REFERENCE REFERENCE 28−75 Clsf. Standard Doc. PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) Product Specifications Revision Code 1−17 L 2 / 20 P. Performance Test Method 3. Capacitance Within a range of specified value. (Measured at a frequency of 1 kHz ±0.2 kHz, at 20°C ±2°C and with voltage of 5 Vrms or less.) JIC C 5102-1994 7.8 IEC 384-1-1982 4. Dissipation Factor 0.6% or less (Measured at a frequency of 1 kHz ±0.2 kHz, at 20°C ±2°C and with voltage of 5 Vrms or less.) JIC C 5102-1994 7.9 IEC 384-1-1982 4.8 5. Connection The connection of the element shall not open even instantaneously when applied a voltage of 100 mVpeak or less and applied light force. JIS C 5102-1994 7.10 IEC 384-1-1982 No. Item No. 6. Vibration Resistance The capacitor shall be mounted on the PCB (Printed Circuit Board), and the following vibration shall be applied to the capacitor. Range of vibration frequency 10 Hz to 55 Hz total amplitude 1.5 mm, rate of frequency vibration to be such as varying from 10 Hz to 55 Hz and return to 10 Hz in about 1 min and thus repeated. Thus shall be conducted for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours). JIC C 5102-1994 8.2.3.(A) IEC 384-1-1982 4.17 The connection shall not get short-circuit or open when examined the connection of the element in compliance with the previous item (connection of element) during the last 30 min of the test. The terminal shall be immersed in methanol solution of resin (about 25%) and the terminal shall be immersed in the solder bath at a temperature of 255°C ±5°C for 2.5 s ±0.5 s. After test immersion, the solder shall be stuck to 90% or more in the surface of the electrode that shown in blew development. X mm X mm Surface of External electrode Termination surface 7. Soldering Property Surface of External electrode Development of electrode Evaluation shall be conducted in this area. X = 0.2 (2012, 3126, 3225 size) 0.1(1608 size) Solder in the solder tank is Sn-Ag-Cu. Film Capacitor Division Capacitor Business Division Panasonic Corporation JIS C 5102-1994 8.4 IEC 384-1-1982 4.15 REFERENCE 28−75 Clsf. Standard Doc. Product Specifications No. PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) Item No. Revision Code Performance 1−17 L 3 / 20 P. Test Method The capacitor under test shall be kept at condition of the temperature 40°C ±2°C and the humidity at 90%RH to 95%RH for 1000 hours +48/ -0 hours in the testing oven and then kept at ordinary condition (ordinary temperature and humidity) for 1.5 hours ±0.5 hours. After the test, the capacitor shall be satisfied with the following performance. 8. Moisture Resistance (I) Appearance : No remarkable change. Dielectric Withstand Voltage : Between terminals Nothing abnormal shall be found, when applied a voltage of 130% of the rated voltage for 1 min (the capacitor shall be applied the voltage through 2 kΩ or more when charge and discharge). Insulation Resistance : Between terminals 1000 MΩ or more Change rate of capacitance : Within ±2% of the value before the test. Dissipation Factor: 0.9% or less (at 1 kHz) JIC C 5102-1994 9.5 IEC 384-1-1982 4.22 The capacitor under test shall be kept at condition of the temperature 60°C ±2°C and the humidity at 90%RH to 95%RH for 500 +24/ -0 hours in the testing oven and then kept at ordinary condition for 1.5 hours ±0.5 hours. After the test, the capacitor shall be satisfied with the following performance. Moisture 9. Resistance (II) Appearance : No remarkable change. Dielectric Withstand Voltage : Between terminals Nothing abnormal shall be found, when applied a voltage of 130% of the rated voltage for 1 min (the capacitor shall be applied the voltage through more than 2 kΩwhen charge and discharge). Insulation Resistance : Between terminals 500 MΩ or more Change rate of capacitance : Within ±2% of the value before the test. Dissipation Factor : 0.9% or less (at 1 kHz) Film Capacitor Division Capacitor Business Division Panasonic Corporation JIC C 5102-1994 9.5 IEC 384-1-1982 4.22 REFERENCE 28−75 Clsf. Standard Doc. PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) Product Specifications No. Item No. Revision Code Performance 1−17 L 4 / 20 P. Test Method The capacitor under test shall be kept at condition of the temperature 40°C ±2°C and the humidity at 90%RH to 95%RH with applying the rated voltage continuously for 1000 hours +48/ -0 hours in the testing oven and then kept at ordinary condition for 1.5 hours ±0.5 hours. After the test, the capacitor shall be satisfied with the following performance. 