SiA417DJ Datasheet

New Product
SiA417DJ
Vishay Siliconix
P-Channel 8-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
-8
RDS(on) (Ω)
ID (A)
0.023 at VGS = - 4.5 V
- 12a
0.031 at VGS = - 2.5 V
- 12a
0.040 at VGS = - 1.8 V
- 12
a
0.058 at VGS = - 1.5 V
- 12a
0.095 at VGS = - 1.2 V
- 12a
• Halogen-free
• TrenchFET® Power MOSFET
• New Thermally Enhanced PowerPAK®
SC-70 Package
- Small Footprint Area
- Low On-Resistance
Qg (Typ.)
19 nC
RoHS
COMPLIANT
APPLICATIONS
• Load Switch, PA Switch for Portable Devices
PowerPAK SC-70-6L-Single
S
1
D
2
Marking Code
D
3
6
G
D
5
2.05 mm
Part # code
XXX
Lot Traceability
and Date code
S
D
S
G
BHX
2.05 mm
D
4
Ordering Information: SiA417DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
Symbol
VDS
VGS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
IDM
Pulsed Drain Current
Continuous Source-Drain Diode Current
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
ID
TC = 25 °C
TA = 25 °C
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
IS
PD
TJ, Tstg
Limit
-8
±5
- 12a
- 12a
- 12a, b, c
- 8.3b, c
- 30
- 12a
- 2.9b, c
19
12
3.5b, c
2.2b, c
- 55 to 150
260
Unit
V
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
RthJA
t≤5s
28
36
Maximum Junction-to-Ambientb, f
°C/W
RthJC
5.3
6.5
Maximum Junction-to-Case (Drain)
Steady State
Notes:
a. Package limited
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 80 °C/W.
Document Number: 74637
S-80437-Rev. B, 03-Mar-08
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New Product
SiA417DJ
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = - 250 µA
-8
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
ΔVDS/TJ
VDS Temperature Coefficient
V
- 7.3
ID = - 250 µA
mV/°C
VGS(th) Temperature Coefficient
ΔVGS(th)/TJ
Gate-Source Threshold Voltage
VGS(th)
VDS = VGS, ID = - 250 µA
-1
V
IGSS
VDS = 0 V, VGS = ± 5 V
± 100
nA
VDS = - 8 V, VGS = 0 V
-1
VDS = - 8 V, VGS = 0 V, TJ = 55 °C
- 10
Gate-Source Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
VDS ≤ - 5 V, VGS = - 4.5 V
VGS = - 4.5 V, ID = - 7 A
Drain-Source On-State Resistance
a
Forward Transconductancea
RDS(on)
gfs
2.5
- 0.35
- 10
µA
A
0.019
0.023
VGS = - 2.5 V, ID = - 6 A
0.026
0.031
VGS = - 1.8 V, ID = - 5.3 A
0.033
0.040
VGS = - 1.5 V, ID = - 1.7 A
0.043
0.058
VGS = - 1.2 V, ID = - 1.1 A
0.063
0.095
VDS = - 4 V, ID = - 7 A
23
Ω
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
1600
VDS = - 4 V, VGS = 0 V, f = 1 MHz
pF
500
320
VDS = - 4 V, VGS = - 5 V, ID = - 10 A
VDS = - 4 V, VGS = - 4.5 V, ID = - 10 A
21
32
19
29
2.2
nC
5
f = 1 MHz
td(on)
15
VDD = - 4 V, RL = 0.5 Ω
ID ≅ - 8.3 A, VGEN = - 4.5 V, Rg = 1 Ω
tr
td(off)
Ω
8
25
25
38
80
120
tf
45
70
td(on)
10
15
VDD = - 4 V, RL = 0.5 Ω
ID ≅ - 8.3 A, VGEN = - 5 V, Rg = 1 Ω
tr
td(off)
tf
12
20
80
120
45
70
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
TC = 25 °C
IS
Pulse Diode Forward Current
ISM
Body Diode Voltage
VSD
- 12
- 30
IS = - 8.3 A, VGS = 0 V
- 0.8
- 1.2
A
V
Body Diode Reverse Recovery Time
trr
60
90
ns
Body Diode Reverse Recovery Charge
Qrr
33
50
nC
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
IF = - 8.3 A, di/dt = 100 A/µs, TJ = 25 °C
15
45
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 74637
S-80437-Rev. B, 03-Mar-08
New Product
SiA417DJ
