INTERSIL 5962R0053801V9A

IS-705RH
Features
The Radiation Hardened IS-705RH
is a monolithic device that
monitors the power supply voltage
used by satellite control units and
provides a reset output pulse
during power-up and power-down. The reset threshold
is 4.65V (Typ) and the reset pulse width is set at 200ms
(Typ). A watchdog circuit is incorporated for easy
interfacing with microprocessors and controllers. If the
watchdog input has not been toggled within a preset
1.6s (Typ) time period, an output signal is generated,
which can be used as an interrupt. The power function
input (PFI) may be used to monitor other voltage levels.
The circuit has a 1.25V (Typ) threshold and provides a
PFO output when low voltage is detected. An active-low
manual reset input is also provided for direct control of
the reset function.
• Electrically Screened to SMD #5962-00538
Constructed with the Intersil UHF2X-CMOS process,
these devices have been specifically designed to provide
highly reliable performance in harsh radiation
environments. This process has been tested for single
event latch-up and has demonstrated an immunity to
90MeV/mg/cm2.
• Critical Microprocessor Power Monitoring
TM
• QML Qualified per MIL-PRF-38535 Requirements
• Radiation Hardness
- Total Dose . . . . . . . . . . . . . 100 krad(Si) (Min)
- Single Event Latch-up . . . . . . >90MeV/mg/cm2
• Precision 4.65V Voltage Monitor
• Supply Voltage Range . . . . . . . . . 4.75V to 5.5V
• RESET Valid at VCC = 1.2V
• Low Supply Current . . . . . . . . . . . . .420µA (Typ)
• 200ms (Typ) RESET Pulse Width
Applications
• Flight Computers
• Controllers
• Reliable Replacement of Discrete Solutions
Pin Configuration
Specifications for Rad Hard QML devices are
controlled by the Defense Supply Center in
Columbus (DSCC). The SMD numbers listed here
must be used when ordering.
Detailed Electrical Specifications for these
devices are contained in SMD 5962-00538. A
“hot-link” is provided on our homepage for
downloading.
http://www.dscc.dla.mil/downloads/milspec/s
md/00538.pdf
IS-705RH
(8 LD FLATPACK)
TOP VIEW
MR
1
8 WDO
VCC
2
7 RESET
GND
3
6 WDI
PFI
4
5 PFO
Ordering Information
ORDERING
NUMBER
INTERNAL
MKT. NUMBER
PART
MARKING
5962R0053801V9A
IS0-705RH-Q
IS0-705RH/SAMPLE
IS0-705RH/SAMPLE
5962R0053801QXC
(Note)
IS9-705RH-8
Q 5962R00 53801QXC
5962R0053801VXC
(Note)
IS9-705RH-Q
IS9-705RH/PROTO
(Note)
IS9-705RH/PROTO
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
-55 to +125
DIE
-55 to +125
DIE SAMPLE
-55 to +125
8 Ld Flatpack, Solder SL
Q 5962R00 53801VXC
-55 to +125
8 Ld Flatpack, Solder SL
IS9- 705RH /PROTO
-55 to +125
8 Ld Flatpack, Solder SL
NOTE: These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant
and compatible with both SnPb and Pb-free soldering operations.
March 23, 2010
FN4703.6
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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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IS-705RH
Radiation Hardened Power-Up/Down
Microprocessor Reset Circuit
IS-705RH
Die Characteristics
Process:
DIE DIMENSIONS:
UHF2X-CMOS, Junction Isolation
1500μmx1830µm (59milsx72mils)
Thickness: 483µm ±25.4μm (19mils ±1mil)
Backside Finish:
INTERFACE MATERIALS
Silicon
Glassivation
ASSEMBLY RELATED INFORMATION
Type: Nitride (Si3N4) over Silox (SiO2)
Nitride Thickness: 4.0kÅ ±1.0kÅ
Silox Thickness: 12.0kÅ ±4.0kÅ
Substrate Potential:
Unbiased
(May be left floating or connected to GND.)
Top Metallization
ADDITIONAL INFORMATION
Top Metal 3: TiAlCu
Thickness: 0.8µm ±0.02µm
Metal 1 and 2: TiAlCu
Thickness: 0.4µm ±0.01µm
Worst Case Current Density:
<2.0 x 105 A/cm2
Metallization Mask Layout
IS-705RH
MR (1)
WDO (8)
VCC (2)
RESET (7)
WDI (6)
GND (3)
PFI (4)
PFO (5)
NOTE: Octagonal trim pads should be left unconnected.
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Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications
at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by
Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any
infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any
patent or patent rights of Intersil or its subsidiaries.
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FN4703.6
March 23, 2010