10. Moisture Resistance Loading (I) Appearance : No remarkable change. Dielectric Withstand Voltage : Between terminals Nothing abnormal shall be found, when applied a voltage of 130% of the rated voltage for 1 min (the capacitor shall be applied the voltage through more than 2 kΩ when charge and discharge) . Insulation Resistance : Between terminals 1000 MΩ or more Change rate of capacitance : Within ±2% of the value before the test. Dissipation Factor : 0.9% or less (at 1 kHz) JIC C 5102-1994 9.9 The capacitor under test shall be kept at condition of the temperature 60°C ±2°C and the humidity at 90%RH to 95%RH with applying the rated voltage continuously for 500 hours +24/ -0 hours in the testing oven and then kept at ordinary condition for 1.5 hours ±0.5 hours. After the test, the capacitor shall be satisfied with the following performance. 11. Moisture Resistance Loading (II) Appearance : No remarkable change. Dielectric Withstand Voltage : JIC C 5102-1994 Between terminals 9.9 Nothing abnormal shall be found, when applied a voltage of 130% of the rated voltage for 1 min (the capacitor shall be applied the voltage through more than 2 kΩ when charge and discharge). Insulation Resistance : Between terminals 500 MΩ or more Change rate of capacitance : Within ±2% of the value before the test. Dissipation Factor : 0.9% or less (at 1 kHz) Film Capacitor Division Capacitor Business Division Panasonic Corporation REFERENCE 28−75 Clsf. Standard Doc. PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) Product Specifications No. Item No. Revision Code Performance 1−17 L 5 / 20 P. Test Method The capacitor under test shall be kept at condition of the temperature 85°C ±2°C and the humidity at 85%RH +2/ -5%RH with applying the rated voltage continuously for 500 hours +24/ -0 hours in the testing oven and then kept at ordinary condition for 1.5 hours ±0.5 hours. After the test, the capacitor shall be satisfied with the following performance. 12. Moisture Resistance Loading (III) Appearance : No remarkable change. Dielectric Withstand Voltage : JIC C 5102-1994 Between terminals 9.9 Nothing abnormal shall be found, when applied the rate voltage for 1 min (the capacitor shall be applied the voltage through more then 2 kΩ when charge and discharge). Insulation Resistance : Between terminals 10 MΩ or more Change rate of capacitance : Within ±10% of the value before the test. Dissipation Factor : 1.2% or less (at 1 kHz) The capacitor under test shall be kept at condition of the temperature 125°C ±2°C with applying a voltage of 125% of the rated voltage through a series-connected resister of from 20 Ω to 1000 Ω per 1 V continuously for 1000 hours +48/ -0 hours in the testing oven and then let alone until the capacitor reaches the heat equilibrium with ordinary condition. After the test, the capacitor shall be satisfied with the following performance. 13. 14. High Temperature Loading Heat Resistance Appearance : No remarkable change. Insulation Resistance : Between terminals 1000 MΩ or more Change rate of capacitance : Within ±2% of the value before the test. Dissipation Factor : 0.66% or less (at 1 kHz) The capacitor under test shall be kept at condition of the temperature at 125°C ±2°C for 2 hours +1/ -0 hour in the testing oven. After the test, the capacitor shall be satisfied with the following performance. Insulation Resistance : Between terminals 100 MΩ or more Change rate of capacitance : Within +3%/ -2% of the value before the test. Film Capacitor Division Capacitor Business Division Panasonic Corporation JIC C 5102-1994 9.10 JIC C 5102-1994 9.2 IEC 384-1-1982 4.21.2 REFERENCE 28−75 Clsf. Standard Doc. Product Specifications No. 15. Item Cold Resistance PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) No. Revision Code Performance The capacitor under test shall be kept at condition of the temperature at –55°C ±3°C for 2 hours +1/ -0 hour in the testing oven. After the test, the capacitor shall be satisfied with the following performance. Change rate of capacitance : Within ±2% of the value before the test. 1. Reflow method Test condition of the reflow oven shall be adjusted that maximum temperature of the capacitor surface shall be 260°C ±3°C (see Fig.1). After this, the capacitor shall be satisfied with the following performance. 