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
10
30
VGS = 5 V thru 2 V
8
I D - Drain Current (A)
I D - Drain Current (A)
25
20
15
VGS = 1.5 V
10
6
4
TC = 25 °C
2
5
TC = 125 °C
VGS = 1 V
TC = - 55 °C
0
0.0
0.5
1.0
1.5
2.0
2.5
0
0.0
3.0
0.3
VDS - Drain-to-Source Voltage (V)
0.9
1.2
1.5
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.12
2500
0.10
VGS = 1.5 V
0.08
2000
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
0.6
VGS = 1.8 V
0.06
VGS = 1.2 V
VGS = 2.5 V
0.04
Ciss
1500
1000
Coss
500
0.02
Crss
VGS = 4.5 V
0.00
0
0
5
10
15
20
25
30
0
2
I D - Drain Current (A)
6
8
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
1.4
5
ID = 7 A
ID = 10 A
1.3
4
VDS = 4 V
R DS(on) - On-Resistance
(Normalized)
VGS - Gate-to-Source Voltage (V)
4
3
VDS = 6.4 V
2
VGS = 4.5 V, 2.5 V, 1.8 V, 1.5 V
1.2
1.1
1.0
0.9
1
0.8
0
0
5
Document Number: 74637
S-80437-Rev. B, 03-Mar-08
10
15
20
25
0.7
- 50
- 25
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
150
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New Product
SiA417DJ
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.10
100
R DS(on) - On-Resistance (Ω)
I S - Source Current (A)
ID = 7 A
TJ = 150 °C
TJ = 25 °C
10
0.08
0.06
0.04
125 °C
0.02
25 °C
0.00
1
0
0.2
0.4
0.6
0.8
1.0
0
1.2
1
0.7
30
0.6
25
0.5
4
5
20
Power (W)
V GS(th) (V)
3
On-Resistance vs. Gate-to-Source Voltage
Soure-Drain Diode Forward Voltage
ID = 250 µA
0.4
15
0.3
10
0.2
5
0.1
- 50
2
VGS - Gate-to-Source Voltage (V)
VSD - Source-to-Drain Voltage (V)
- 25
0
25
50
75
100
125
0
0.001
150
0.01
0.1
1
10
100
TJ - Temperature (°C)
Time (s)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
100
1000
IDM Limited
Limited by RDS(on)*
I D - Drain Current (A)
10
1 ms
10 ms
ID(on)
Limited
1
100 ms
1s
10 s
DC
0.1
TA = 25 °C
Single Pulse
0.01
0.1
BVDSS Limited
1
* VGS
10
VDS - Drain-to-Source Voltage (V)
minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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Document Number: 74637
S-80437-Rev. B, 03-Mar-08
New Product
SiA417DJ
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
30
20
25
Power Dissipation (W)
I D - Drain Current (A)
15
20
15
Package Limited
10
10
5
5
0
0
0
25
50
75
100
TC - Case Temperature (°C)
Current Derating*
125
150
25
50
75
100
125
150
TC - Case Temperature (°C)
Power Derating
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 74637
S-80437-Rev. B, 03-Mar-08
www.vishay.com
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New Product
SiA417DJ
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
t1
0.05
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 65 C/W
0.02
3. TJM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (s)
10
100
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.05
0.1
10-4
0.02
Single Pulse
10-3
10-2
10-1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?74637.
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Document Number: 74637
S-80437-Rev. B, 03-Mar-08
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
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information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
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Document Number: 91000
Revision: 18-Jul-08
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