Module Assembly Module assembled on Carrier Board Thermal Pad added Metal shield assembled Thermal pad shield Shield frame Module PCB Carrier board Colligo Module Thermal Design Designed for heat dissipation from both top and bottom shield Module PCB Mother board VS2 Shield frame Module Thermal Design Designed for heat dissipation from both top and bottom Bottom – using thermal pad shield Module PCB Shield frame VS2 Mother board Product metal case Thermal pad Module Thermal Design Designed for heat dissipation from both top and bottom Bottom – using thermal pad Top – using thermal pad and module’s shield Thermal pad shield Module PCB Shield frame VS2 Mother board Product metal case Thermal pad Colligo Module TX Placement HDBT LINK LED(1) HDMI HDCP LED(1) FW LED(1) RESETN(1) VSMS_RX_LVTTL(1) VSMS 3V3(1) VSMS_TX_LVTTL(1) GND(1) RMII_MAC_CLK(1) (1) RMII_MAC_RXD0(1) RMII_MAC_TXEN(1) RMII_MAC_TXD0 RMII_MAC_RXDV(1) CFG_SDA(1) RMII_MAC_RXD1(1) RMII_MAC_TXD1(1) VS2-MDL1 TX – REV A (TOP-SIDE) HDBT ESD CFG_SCL(1) GMII_MDC(1) USB 12Mhz XTAL 25Mhz XTAL (assembly option with 125Mhz Osc.) GMII_MDIO(1) VS2-23XXX TX Flash Ext. Buffer 125Mhz OSC. (assembly option with 25Mhz XTAL.) Flash DCDC 1.0V (1) SMD Test Points DCDC 1.8V DCDC 3.3V Colligo Module RX Placement HDBT LINK LED(1) HDMI HDCP LED(1) FW LED(1) RESETN(1) VSMS_RX_LVTTL(1) VSMS 3V3(1) VSMS_TX_LVTTL(1) GND(1) VS2-MDL1 RX – REV A (TOP-SIDE) HDBT ESD CFG_SDA(1) CFG_SCL(1) USB 12Mhz XTAL 25Mhz XTAL (assembly option with 125Mhz Osc.) VS2-23XXX RX Flash Ext. Buffer 125Mhz OSC. (assembly option with 25Mhz XTAL.) Flash MII_RXD_ST5(1) DCDC 1.0V (1) SMD Test Points DCDC 1.8V DCDC 3.3V HDMI Extender Application Minimal additional BOM 4-layer PCB No need for power management LEDS PWR DBG/RIF Transformer ESD ESD HDMI & USB Extender Application Minimal additional BOM 4-layer PCB No need for power management With USB interface LEDS PWR DBG/RIF ESD Transformer ESD ESD Carrier for HDMI + USB – Example Connectors HDMI, HDBaseT, USB and DC Indicators (optional) LEDs for Power, Link, Video/HDCP, FW activity Dimensions – 130mm x 66mm 4 layers – lower cost Same PCB design for TX / RX Carrier Board Placement - Top J1 19 20 J2 1 19 2 20 J4 EXT 1.8V J5 - - 1 3 5 7 2 46 8 J8 VS2XXX RX / TX MDL1 19 HDII 4 3 2 1 15 16 1 2 15 16 1 2 J16 (micro-B) Assembly option I2C_HOST POR_BYPASS 2 1 20 19 J17 2 1 20 19 J18 D5 D10 D7 D9 DC JACK 1 2 3 J12 J14 J13 J11 J10 1 2 3 4 J9 5 1 USB Host J3 1 2 3 4 J7 1 HDMI In/OUT (Type-A) Assembly option - 1 2 3 4 J6 HDBT Transformer USB Device 1 2 + SW1 JR1 HDBT RJ-45 Reset Pushbutton + DEBUG EXT 1.0V RIF_UART + EXT 3.3V VS2-CRR1-MDL1 – REVA (TOP) LED HDMI HDCP LED HDBT LINK LED FW LED POWER Carrier Board Placement - Bottom VS2-CRR1-MDL1 – REVA (BOT) J19 HDIO Use-Cases: Projector & Matrix Adding HDBaseT support using minimal design effort Use-Cases: Industrial PC Adding HDBaseT support using minimal design effort Thank You 23