2. Soldering iron method The soldering iron of a 30-watt shall be used and the temperature of the soldering iron shall be adjusted at 260°C ±10°C. The soldering iron together with a solder wire of 1mm diameter shall be put to each outer electrode of the capacitor for 3.5 s ±0.5 s. After this, the capacitor shall be satisfied with the following performance. 16. Soldering Heat Resistance Appearance : No remarkable change. Dielectric Withstand Voltage : Between terminals Nothing abnormal shall be found, when applied a voltage of 150% of the rated voltage for 1 min or 175% of the rated voltage for 1 s to 5 s. (The capacitor shall be applied the voltage through 2 kΩ or more when charge and discharge.) Insulation Resistance : Between terminals 1000 MΩ or more Change rate of capacitance : Within ±3% of the value before the test. Dissipation Factor : 0.66% or less (at 1 kHz) Connection : Stable Film Capacitor Division Capacitor Business Division Panasonic Corporation 1−17 L 6 / 20 P. Test Method JIC C 5102-1994 9.1 IEC 384-1-1982 4.21.4 REFERENCE 28−75 Clsf. Standard Doc. PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) Product Specifications No. Item No. Revision Code Performance 17. Temperature Cycle The capacitor under the test shall be put in the testing oven and kept at condition of the temperature of –55°C ±3°C for 30 min ±3 min and then kept at the ordinary temperature for 3 min or less. After this, the capacitor under the test shall be kept at condition of the temperature of 125°C ±2°C for 30 min ±3 min and then kept at the ordinary temperature for 3 min or less. These two operations shall be counted as 1 cycle, and it shall be repeated for 5 cycles successively. After the test, the capacitor shall be kept at the ordinary condition for 1.5 hours ±0.5 hours, and shall be satisfied with the following performance. 1−17 L 7 / 20 P. Test method JIC C 5102-1994 9.3 Appearance : No remarkable change. Insulation Resistance : Between terminals 1000 MΩ or more Change rate of capacitance : Within ±2% of the value before the test. Dissipation Factor : 0.66% or less (at 1 kHz) The equipment shall permit pressurizing. Apply a force to the center of specimen, using a pressurizing jig as shown in the drawing, for 10 s. The force shall be 5 N. F 18. Robustness of Capacitor body JIS C 5102-1994 8.12 Appearance : No remarkable change. Film Capacitor Division Capacitor Business Division Panasonic Corporation REFERENCE 28−75 Clsf. Standard Doc. Product Specifications No. Item 19. Adhesive Strength Revision Code Performance P. JIC C 5102-1994 8.11.2 F The bending stroke shall be 1 mm. Pressurizing shall be carried out at the rate of 1 mm/s. After reaching the specified bending, keep it for 5 s. After the test, no breaking of the terminal shall be found. Film Capacitor Division 1−17 L 8 / 20 Test method Mount the specimen to the testing PCB. Examine the appearance of specimen with a magnifying glass of 10 magnifications. As shown in below, apply the pressurizing jig to the center in the longitudinal direction of specimen. Apply a force to the pressurizing jig gradually in the horizontal direction with the testing PCB. The pressure shall be 5N (for 1608 size : 1N) and the holding duration for 10 s ±1 s. After the test, use a magnifying glass of 10 magnifications, and check for cracks of soldering position. Appearance : No remarkable change. Resistance of 20. Board to bending No. PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) Capacitor Business Division Panasonic Corporation JIC C 5102-1994 8.11.1 REFERENCE 28−75 Clsf. Standard Doc. PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) Product