IS-1009RH ® Data Sheet FN4780.4 January 27, 2006 Radiation Hardened 2.5V Reference Features The Star*Power Radiation Hardened IS-1009RH is a 2.5V shunt regulator diode designed to provide a stable 2.5V reference over a wide current range. • Electrically Screened to SMD # 5962-00523 The device is designed to maintain stability over the full miitary temperature range and over time. The 0.2% reference tolerance is achieved by on-chip trimming. An adjustment terminal is provided to allow for the calibration of system errors. The use of this terminal to adjust the reference voltage does not effect the temperature coefficient. • QML Qualified per MIL-PRF-38535 Requirements • Radiation Environment - Total Dose . . . . . . . . . . . . . . . . . . . . 300 krad(Si) (Max) - Latch-up Immune . . . . . . . . . . . . . Dielectrically Isolated • Reverse Breakdown Voltage (VZ) . . . . . . . . . . . . . . . 2.5V • Change in VZ vs. Current (400µA to 10mA). . . . . . . . 6mV • Change in VZ vs. Temp (-55°C to 125°C) . . . . . . . . 15mV • Max Reverse Breakdown Current . . . . . . . . . . . . . . 20mA Constructed with the Intersil dielectrically isolated EBHF process, these devices are immune to Single Event Latch-up and have been specifically designed to provide highly reliable performance in harsh radiation environments. • Device is tested with 10µF shunt capacitance connected from V+ to V-, which provides optimum stability • Interchangeable with 1009 and 136 Industry Types Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed here must be used when ordering. Applications Detailed Electrical Specifications for these devices are contained in SMD 5962-00523. • Reference for 5V Systems Pinouts Ordering Information IS2-1009RH (TO-206AB CAN) BOTTOM VIEW 2 3 V- ISYE-1009RH (SMD.5) BOTTOM VIEW V- • A/D and D/A Reference ORDERING NUMBER V+ ADJ 1 • Power Supply Monitoring 2 ADJ 1 V+ INTERNAL MKT. NUMBER PART MARKING TEMP. RANGE (°C) 5962F0052301VXC IS2-1009RH-Q F00523V -55 to 125 5962F0052301QXC IS2-1009RH-8 F00523 01QXC Q -55 to 125 5962F0052301VYC ISYE-1009RH-Q Q 5962F00 52301VYC -55 to 125 5962F0052301QYC ISYE-1009RH-8 Q 5962F00 52301QYC -55 to 125 IS2-1009RH/Proto IS2-1009RH/ Proto -55 to 125 ISLYE1009RH/Proto -55 to 125 IS2-1009RH/ Proto ISYE-1009RH/Proto ISYE-1009RH/ Proto 3 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2000, 2006. Star*Power™ is a trademark of Intersil Corporation. All Rights Reserved All other trademarks mentioned are the property of their respective owners. IS-1009RH Die Characteristics DIE DIMENSIONS Backside Finish 1270µm x 1778µm (50 mils x 70 mils) Thickness: 483µm ±25.4µm (19 mils ±1 mil) Silicon ASSEMBLY RELATED INFORMATION INTERFACE MATERIALS Substrate Potential Glassivation Unbiased (DI) Type: Nitride (Si3N4) over Silox (SiO2) Nitride Thickness: 4.0kÅ ±1.0kÅ Silox Thickness: 12.0kÅ ±4.0kÅ ADDITIONAL INFORMATION Worst Case Current Density <1.0 x 105 A/cm2 Top Metallization Transistor Count Type: AlSiCu Thickness: 16.0kÅ ±2kÅ 26 Substrate EBHF, Dielectric Isolation Metallization Mask Layout IS-1009RH ADJ V+ V- All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 2 FN4780.4 January 27, 2006