Specifications No. Revision Code 1−17 L 9 / 20 Fig.1 Standard surface temperature curve of the capacitor for reflow method. Please confirm the test of the reflow method within the range of the under mentioned profile. (The guarantee temperature and time are numerical values of the bold-faced type in the profile.) TEST CONDITION 50×115, 0.8 mm thickness glass epoxy board Thermocouple K Thermo electromotive force wire diameter 0.1 mmΦ dummy (Attach thermocouple on the parts top surface.) Temperature (°C) of the capacitor surface 300 max 260℃ ――― Temperature (℃) ――― 250 250°C or more, 30s max 220°C or more, 95s max 200 150 100 50 40 s ~ 90 s 60 s ~ 150 s 20 s ~ 80 s max 70s 0 Time → Film Capacitor Division Capacitor Business Division Panasonic Corporation P. REFERENCE 28−75 Clsf. Standard Doc. No. PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) Product Specifications Revision Code 1−17 L 10 / 20 P. 10.△ Caution about safety in use ! I. Operating range (voltage, current, operating temperature) Use the capacitor within the specified limits listed below (a to d). Over rated conditions might cause deterioration, damage, smoke and fire. Do not use capacitor beyond range of the condition. a) Permissible Voltage • DC rated voltage of this product is 50V (1H) and 16 V (1C). Use the capacitor within DC rated voltage. • When used in AC applied circuit, less than 30Vr.m.s. (1H) and 11Vr.m.s. (1C) should be applied. When used in a high frequency, less than 30Vr.m.s.(1H) and 11Vr.m.s. (1C) should be applied and current applied should be the value of permissible current in Fig.2 to 5 in page 17 to 20. • Do not apply to be in connected directly to AC line such as a primary power circuit. • Use the peak of pulse voltage applied the capacitor within the DC rated voltage. • Caution about safety in inverter circuit for LCD back light use: Do not use DC rated voltage 16V article for resonance uses, such as an inverter power supply for back lights of a liquid crystal display. Moreover, +B voltage of the following basic circuit should use DC rated voltage 50V article less than [ 9.5V ]. And please use the peak of pulse voltage (especially, in case of the using PWM brightness circuit) applied the capacitor within the DC rated voltage. [Typical electronic inverter circuit for LCD back light] L +B Lamp b) Permissible Current • The permissible current must be considered by dividing into pulse current (peak current) and continuous current (rms current). When using, therefore, make sure the both current are within the permissible values. In the case that a continuous current value is able not to be measured, use the capacitor within 10°C as the inherent temperature rise confirmed by the measuring method shown in page 16. • Continuous current should be within specified figure in Fig.2 to 5. Contact us when the waveforms are totally different from the sine wave. • Pulse current should be within the figures calculated by Tab.1. Use within 10000 cycles of pulse current. When pulse current applied more than 10000 cycles, please consult us before use. c) Operating Temperature Range • The specified “Operating Temperature Range” in specification is absolute maximum and minimum temperature rating. So in any case, each the capacitors shall be operated within the specified “Operating Temperature Range”. • It must be noted, however the “Operating Temperature Range” is the surface temperature of the capacitor is the sum of the ambient temperature + own temperature rise, not just the ambient temperature of the capacitor. • If there is cooling plate of the other part of any resistance heated to high temperature near the capacitor, the capacitor may be locally heated by the radiation heat, exceeding the “Operating Temperature Range”, and smoking or firing may be caused. Check the capacitor surface temperature at the heat source side. d) For safety handling, check worst conditions within the specification range. Protective means for safety should be provided in case the pulse and rms current may exceed the permissible values due to abnormal action of elsewhere in the circuit. Please consult in advance when capacitors are connected in parallel to supplement capacitance. Film Capacitor Division Capacitor Business Division Panasonic Corporation REFERENCE 28−75 Clsf. Standard Doc. PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) Product Specifications No. Revision Code 1−17 L 11 / 20 P. II. Recommendable land dimensions For designing land dimensions, refer to the following recommendable land dimensions. unit: mm Dimensions Size code A B C C K1 0.6 2.0 0.7 J1, J2 0.8 2.4 1.1 H1, H2, H3 1.8 3.6 1.4 G1, G2, G3 1.8 3.6 2.3 <Note> • A recommended solder paste thickness is between 0.10 mm and 0.15 mm. A B III. Selection of Printed Circuit Board Do not use ceramic and metal board, because they have a large thermal expansion coefficient that is different from that of this capacitor, which are liable to cause a deterioration of thermal cycle endurance. IV. Soldering a) Soldering method This capacitor only used in reflow method. Don’t use in flow, dipping, and VPS soldering method. b) Recommendable reflow soldering conditions Recommendable reflow condition (parts surface) Soldering (max 240°C, max 5s) Temperature of parts surface(°C) 250 220°C, 20-30s 200 150 Pre-heating (150°C to 180°C) 100 50 Less than 5 seconds Less than 2.5 minites More than 2 minites Time <Note> • The above figure is recommendable conditions. • Soldering frequency shall be maximum two times. In soldering of second time, solder after capacitor body temperature returned to room temperature. • When require further conditions except for the above, use within the range of test “Soldering Heat Resistance” shown in page 6. • The reflow method recommends the hot wind circulation method. The heat influence on the capacitor is different in the methods other than the hot wind circulation method. Please confirm there is no problem in the characteristic of the capacitor beforehand when it is mounted excluding the hot wind circulation method. Please inquire when it is uncertain. Film Capacitor Division Capacitor Business Division Panasonic Corporation REFERENCE 28−75 Clsf. Standard Doc. PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) Product Specifications No. Revision Code 1−17 L 12 / 20 P. c) Soldering conditions used in soldering iron Temperature Soldering time Other conditions Wattage of soldering iron: 30 W max 270°C max 4.0 s Pre-heating is not needed • In the case of sketch (a) Put a soldering iron to an electrode (for less than 4 s) with solder like sketch (a) shows. *Put soldering iron lightly. *Soldering is allowed as one side by one side (without interval) or as both sides at the same time. • In the case of sketch (b) After a solder is melted on a soldering iron like sketch (b), put them to an electrode (for less than 4 s). *Put soldering iron lightly. *Soldering is allowed as one side by one side (without interval) or as both sides at the same time. Sketch (b) Sketch (a) land land melting solder solder soldering iron soldering iron <Note> • Soldering frequency shall be maximum two times. In soldering of a second time, solder after capacitor body temperature returned for room temperature. • The above condition shall be applied also on modifying by solder iron after reflow soldering. Modifying by solder iron after reflow soldering within once. Because there is heat career once by reflow soldering. • When measuring temperature, it shall be operated with solder on soldering iron. • Pay attention to the soldering iron tip not to touch directly to film dielectric, especially cut edge side. • Consult with our engineering section in advance when require further conditions except for the above. d) Others • It is too much heat record that solders or solders removal this product or the other part which approaches this product using hot air–blow. Consult us before use. • Do not to use soldering this product by light beam or laser beam. If used these method, consult us before using. • Consult us before using, when soldering in other method. Film Capacitor Division Capacitor Business Division Panasonic Corporation REFERENCE 28−75 Clsf. Standard Doc. PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) Product Specifications No. Revision Code 1−17 L 13 / 20 P. V. Soldering flux and solder • The content of halogen in the flux of solder paste and solder wire shall be 0.1 wt% or less Rosin-based and non-activated soldering flux is recommended. • Consult with our engineering section in advance when using flux with more than 0.1 wt% of the halogen content. VI. Cleaning a) Applicable solvent Type Alcohol Halogenated hydrocarbon Cleaner IPA (isopropyl alcohol) AK-225AES Manufacturer General industrial use Asahi Glass Co.,Ltd. b) Cleaning method Item Conditions Immersion Vaporized cleaning Ultrasonic cleaning Temperature Period Room temperature Less than 50°C Less than 50°C Within 5 min Within 5 min Within 5 min <Note> • Do not wash it with water. • When cleaning after soldering, check temperature of capacitor surface is blew 60°C. • It is necessary to remove cleaner from PCB by drying thoroughly after cleaning. • Cleaner shall contain halogen within less than 0.1wt%, because in case of cleaning after mounting, halogen in flux will dissolve into cleaner. • Consult with our engineering section in advance when further information for cleaning solvent, conditions are required. VII. Storage and preservation • It must be noted that the solderability of the external electrode may deteriorated when stored in an atmosphere filled with moisture, dust, or reactive gas such as hydrogen chloride, hydrogen sulfide, sulfurous acid, or ammonia etc. • Avoid location with particularly high temperature and high humidity, and store in conditions not exceeding 35°C and 85%RH. Storage period limit is 6 months (use within 6 months). • Consult with our engineering section in advance when require further conditions except for the above. VIII. Operating environment • Consult us about usage for a long period in humid environments, because characteristic deterioration by low insulation resistance or oxidization of metallized film may occur due to moisture absorption with the passing of the time. • The Capacitor shall not be operated under following environmental conditions. These conditions may be generated to deteriorated the characteristic in the capacitor. a) Under conditions of corrosive atmosphere such as hydrogen chloride, hydrogen sulfide, sulfurous acid, or ammonia etc. b) Under conditions of water or frost formation. c) To be exposed directly to water, oil, or sunlight. d) To be exposed to ozone, radioactive rays, or ultraviolet rays. • No dust should be permitted to remain on the surface of the product as this may cause electrical leakage. Film Capacitor Division Capacitor Business Division Panasonic Corporation REFERENCE 28−75 Clsf. Standard Doc. Product Specifications PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) No. Revision Code 1−17 L 14 / 20 P. Rate of Capacitance Change (%) IX. Capacitance change due to humidity absorption In environment with humidity change, capacitance of this capacitor change (increases and decreases). Because capacitor absorbing and dis-absorbing due to humidity of environment. Consult with our engineering section detail of this capacitance change. [For example : The data shown below is capacitance change from dry condition to 40°C, 95%RH condition.] 40°C 95%RH About 2% Dry condition Time → X. In case of using resin for fixing the chip parts In case of using resin for fixing the chip parts, inquiring in advance of our engineering section is recommended. XI. Resin coating When capacitors are coated or embedded with resin, inquiring of our engineering section is recommended. XII. Handling of a element When handle an element of the capacitor with tweezers, care must be taken to avoid mechanical damage. We recommend: • Use tweezers made of resign and should apply stress to the element less than 1N (1608 size), 5N (2012, 3216, 3225 size). • Avoid any contact with the cut surface (except outer electrode surface). XIII. Mechanical stress, damage Please pay attention to the following points, when mechanical stress or damage is applied to the capacitor, it may become the cause of malfunction. • Do not apply 1N (1608 size), 5N (2012, 3216, 3225 size) or more as pull, stress and pressure etc. • Do not apply strong stress to cut edge side of the capacitor and not give the damage of scratch etc. XIII-(1). Terminal strength (pull direction) Pay attention to the pull force of terminal (F direction) so as not to damage to the capacitor. F XIII-(2). Chip mounting consideration In mounting the capacitors any bending and expanding force against them shall be kept minimum to prevent them from bending damaged or cracked, following precautions and recommendations shall be observed carefully in the process. • Motion of vacuum nozzle or clump shall be adjusted so that the capacitors shall not be damaged by pushing force. • Maximum stroke of the nozzle shall be adjusted to avoid damage so that the maximum bending of PCB becomes not too much. • The PCB shall be supported by means of adequate supporting pins. Film Capacitor Division Capacitor Business Division Panasonic Corporation REFERENCE 28−75 Clsf. Standard Doc. Product Specifications PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) No. Revision Code 1−17 L 15 / 20 P. XIV. Singular using This capacitor is generally surface mount device. Do not use singular using. XV. Appearance • The gap among a film about 0.1 mm on the cut edge side may occur by structure and process. But there is not a problem in reliability. • We make assurance double sure about quality of the appearance. If it obstructs the reliability and performance of the electronic equipment requested, we exchange the appearance boundary sample. The gap between layers (about 0.1 mm) XVI. Life designed This product is designed as its life time is more than 10 year (actual working hours of capacitor are 50,000h) under the following conditions: • Operating temperature is less than 125°C and applied voltage is than rated voltage. Measuring method of inherent temperature rise As shown in the drawing, attach a thermocouple to the capacitor surface with adhesive, and measure the surface temperature and capacitor surface temperature while avoiding radiation heat from peripheral parts. At this time, use a thermocouple with small thermal capacity (Φ0.1 T wire), and to avoid heat release to the board, lift the parts to be measure from the board by using lead wire or the like, and install as shown in the drawing. To avoid effects of convention and wind, put the capacitor into the box or the like, and measure in wind-free condition. Thermocouple Land Lead wire Temperature measurement instrument Film Capacitor Division Capacitor Business Division Panasonic Corporation REFERENCE 28−75 Clsf. Standard Doc. Product Specifications PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) No. Revision Code 1−17 L 16 / 20 P. Tab.1 Permissible pulse current (Max 10000 cycles) Pulse current applied to this capacitor should be used within permissible pulse current (Max 10000 cycles) shown in Tab.1 The pulse current = C(µF) × dV/dt value (V/ µs) In case of pulse current is over the specified table, inquire of our engineering section. Part No. (Capacitance: µF) 101 (0.00010) 121 (0.00012) 151 (0.00015) 181 (0.00018) 221 (0.00022) 271 (0.00027) 331 (0.00033) 391 (0.00039) 471 (0.00047) 561 (0.00056) 681 (0.00068) 821 (0.00082) 102 (0.0010) 122 (0.0012) 152 (0.0015) 182 (0.0018) 222 (0.0022) 272 (0.0027) 332 (0.0033) 392 (0.0039) 472 (0.0047) 562 (0.0056) 682 (0.0068) 822 (0.0082) 103 (0.010) 123 (0.012) 153 (0.015) 183 (0.018) 223 (0.022) 273 (0.027) 333 (0.033) 393 (0.039) 473 (0.047) 563 (0.056) 683 (0.068) 823 (0.082) 104 (0.10) Film Capacitor Division dV/dt (V/ µs) ECHU1C(X) ECHU1H(X) 420 1100 390 1050 350 940 325 890 295 800 270 730 245 690 225 610 205 580 193 520 175 480 160 440 150 400 135 370 123 340 115 310 105 270 95 260 86 240 80 220 74 200 68 190 62 170 58 160 52 145 48 135 43 120 40 110 37 100 33 94 31 86 28 78 26 ―――――― 24 ―――――― 22 ―――――― 20 ―――――― 19 ―――――― Capacitor Business Division Panasonic Corporation REFERENCE 28−75 Clsf. Standard Doc. Product Specifications PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) No. Revision Code Fig.2 Permissible Current ECHU1C(X):(0.00010 µF to 0.0027 µF) Measuring condition : Sine wave 0.06 0.05 0.04 Permissible Effective Current [A] 0.0027µF 0.0022µF 0.03 0.0018µF 0.0015µF 0.02 0.0012µF 0.001µF 0.00082µF 0.01 0.00068µF 0.00056µF 0.00047µF 0.00039µF 0.00033µF 0.00027µF 0.00022µF 0.00018µF 0.00015µF 0.00012µF 0.0001µF 0 10 100 1000 Frequency [kHz] Film Capacitor Division Capacitor Business Division Panasonic Corporation 1−17 L 17 / 20 P. REFERENCE 28−75 Clsf. Standard Doc. Product Specifications PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) No. Revision Code Fig.3 Permissible Current ECHU1C(X): ( 0.0033 µF to 0.10 µF) Measuring condition : Sine wave 1.5 0.1µF 1.25 0.082µF 1 Permissible Effective Current [A] 0.068µF 0.056µF 0.75 0.047µF 0.039µF 0.5 0.033µF 0.027µF 0.022µF 0.018µF 0.25 0.015µF 0.012µF 0.01µF 0.0082µF 0.0068µF 0.0056µF 0.0047µF 0.0039µF 0.0033µF 0 10 100 Frequency [kHz] Film Capacitor Division Capacitor Business Division Panasonic Corporation 1000 1−17 L 18 / 20 P. REFERENCE 28−75 Clsf. Standard Doc. Product Specifications PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) No. Revision Code Fig.4 Permissible Current ECHU1H(X): ( 0.0001 µF to 0.0027 µF) Measuring condition : Sine wave 0.12 0.0027µF 0.1 0.0022µF Permissible Effective Current [A] 0.08 0.0018µF 0.06 0.0015µF 0.0012µF 0.04 0.001µF 0.00082µF 0.00068µF 0.00056µF 0.02 0.00047µF 0.00039µF 0.00033µF 0.00027µF 0.00022µF 0.00018µF 0.00015µF 0.00012µF 0.0001µF 0 10 100 1000 Frequency [kHz] Film Capacitor Division Capacitor Business Division Panasonic Corporation 1−17 L 19 / 20 P. REFERENCE 28−75 Clsf. Standard Doc. Product Specifications PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) No. Revision Code ECHU1H(X): ( 0.0033 µF to 0.039 µF) Fig.5 Permissible Current Measuring condition : Sine wave 1.2 1 0.039µF 0.033µF 0.8 Permissible Effective Current [A] 0.027µF 0.022µF 0.018µF 0.6 0.015µF 0.012µF 0.4 0.01µF 0.0082µF 0.0068µF 0.0056µF 0.2 0.0047µF 0.0039µF 0.0033µF 0 10 100 1000 Frequency [kHz] Film Capacitor Division Capacitor Business Division Panasonic Corporation 1−17 L 20 / 20 P. REFERENCE 28-75 PLASTIC FILM CHIP CAPACITOR TYPE ECHU(X) Issue Date Oct.16.’00 Description 1-17 Constitution Approval Check M.Moriwaki Y.Miyamoto Design S.Ishikawa M.Moriwaki Y.Miyamoto H.Hasegawa A Jul.18.’02 Revise accompanying of addition of 1608 size. B Feb.23.’04 Revise Collection of 9-11 Moisture Resistance Loading M.Moriwaki Y.Miyamoto H.Hasegawa (II) Dissipation Factor :0.9% or more → or less C May.12.’04 Revise Collection of fig.2 to fig.5 Permissible Current Issue D Oct.1.2004 E Dec.24.2004 F Apr. 1. 2005 G Apr. 1. 2006 H I Date Description Company name changed Addition 10-XV. Appearance Company name changed Company name changed [1] Fig.1 Changed 230°C or more 30smax, 180°C~260°C 20s~50s, 260°C~160°C 40smax →250°C or more 30s max, 220°C or more 95s max, 180°C~260°C 20s~80s, 260°C~160°C 70s max [2] Fig.1 Addition (The guarantee temperature and time are numerical values of the bold-faced type in the profile.) [3] 10-IV b) <Note> Changed • Heat effect of VSP method is different from that of Jul 12. 2006 reflow method, Consult us before using, when soldering in VSP method. →• The reflow method recommends the hot wind circulation method. The heat influence on the capacitor is different in the methods other than the hot wind circulation method. Please confirm there is no problem in the characteristic of the capacitor beforehand when it is mounted excluding the hot wind circulation method. Please inquire when it is uncertain. [4] 9. CHARACTER No.7 Addition Solder in the solder tank is Sn-Ag-Cu. [1]Changed 10.Caution about safety in use I.Operating range (voltage, current, operating temperature) b) Permissible Current Fig.2 , Fig.3 , Fig.4 and Fig.5 Sep.6.2006 [2]Addition 10.Caution about safety in use I.Operating range (voltage, current, operating temperature) a) Permissible Voltage • Caution about safety in inverter circuit for LCD back light use M.Moriwaki Y.Miyamoto H.Hasegawa QA Approval Approval Design K. Kuwata K. Ogawa Y. Miyamoto K. Kuwata K. Ogawa H. Hasegawa K. Ago M. Nagaoka Y. Miyamoto M. Okamura M. Nagaoka Y. Miyamoto M. Okamura M. Nagaoka Y. Miyamoto M. Okamura M. Nagaoka Y. Miyamoto J Apr. 1.2008 Company name changed. M. Okamura M. Nagaoka Y. Takata K Apr. 1.2012 Company name changed. H.Arita T.Kume Y. Takata REFERENCE